JP5181755B2 - 電子部品用パッケージ及び表面実装型電子デバイス - Google Patents

電子部品用パッケージ及び表面実装型電子デバイス Download PDF

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Publication number
JP5181755B2
JP5181755B2 JP2008070798A JP2008070798A JP5181755B2 JP 5181755 B2 JP5181755 B2 JP 5181755B2 JP 2008070798 A JP2008070798 A JP 2008070798A JP 2008070798 A JP2008070798 A JP 2008070798A JP 5181755 B2 JP5181755 B2 JP 5181755B2
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Prior art keywords
package
mounting
electrode
mounting electrode
crystal resonator
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Expired - Fee Related
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Japanese (ja)
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JP2009224741A5 (enExample
JP2009224741A (ja
Inventor
和俊 藤田
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Seiko Epson Corp
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Seiko Epson Corp
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JP2008070798A 2008-03-19 2008-03-19 電子部品用パッケージ及び表面実装型電子デバイス Expired - Fee Related JP5181755B2 (ja)

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JP2008070798A JP5181755B2 (ja) 2008-03-19 2008-03-19 電子部品用パッケージ及び表面実装型電子デバイス

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JP2008070798A JP5181755B2 (ja) 2008-03-19 2008-03-19 電子部品用パッケージ及び表面実装型電子デバイス

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JP2009224741A JP2009224741A (ja) 2009-10-01
JP2009224741A5 JP2009224741A5 (enExample) 2011-04-21
JP5181755B2 true JP5181755B2 (ja) 2013-04-10

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8796558B2 (en) 2010-04-01 2014-08-05 Daishinku Corporation Base of surface-mount electronic component package, and surface-mount electronic component package
US8729967B2 (en) * 2011-09-08 2014-05-20 Nihon Dempa Kogyo Co., Ltd. Surface-mounted crystal oscillator and manufacturing method thereof
US9795034B2 (en) * 2012-05-30 2017-10-17 Kyocera Corporation Wiring board and electronic device
JP6248539B2 (ja) * 2013-10-28 2017-12-20 株式会社大真空 電子部品用パッケージのベース、電子部品用パッケージ
JP6176057B2 (ja) * 2013-10-28 2017-08-09 株式会社大真空 電子部品用パッケージのベース、電子部品用パッケージ
JP7655110B2 (ja) 2021-06-22 2025-04-02 株式会社大真空 電子部品用パッケージのベース、電子部品用パッケージ

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003158220A (ja) * 2001-11-26 2003-05-30 Kyocera Corp 配線基板
JP2003218489A (ja) * 2002-01-24 2003-07-31 Kyocera Corp 配線基板
JP3781119B2 (ja) * 2003-03-17 2006-05-31 セイコーエプソン株式会社 圧電デバイス用パッケージ及び圧電デバイス
JP2009141455A (ja) * 2007-12-04 2009-06-25 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶デバイス

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JP2009224741A (ja) 2009-10-01

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