JP2012227472A5 - - Google Patents

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JP2012227472A5
JP2012227472A5 JP2011096111A JP2011096111A JP2012227472A5 JP 2012227472 A5 JP2012227472 A5 JP 2012227472A5 JP 2011096111 A JP2011096111 A JP 2011096111A JP 2011096111 A JP2011096111 A JP 2011096111A JP 2012227472 A5 JP2012227472 A5 JP 2012227472A5
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Japan
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electronic component
mounting structure
cover
circuit pattern
heat transfer
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JP2011096111A
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Japanese (ja)
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JP5936313B2 (en
JP2012227472A (en
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Priority claimed from JP2011096111A external-priority patent/JP5936313B2/en
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Description

フィン５１は、伝熱材を介して覆体にねじ止めなどで機械的に接続しても良いが、覆体とフィンを一体に成型することが、効率的であり、且つ熱抵抗を下げるので好ましい。
図４では、フィン５１が、覆体の発熱する電子部品の周辺のみに設けられているが、覆体全域の外表面に設けても良い。
覆体の伝熱材との接触部の反対側にフィンを設けることは、実施の形態１の電子部品の実装構造体にも適用でき、同様な効果を有する。 The fin 51 may be mechanically connected to the cover by screwing or the like via a heat transfer material. However, it is efficient to form the cover and the fin integrally, and the thermal resistance is lowered. preferable.
In FIG. 4, the fins 51 are provided only around the electronic component that generates heat from the cover, but may be provided on the outer surface of the entire cover.
Providing the fin on the opposite side of the contact portion of the cover with the heat transfer material can also be applied to the electronic component mounting structure of Embodiment 1 and has the same effect.

本実施の形態において、第１の突出部５３の伝熱材４０との接触面のサイズは、第１の電子部品１０ａの伝熱材接触面のサイズより大きめになっており、覆体５０ｃにおける第１の突出部５３の周囲に向かって熱を広げることができ、放熱性を高めることができる。
図示しないが、実施の形態３のように、覆体における、伝熱材との接触部の反対側の外表面にフィンを設けても良い。 In the present embodiment, the size of the contact surface of the first protrusion 53 with the heat transfer material 40 is larger than the size of the heat transfer material contact surface of the first electronic component 10a. Heat can be spread toward the periphery of the first protrusion 53, and heat dissipation can be improved.
Although not shown, as in the third embodiment, the covering body may be a fin on the opposite side of the outer surface of the contact portion of the heat transfer member.

すなわち、本実施の形態における、第１の形状の電極は、図１３（ａ）に示すように、立脚部２４ｂが一定の角度で内側に屈曲した電極２０ｂであり、第２の形状の電極は、図１３（ｂ）に示すように、立脚部２４ｂがくの字状に内側に屈曲した電極２０ｃである。 That is, in the present embodiment, as shown in FIG. 13A, the first shape electrode is an electrode 20b in which the standing leg portion 24b is bent inward at a certain angle, and the second shape electrode is as shown in FIG. 13 (b), an electrode 20c which is bent inwardly shaped base portions 24b calyx.

Claims (15)

配線基板と、上記配線基板の回路パターンに実装された電子部品と、上記電子部品の両端に設けられた電極と、上記電子部品における上記回路パターン側の反対側の面に配設された伝熱材と、上記伝熱材における上記電子部品との接触面の反対側の面に接触するとともに、上記回路パターンに対して平行に固定された覆体とを備えた電子部品の実装構造体であって、
上記電子部品がチップ部品であり、上記電極が、上記回路パターンと接合する回路接合部と、上記電子部品を上記回路パターンから浮かす立脚部とを有しており、上記回路パターン面から上記電子部品の伝熱材側の面までの高さである電子部品の設置高さと上記伝熱材の厚みとの合計が、上記覆体を固定する前より、固定後の方が薄くなっている電子部品の実装構造体。 A wiring board; an electronic component mounted on the circuit pattern of the wiring board; electrodes provided on both ends of the electronic component; and heat transfer disposed on a surface of the electronic component opposite to the circuit pattern side. A mounting structure for an electronic component comprising: a cover that is in contact with a surface of the heat transfer material opposite to the contact surface with the electronic component and is fixed in parallel to the circuit pattern. And
The electronic component is a chip component, and the electrode includes a circuit bonding portion for bonding to the circuit pattern, and a standing portion for floating the electronic component from the circuit pattern, and the electronic component from the circuit pattern surface. The electronic component in which the total height of the electronic component, which is the height to the surface of the heat transfer material, and the thickness of the heat transfer material is thinner after fixing than before fixing the cover Implementation structure. 上記覆体が、スペーサを介して上記配線基板に固定機構で固定されており、上記配線基板の回路パターン形成面から上記覆体の内表面までの間隔が、上記電子部品の設置高さより大きく、上記覆体を固定する前の上記電子部品の設置高さと上記伝熱材の厚みとの合計より小さくなるように、上記スペーサの高さを設定したことを特徴とする請求項１に記載の電子部品の実装構造体。 The cover member is being secured by the securing mechanism on the wiring substrate via a spacer, the distance from the circuit pattern surface of the wiring board to the inner surface of the cover member is greater than the installation height of the electronic component, electronic according to claim 1, characterized in that the covering body so as to be smaller than the sum of the thickness before the installation height of the electronic component and the heat transfer member for fixing the, set the height of the spacer Component mounting structure. 上記配線基板における上記電子部品の実装面の反対側に、放熱体を設けたことを特徴とする請求項２に記載の電子部品の実装構造体。 On the opposite side of the mounting surface of the electronic component in the wiring board, the mounting structure of an electronic component according to claim 2, characterized in that a heat radiator. 上記電子部品を上記回路パターンに実装した配線基板が、基板搭載部と上記基板搭載部の周囲に設けられた壁である周壁部とを有する筐体本体の上記基板搭載部に固定され、上記覆体が上記周壁部の上面に固定機構で固定されており、上記配線基板の回路パターン形成面から上記覆体の内表面までの間隔が、上記電子部品の設置高さより大きく、上記覆体を固定する前の上記電子部品の設置高さと伝熱材の厚みとの合計より小さくなるように、上記周壁部の高さを設定したことを特徴とする請求項１に記載の電子部品の実装構造体。 Wiring board with the electronic component mounted on the circuit patterns are fixed to the substrate mounting portion of the housing body having a peripheral wall portion is a wall provided around the substrate mounting portion and the substrate mounting portion, the covering The body is fixed to the upper surface of the peripheral wall by a fixing mechanism, and the distance from the circuit pattern forming surface of the wiring board to the inner surface of the cover is larger than the installation height of the electronic component, and the cover is fixed. 2. The electronic component mounting structure according to claim 1, wherein the height of the peripheral wall portion is set to be smaller than the total of the installation height of the electronic component and the thickness of the heat transfer material before starting. . 上記筐体本体にフィンを設けたことを特徴とする請求項４に記載の電子部品の実装構造体。   The electronic component mounting structure according to claim 4, wherein fins are provided in the housing body. 上記覆体の内表面における上記電子部品が投影される部分に第１の突出部が設けられ、上記配線基板の回路パターン形成面から上記覆体の上記第１の突出部の表面までの間隔が、上記電子部品の設置高さより大きく、上記覆体を固定する前の上記電子部品の設置高さと伝熱材の厚みとの合計より小さくなるように、上記周壁部の高さを設定したことを特徴とする請求項４または請求項５に記載の電子部品の実装構造体。 The first protrusion is provided in a portion where the electronic component on the inner surface of the cover member is projected, the distance from the circuit pattern surface of the wiring substrate to the surface of the first projecting portion of the covering body greater than the installation height of the electronic component, so that less than the sum of the previous above thickness of the electronic component of the installation height and the heat transfer material for fixing the covering body, that it has set the height of the peripheral wall portion The electronic component mounting structure according to claim 4, wherein the electronic component mounting structure is characterized in that: 上記覆体の第１の突出部の三方の周囲に、上記第１の突出部を囲んで、貫通孔が設けられたことを特徴とする請求項６に記載の電子部品の実装構造体。   7. The electronic component mounting structure according to claim 6, wherein a through hole is provided around three sides of the first protrusion of the cover so as to surround the first protrusion. 上記覆体の第１の突出部がバネ性を有することを特徴とする請求項７に記載の電子部品の実装構造体。   The electronic component mounting structure according to claim 7, wherein the first projecting portion of the cover has a spring property. 上記覆体における外表面側に、フィンを設けたことを特徴とする請求項１ないし請求項６のいずれか１項に記載の電子部品の実装構造体。 The electronic component mounting structure according to any one of claims 1 to 6, wherein fins are provided on an outer surface side of the cover . 上記覆体の内表面における上記電子部品の外周に、第２の突出部を設けたことを特徴とする請求項１ないし請求項５のいずれか１項に記載の電子部品の実装構造体。 The outer periphery of the electronic component on the inner surface of the covering body, the mounting structure of an electronic component according to any one of claims 1 to 5, characterized in that a second projecting portion. 上記覆体の外表面に上記覆体の厚み方向の溝を形成して、上記覆体の内表面側に突部を設けたことを特徴とする請求項１ないし請求項５のいずれか１項に記載の電子部品の実装構造体。   The groove of the thickness direction of the said cover body was formed in the outer surface of the said cover body, and the protrusion was provided in the inner surface side of the said cover body, The any one of Claim 1 thru | or 5 characterized by the above-mentioned. The electronic component mounting structure described in 1. 上記覆体の上記伝熱材との接触面に、複数の細かい突起部が設けられたことを特徴とする請求項１ないし請求項１１のいずれか１項に記載の電子部品の実装構造体。 The contact surface between the heat transfer material of the covering body, the mounting structure of an electronic component according to any one of claims 1 to 11, wherein a plurality of fine projections are provided. 上記電極の立脚部が、屈曲していることを特徴とする請求項１ないし請求項１２のいずれか１項に記載の電子部品の実装構造体。   The mounting structure for an electronic component according to any one of claims 1 to 12, wherein a standing leg portion of the electrode is bent. 上記電極が、少なくとも上記電子部品の接合部と上記回路接合部とにおいて、上記電極の長手方向で分割されていることを特徴とする請求項１ないし請求項１３のいずれか１項に記載の電子部品の実装構造体。 The electrode is, in at least the junction of the electronic component and the circuit junction according to any one of claims 1 to 13, characterized in that it is divided in the longitudinal direction of the electrode electronic Component mounting structure. 上記電極の厚みが、０．２ｍｍ以下であることを特徴とする請求項１ないし請求項１４のいずれか１項に記載の電子部品の実装構造体。   15. The electronic component mounting structure according to claim 1, wherein the electrode has a thickness of 0.2 mm or less.
JP2011096111A 2011-04-22 2011-04-22 Electronic component mounting structure Active JP5936313B2 (en)

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