JP2009224741A5 - - Google Patents

Claims (9)

An electronic component package comprising an insulating substrate having a substantially rectangular bottom shape and a mounting electrode formed on the bottom surface of the insulating substrate,
The mounting electrodes, the electronic component package, wherein said this insulating substrate is the mounting electrodes such as grooves in the not divided length is formed a configuration to expose. 2. The electronic component package according to claim 1, wherein an entire circumference of the groove is surrounded by the mounting electrode. 2. The electronic component package according to claim 1, wherein the groove portion has a notch shape that is notched from an outer periphery to an inner portion of the mounting electrode.   2. The electronic component package according to claim 1, wherein the mounting electrode is formed along two opposing bottom sides of the insulating substrate.   The electronic component package according to claim 1, wherein the mounting electrodes are respectively formed at four corners of the bottom surface of the insulating substrate. The mounting electrode is divided into two electrode regions by a straight line passing through the center of the mounting electrode and parallel to two opposing bottoms of the insulating substrate formed so that the mounting electrodes are along each other. the area of one electrode region positioned on the center side a, the area of the other electrode region when a B, and claim 4, characterized in that said forming a groove at a position such that a> B Package for electronic components as described. Of the vertices of the mounting electrode, the mounting electrode is divided into two electrode regions by a diagonal line connecting two vertices located on the edge side of the insulating substrate, and one electrode region located on the center side of the insulating substrate 6. The electronic component package according to claim 5 , wherein the groove is formed at a position where A> B, where A is the area of the other electrode region and B is the area of the other electrode region. Electronic component package according to any one of claims 1 to 7, characterized in that a recess is formed the groove and the corresponding position of the insulating substrate. A surface-mount type electronic device comprising the electronic component package according to any one of claims 1 to 8 .