JP5353251B2 - Multilayer capacitor and multilayer capacitor mounting structure - Google Patents
Multilayer capacitor and multilayer capacitor mounting structure Download PDFInfo
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- JP5353251B2 JP5353251B2 JP2009001936A JP2009001936A JP5353251B2 JP 5353251 B2 JP5353251 B2 JP 5353251B2 JP 2009001936 A JP2009001936 A JP 2009001936A JP 2009001936 A JP2009001936 A JP 2009001936A JP 5353251 B2 JP5353251 B2 JP 5353251B2
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- 239000003990 capacitor Substances 0.000 title claims description 84
- 239000000758 substrate Substances 0.000 claims description 99
- 230000004308 accommodation Effects 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000005452 bending Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 7
- 230000000116 mitigating effect Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 230000035515 penetration Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/252—Terminals the terminals being coated on the capacitive element
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
本発明は、積層コンデンサ及び積層コンデンサの実装構造に関する。 The present invention relates to a multilayer capacitor and a multilayer capacitor mounting structure.
従来、誘電体層を複数積層してなる素体と、素体内に形成された複数の内部電極と、素体の両端部を覆うように形成された一対の端子電極とを備えた積層コンデンサがある（例えば特許文献１参照）。近年では、電子機器の小型化に伴って、積層コンデンサを基板にＳＭＤ（Ｓｕｒｆａｃｅ Ｍｏｕｎｔ Ｄｅｖｉｃｅ）実装する方法が主流となってきている（例えば特許文献２参照）。
ところで、積層コンデンサに電圧を印加した場合、電歪効果によって素体に印加電圧に応じた大きさの機械的歪みが生じる。特に交流電圧を印加したときには、この機械的歪みによって積層コンデンサに振動（電歪振動）が発生する。そのため、積層コンデンサを基板に実装し、交流電圧を印加すると、電歪振動が基板に伝播して、いわゆる音鳴きが発生することがある。この音鳴きの問題は、積層コンデンサと基板との接触面積の大きなＳＭＤ実装では特に顕著になると考えられる。 By the way, when a voltage is applied to the multilayer capacitor, mechanical distortion having a magnitude corresponding to the applied voltage is generated in the element body due to the electrostrictive effect. In particular, when an AC voltage is applied, vibration (electrostrictive vibration) is generated in the multilayer capacitor due to this mechanical strain. Therefore, when a multilayer capacitor is mounted on a substrate and an AC voltage is applied, electrostrictive vibration propagates to the substrate, and so-called noise may occur. This noise problem is considered to be particularly noticeable in SMD mounting where the contact area between the multilayer capacitor and the substrate is large.
本発明は、上記課題の解決のためになされたものであり、音鳴きの発生を抑えつつ、ＳＭＤ実装を可能とする積層コンデンサ、及びこのような積層コンデンサの実装構造を提供することを目的とする。 The present invention has been made to solve the above-described problems, and an object thereof is to provide a multilayer capacitor that enables SMD mounting while suppressing the occurrence of noise and a mounting structure of such a multilayer capacitor. To do.
上記課題の解決のため、本発明に係る積層コンデンサは、誘電体層を複数積層してなる素体と、素体の両端面を覆うように形成された端子電極と、端子電極に固定されたリード端子と、素体に面する第１の面、及び実装基板への実装面となる第２の面を有する絶縁性基板と、を備え、絶縁性基板には、第１の面から第２の面に至る貫通部が設けられ、リード端子の先端部は、絶縁性基板に固定されない状態で貫通部を通り、第２の面に突出していることを特徴としている。 In order to solve the above-described problems, a multilayer capacitor according to the present invention includes an element body formed by laminating a plurality of dielectric layers, a terminal electrode formed so as to cover both end faces of the element body, and fixed to the terminal electrode. A lead terminal; and an insulating substrate having a first surface facing the element body and a second surface serving as a mounting surface to the mounting substrate. The insulating substrate includes a second surface from the first surface to the second surface. The lead portion of the lead terminal passes through the through portion without being fixed to the insulating substrate and protrudes to the second surface.
この積層コンデンサでは、素体の両端面を覆う端子電極にリード端子が固定されている。これにより、電圧印加時の積層コンデンサに電歪振動が発生した場合であっても、リード端子が撓むことによって電歪振動が緩和され、音鳴きの発生を防止できる。また、リード端子の先端部が絶縁性基板の実装面である第２の面から突出しているので、ＳＭＤ実装において実装基板のランド電極との接続を簡便に行うことができる。このリード端子の先端部は、絶縁性基板に固定されない状態で貫通部を通っているので、リード端子の撓みが絶縁性基板への固定によって阻害されることもなく、電歪振動の緩和効果が担保される。 In this multilayer capacitor, lead terminals are fixed to terminal electrodes that cover both end faces of the element body. Thus, even when electrostrictive vibration occurs in the multilayer capacitor during voltage application, the electrostrictive vibration is mitigated by bending the lead terminal, and the generation of noise can be prevented. In addition, since the leading end portion of the lead terminal protrudes from the second surface, which is the mounting surface of the insulating substrate, the connection with the land electrode of the mounting substrate can be easily performed in the SMD mounting. Since the tip portion of the lead terminal passes through the penetration portion in a state where it is not fixed to the insulating substrate, the bending of the lead terminal is not hindered by fixing to the insulating substrate, and the effect of mitigating electrostrictive vibration is achieved. Secured.
また、貫通部は、絶縁性基板の内部に形成された貫通孔であり、リード端子の先端部は、貫通孔に挿通されていることが好ましい。この場合、簡単な構成で絶縁性基板にリード端子を係合させることができる。 Moreover, it is preferable that a penetration part is a through-hole formed in the inside of an insulating substrate, and the front-end | tip part of a lead terminal is penetrated by the through-hole. In this case, the lead terminal can be engaged with the insulating substrate with a simple configuration.
また、絶縁性基板は、素体の両端面と略面一となる端面を有し、貫通部は、絶縁性基板の端面に形成された貫通溝であり、リード端子の先端部は、貫通溝に収容されていることが好ましい。この場合、絶縁性基板の面積を小さくすることが可能となり、積層コンデンサの実装密度を高めることができる。 The insulating substrate has end faces that are substantially flush with both end faces of the element body, the penetrating portion is a through groove formed in the end surface of the insulating substrate, and the leading end portion of the lead terminal is the through groove. It is preferable to be accommodated in In this case, the area of the insulating substrate can be reduced, and the mounting density of the multilayer capacitor can be increased.
リード端子の先端部のうち、第２の面に突出している部分は、第２の面の面内方向に屈曲する屈曲部となっていることが好ましい。この場合、ＳＭＤ実装において実装基板のランド電極との接続をより確実に行うことができる。また、絶縁性基板からのリード端子の抜けを防止できる。 Of the tip portion of the lead terminal, the portion protruding to the second surface is preferably a bent portion that bends in the in-plane direction of the second surface. In this case, the connection with the land electrode of the mounting substrate can be more reliably performed in the SMD mounting. Further, the lead terminal can be prevented from coming off from the insulating substrate.
また、第２の面には、屈曲部を収容する収容溝が形成されていることが好ましい。この場合、収容溝の深さによって絶縁性基板の第２の面からのリード端子の先端部（屈曲部）の突出量を調整できるので、実装基板のランド電極への確実な接続を担保しつつ、積層コンデンサと実装基板との高さ方向の位置合わせを容易にできる。 Moreover, it is preferable that the accommodation groove | channel which accommodates a bending part is formed in the 2nd surface. In this case, since the protrusion amount of the leading end portion (bent portion) of the lead terminal from the second surface of the insulating substrate can be adjusted by the depth of the accommodation groove, the reliable connection to the land electrode of the mounting substrate is ensured. In addition, it is possible to easily align the multilayer capacitor and the mounting substrate in the height direction.
リード端子には、端子電極との固定部分から第１の面に至るまでの部分で、素体に対して外向きの凸部が形成されていることが好ましい。この場合、素体と絶縁性基板との間に一定の間隔が形成される。また、凸部の形成によってリード端子の長さも長くなる。したがって、音鳴きの発生をより好適に防止できる。 It is preferable that the lead terminal is formed with a convex portion outward from the element body in a portion from the portion fixed to the terminal electrode to the first surface. In this case, a constant interval is formed between the element body and the insulating substrate. Further, the length of the lead terminal is increased by the formation of the convex portion. Therefore, it is possible to more appropriately prevent the generation of sound.
また、リード端子には、端子電極との固定部分から第１の面に至るまでの部分で、素体に対して内向きの凸部が形成されていることが好ましい。この場合、素体と絶縁性基板との間に一定の間隔が形成される。また、凸部の形成によってリード端子の長さも長くなる。したがって、音鳴きの発生をより好適に防止できる。また、この凸部により、絶縁性基板の厚さ方向に素体を位置決めできる。 Moreover, it is preferable that the lead terminal has an inward convex portion with respect to the element body in a portion from the portion fixed to the terminal electrode to the first surface. In this case, a constant interval is formed between the element body and the insulating substrate. Further, the length of the lead terminal is increased by the formation of the convex portion. Therefore, it is possible to more appropriately prevent the generation of sound. Moreover, an element | base_body can be positioned in the thickness direction of an insulating board | substrate by this convex part.
また、本発明に係る積層コンデンサの実装方法は、上述した積層コンデンサを用いた積層コンデンサの実装構造であって、第２の面から突出するリード端子の先端部を実装基板のランド電極に電気的に接合してなることを特徴としている。 The multilayer capacitor mounting method according to the present invention is a multilayer capacitor mounting structure using the above-described multilayer capacitor, wherein the tip of the lead terminal protruding from the second surface is electrically connected to the land electrode of the mounting substrate. It is characterized in that it is joined.
この積層コンデンサの実装構造では、素体の両端面を覆う端子電極にリード端子が電気的に接続されている。これにより、電圧印加時の積層コンデンサに電歪振動が発生した場合であっても、リード端子が撓むことによって電歪振動が緩和され、音鳴きの発生を防止できる。また、リード端子の先端部が絶縁性基板の実装面である第２の面から突出しているので、ＳＭＤ実装において実装基板のランド電極との接続を簡便に行うことができる。このリード端子の先端部は、絶縁性基板に固定されない状態で貫通部を通っているので、リード端子の撓みが絶縁性基板への固定によって阻害されることもなく、電歪振動の緩和効果が担保される。 In this multilayer capacitor mounting structure, lead terminals are electrically connected to terminal electrodes covering both end faces of the element body. Thus, even when electrostrictive vibration occurs in the multilayer capacitor during voltage application, the electrostrictive vibration is mitigated by bending the lead terminal, and the generation of noise can be prevented. In addition, since the leading end portion of the lead terminal protrudes from the second surface, which is the mounting surface of the insulating substrate, the connection with the land electrode of the mounting substrate can be easily performed in the SMD mounting. Since the tip portion of the lead terminal passes through the penetration portion in a state where it is not fixed to the insulating substrate, the bending of the lead terminal is not hindered by fixing to the insulating substrate, and the effect of mitigating electrostrictive vibration is achieved. Secured.
本発明に係る積層コンデンサ及び積層コンデンサの実装構造によれば、音鳴きの発生を抑えつつ、ＳＭＤ実装が可能となる。 According to the multilayer capacitor and the multilayer capacitor mounting structure according to the present invention, SMD mounting is possible while suppressing the generation of noise.
以下、図面を参照しながら、本発明に係る積層コンデンサ及び積層コンデンサの実装構造の好適な実施形態について詳細に説明する。 Hereinafter, preferred embodiments of a multilayer capacitor and a multilayer capacitor mounting structure according to the present invention will be described in detail with reference to the drawings.
［第１実施形態］
図１は、本発明の第１実施形態に係る積層コンデンサの実装構造を示す分解斜視図である。また、図２は、その側面図である。
[First Embodiment]
FIG. 1 is an exploded perspective view showing the multilayer capacitor mounting structure according to the first embodiment of the present invention. FIG. 2 is a side view thereof.
図１及び図２に示すように、積層コンデンサ１の実装構造Ｋ１は、積層コンデンサ１を実装基板２にＳＭＤ実装してなる構造である。積層コンデンサ１は、例えば２０１２タイプ（長さ２．０ｍｍ、幅１．２ｍｍ、高さ１．０ｍｍ）の積層セラミックコンデンサであり、誘電体層３を複数積層してなる略直方体形状の素体４と、素体４の長手方向の両端面４ａ，４ｂを覆うように形成された一対の端子電極５，５と、素体４の底面側に配置された絶縁性基板６と、端子電極５，５のそれぞれに電気的に接続されたリード端子７，７とを備えている。 As shown in FIGS. 1 and 2, the mounting structure K1 of the multilayer capacitor 1 is a structure in which the multilayer capacitor 1 is mounted on the mounting substrate 2 by SMD. The multilayer capacitor 1 is, for example, a 2012 type (length 2.0 mm, width 1.2 mm, height 1.0 mm) multilayer ceramic capacitor, and is a substantially rectangular parallelepiped element body 4 formed by laminating a plurality of dielectric layers 3. A pair of terminal electrodes 5 and 5 formed so as to cover both end faces 4a and 4b in the longitudinal direction of the element body 4, an insulating substrate 6 disposed on the bottom side of the element body 4, and the terminal electrodes 5 and 5 5 is provided with lead terminals 7 and 7 electrically connected to each of the five.
素体４を構成する誘電体層３は、例えばＢａＴｉＯ３系、Ｂａ(Ｔｉ，Ｚｒ)Ｏ３系、又は（Ｂａ，Ｃａ）ＴｉＯ３系といった誘電体セラミックを含むセラミックグリーンシートの積層体を焼結することによって形成されている。素体４では、各誘電体層３は、互いの境界が視認できない程度に一体化されている。 The dielectric layer 3 constituting the element body 4 is a ceramic green sheet laminate including a dielectric ceramic such as a BaTiO 3 system, a Ba (Ti, Zr) O 3 system, or a (Ba, Ca) TiO 3 system. It is formed by tying. In the element body 4, the dielectric layers 3 are integrated to such an extent that their boundaries cannot be visually recognized.
素体４の内部には、図２に示すように、第１の内部電極８ａ及び第２の内部電極８ｂが設けられている。第１の内部電極８ａ及び第２の内部電極８ｂは、例えばＮｉを含む導電性ペーストを印刷等によってセラミックグリーンシートにパターン形成し、当該パターンがセラミックグリーンシートと共に焼結されることによって形成されている。 Inside the element body 4, as shown in FIG. 2, a first internal electrode 8a and a second internal electrode 8b are provided. The first internal electrode 8a and the second internal electrode 8b are formed by, for example, patterning a conductive paste containing Ni on a ceramic green sheet by printing or the like, and sintering the pattern together with the ceramic green sheet. Yes.
第１の内部電極８ａと第２の内部電極８ｂとは、少なくともグリーンシート１層分に相当する誘電体層３を挟むようにして積層方向に交互に配置され、第１の内部電極８ａの端部は、素体４の一方の端面４ａまで伸び、第２の内部電極８ｂの端部は、素体４の他方の端面４ｂまで延びている。 The first internal electrodes 8a and the second internal electrodes 8b are alternately arranged in the stacking direction so as to sandwich the dielectric layer 3 corresponding to at least one green sheet, and the end portions of the first internal electrodes 8a are The element body 4 extends to one end face 4 a, and the end portion of the second internal electrode 8 b extends to the other end face 4 b of the element body 4.
第１の内部電極８ａと第２の内部電極８ｂとによって挟まれる素体領域は、積層コンデンサ１における静電容量を実質的に発生させる部分である。この素体領域は、電歪効果によって機械的歪みが生じる領域でもある。すなわち、素体領域は、第１の内部電極８ａと第２の内部電極８ｂとの間に電圧が印加されると、素体４の積層方向に膨張し、素体４の対向する側面を結ぶ方向に収縮する。 The element region sandwiched between the first internal electrode 8a and the second internal electrode 8b is a portion that substantially generates capacitance in the multilayer capacitor 1. This element region is also a region where mechanical strain is generated by the electrostrictive effect. That is, when a voltage is applied between the first internal electrode 8a and the second internal electrode 8b, the element region expands in the stacking direction of the element body 4 and connects the opposing side surfaces of the element body 4. Shrink in the direction.
端子電極５，５は、例えば導電性金属粉末及びガラスフリットを含む導電性ペーストを素体４の両端面４ａ，４ｂに付与し、これを焼き付けることによって形成される。焼き付けられた端子電極５の表面には、必要に応じてめっき層が形成される。導電性ペーストの付与には、例えばディップ法又は印刷法を用いることができる。 The terminal electrodes 5 and 5 are formed, for example, by applying a conductive paste containing conductive metal powder and glass frit to both end faces 4a and 4b of the element body 4 and baking it. A plated layer is formed on the surface of the baked terminal electrode 5 as necessary. For applying the conductive paste, for example, a dipping method or a printing method can be used.
絶縁性基板６は、例えばポリエステル、エポキシ、フェノールなどの樹脂からなり、厚さ０．５ｍｍ〜１．０ｍｍ程度の平板状をなしている。絶縁性基板６の上面は、素体４に面する第１の面６ａとなっており、絶縁性基板６の底面は、実装基板２への実装面となる第２の面６ｂとなっている。 The insulating substrate 6 is made of, for example, a resin such as polyester, epoxy, or phenol, and has a flat plate shape with a thickness of about 0.5 mm to 1.0 mm. The upper surface of the insulating substrate 6 is a first surface 6 a that faces the element body 4, and the bottom surface of the insulating substrate 6 is a second surface 6 b that is a mounting surface to the mounting substrate 2. .
絶縁性基板６の内部には、第１の面６ａから第２の面６ｂに至る断面円形状の一対の貫通孔９，９が設けられている。貫通孔９，９の内径は、後述するリード端子７の外径よりもわずかに大きく、例えば０．６ｍｍ〜１．０ｍｍとなっている。また、貫通孔９，９間の間隔は、素体４の長さとほぼ同等となっている。 Inside the insulating substrate 6, a pair of through holes 9, 9 having a circular cross section extending from the first surface 6a to the second surface 6b are provided. The inner diameters of the through-holes 9 and 9 are slightly larger than the outer diameter of the lead terminal 7 described later, for example, 0.6 mm to 1.0 mm. Further, the distance between the through holes 9 is substantially equal to the length of the element body 4.
さらに、絶縁性基板６の第２の面６ｂには、貫通孔９，９と略同径の断面半円形状の一対の収容溝１０，１０が設けられている。収容溝１０，１０は、絶縁性基板６の長手方向の端面６ｃ，６ｄから貫通孔９の真下の位置に伸びており、この位置で貫通孔９，９の下端部と連通している。 Further, the second surface 6 b of the insulating substrate 6 is provided with a pair of receiving grooves 10, 10 having a semicircular cross section having substantially the same diameter as the through holes 9, 9. The housing grooves 10, 10 extend from the longitudinal end faces 6 c, 6 d of the insulating substrate 6 to a position directly below the through hole 9, and communicate with the lower ends of the through holes 9, 9 at this position.
リード端子７，７は、例えば外径０．５ｍｍ程度の金属細線である。リード端子７は、素体４における誘電体層３の積層方向に配置され、リード端子７の基端部７ａは、素体４の両端面４ａ，４ｂにおいて端子電極５，５の表面にそれぞれハンダで固定されている。 The lead terminals 7, 7 are fine metal wires having an outer diameter of about 0.5 mm, for example. The lead terminal 7 is disposed in the stacking direction of the dielectric layer 3 in the element body 4, and the base end portion 7 a of the lead terminal 7 is soldered to the surface of the terminal electrodes 5 and 5 on both end faces 4 a and 4 b of the element body 4. It is fixed with.
一方、リード端子７の先端部７ｂは、絶縁性基板６には固定されない状態で貫通孔９，９にそれぞれ通され、第２の面６ｂに突出している。より具体的には、リード端子７の先端部７ｂのうち、第２の面６ｂに突出している部分は、第２の面６ｂの面内方向に向かって外側に屈曲する屈曲部７ｃとなっており、収容溝１０，１０に収容された状態で絶縁性基板６の長手方向の端面６ａ，６ｂの位置まで延びている。 On the other hand, the leading end portion 7b of the lead terminal 7 passes through the through holes 9 and 9 without being fixed to the insulating substrate 6, and protrudes from the second surface 6b. More specifically, a portion of the tip 7b of the lead terminal 7 that protrudes from the second surface 6b is a bent portion 7c that bends outward in the in-plane direction of the second surface 6b. And extends to the position of the end faces 6a, 6b in the longitudinal direction of the insulating substrate 6 in a state of being accommodated in the accommodating grooves 10, 10.
ここで、上述した収容溝１０，１０は、断面半円形状をなしている。このため、屈曲部７ｃの下半分部分が第２の面６ｂから突出した状態となっている。この屈曲部７ｃの下半分部分は、クリームハンダのリフローによって実装基板２のランド電極２ａに固定されている（図２参照）。 Here, the accommodation grooves 10 and 10 described above have a semicircular cross section. For this reason, the lower half portion of the bent portion 7c is in a state protruding from the second surface 6b. The lower half portion of the bent portion 7c is fixed to the land electrode 2a of the mounting substrate 2 by reflow of cream solder (see FIG. 2).
以上説明したように、積層コンデンサ１の実装構造Ｋ１では、素体４の両端面４ａ，４ｂを覆う端子電極５，５にリード端子７，７が固定されている。これにより、電圧印加時の積層コンデンサ１に電歪振動が発生した場合であっても、主として端子電極５との固定部分から絶縁性基板６の第１の面６ａに至るまでの部分でリード端子７，７が撓むことによって電歪振動が緩和され、音鳴きの発生を防止できる。 As described above, in the mounting structure K1 of the multilayer capacitor 1, the lead terminals 7 and 7 are fixed to the terminal electrodes 5 and 5 covering the both end faces 4a and 4b of the element body 4. As a result, even when electrostrictive vibration occurs in the multilayer capacitor 1 when a voltage is applied, the lead terminal mainly extends from the portion fixed to the terminal electrode 5 to the first surface 6a of the insulating substrate 6. Electrostriction vibration is mitigated by bending 7 and 7, and generation | occurrence | production of a squeal can be prevented.
また、リード端子７の先端部７ｂが絶縁性基板６の実装面である第２の面６ｂから突出しているので、ＳＭＤ実装において実装基板２のランド電極２ａとの接続を簡便に行うことができる。リード端子７の先端部７ｂは、絶縁性基板６に固定されない状態で貫通孔９を通っているので、リード端子７の撓みが絶縁性基板６への固定によって阻害されることもなく、電歪振動の緩和効果が担保される。 In addition, since the tip 7b of the lead terminal 7 protrudes from the second surface 6b, which is the mounting surface of the insulating substrate 6, the connection with the land electrode 2a of the mounting substrate 2 can be easily performed in the SMD mounting. . Since the distal end portion 7 b of the lead terminal 7 passes through the through hole 9 in a state where it is not fixed to the insulating substrate 6, the bending of the lead terminal 7 is not hindered by the fixing to the insulating substrate 6, and electrostriction is prevented. The vibration mitigating effect is secured.
さらに、積層コンデンサ１の実装構造Ｋ１では、リード端子７の先端部７ｂが絶縁性基板６の貫通孔９を通っており、先端部７ｂのうち、絶縁性基板６の第２の面６ｂに突出する部分が屈曲部７ｃとなっている。これにより、絶縁性基板６とリード端子７，７との係合を簡単な構成で実現でき、絶縁性基板６への固定を行わずに、リード端子７の抜けを防止できる。 Furthermore, in the mounting structure K1 of the multilayer capacitor 1, the tip portion 7b of the lead terminal 7 passes through the through hole 9 of the insulating substrate 6, and protrudes from the tip portion 7b to the second surface 6b of the insulating substrate 6. The part to perform is the bending part 7c. Thereby, the engagement between the insulating substrate 6 and the lead terminals 7 and 7 can be realized with a simple configuration, and the lead terminal 7 can be prevented from coming off without being fixed to the insulating substrate 6.
また、屈曲部７ｃは、収容溝１０に収容された状態で第２の面６ｂの面内方向に屈曲しており、屈曲部７ｃの下半分部分のみが第２の面６ｂから突出した状態となっている。このように、収容溝１０，１０の深さによって第２の面６ｂからのリード端子７，７の突出量を調整できるので、実装基板２のランド電極２ａへの確実な接続を担保しつつ、積層コンデンサ１と実装基板２との高さ方向の位置合わせを容易にできる。 Further, the bent portion 7c is bent in the in-plane direction of the second surface 6b while being accommodated in the receiving groove 10, and only the lower half portion of the bent portion 7c protrudes from the second surface 6b. It has become. Thus, since the protrusion amount of the lead terminals 7 and 7 from the 2nd surface 6b can be adjusted with the depth of the accommodation grooves 10 and 10, ensuring secure connection to the land electrode 2a of the mounting substrate 2, It is possible to easily align the multilayer capacitor 1 and the mounting substrate 2 in the height direction.
［第２実施形態］
続いて、本発明の第２実施形態について説明する。図３は、本発明の第２実施形態に係る積層コンデンサの実装構造を示す分解斜視図である。また、図２は、その側面図である。
[Second Embodiment]
Subsequently, a second embodiment of the present invention will be described. FIG. 3 is an exploded perspective view showing the multilayer capacitor mounting structure according to the second embodiment of the present invention. FIG. 2 is a side view thereof.
図３及び図４に示す積層コンデンサ１１の実装構造Ｋ２は、板状のリード端子１２，１２を用いている点で、線状のリード端子７，７を用いている第１実施形態と異なっている。すなわち、積層コンデンサ１１の実装構造Ｋ２では、リード端子１２，１２は、例えば厚さ０．１ｍｍ、幅０．５ｍｍ〜１．５ｍｍの帯状をなしており、絶縁性基板６の内部に設けられる貫通孔１３，１３が、リード端子１２，１２の形状に対応して断面矩形状となっている。 The mounting structure K2 of the multilayer capacitor 11 shown in FIGS. 3 and 4 differs from the first embodiment using the linear lead terminals 7 and 7 in that the plate-like lead terminals 12 and 12 are used. Yes. That is, in the mounting structure K2 of the multilayer capacitor 11, the lead terminals 12 and 12 have, for example, a strip shape having a thickness of 0.1 mm and a width of 0.5 mm to 1.5 mm, and are penetrating through the insulating substrate 6. The holes 13 and 13 have a rectangular cross section corresponding to the shape of the lead terminals 12 and 12.
リード端子１２の基端部１２ａは、素体４の両端面４ａ，４ｂにおいて端子電極５，５の表面にそれぞれハンダで固定され、リード端子１２の先端部１２ｂは、絶縁性基板６には固定されない状態で貫通孔１３，１３にそれぞれ通されている。また、リード端子１２の基端部１２ａには、端子電極５との固定部分から素体４の上面に向かって張り出す張出部１２ｄが形成されている。リード端子７の先端部１２ｂのうち、第２の面６ｂに突出している部分は、第２の面６ｂの面内方向に向かって外側に屈曲する屈曲部１２ｃとなっており、第２の面６ｂの表面に沿って絶縁性基板６の長手方向の端面６ｃ，６ｄの位置まで延びている。 The base end portion 12 a of the lead terminal 12 is fixed to the surfaces of the terminal electrodes 5 and 5 on both end faces 4 a and 4 b of the element body 4 with solder, and the tip end portion 12 b of the lead terminal 12 is fixed to the insulating substrate 6. In the state which is not carried out, it is each passed through the through holes 13 and 13. In addition, an extended portion 12 d that protrudes from the portion fixed to the terminal electrode 5 toward the upper surface of the element body 4 is formed at the base end portion 12 a of the lead terminal 12. A portion of the tip 12b of the lead terminal 7 that protrudes from the second surface 6b is a bent portion 12c that bends outward in the in-plane direction of the second surface 6b. The insulating substrate 6 extends along the surface 6b to the positions of the end faces 6c and 6d in the longitudinal direction.
なお、第１実施形態とは異なり、絶縁性基板６の第２の面６ｂは、収容溝１０，１０の無い平坦面となっている。屈曲部１２ｃは、第２の面６ｂの面内方向に向かって内側に屈曲させてもよいが、本実施形態のように屈曲部１２ｃを外側に屈曲させた場合には、屈曲部１２ｃとランド電極２ａとの接合状態を視認しやすいという利点がある。 Note that unlike the first embodiment, the second surface 6 b of the insulating substrate 6 is a flat surface without the receiving grooves 10, 10. The bent portion 12c may be bent inward in the in-plane direction of the second surface 6b. However, when the bent portion 12c is bent outward as in the present embodiment, the bent portion 12c and the land There is an advantage that the joining state with the electrode 2a is easily visible.
このような積層コンデンサ１１の実装構造Ｋ２においても、第１実施形態と同様に、電圧印加時の積層コンデンサ１１に電歪振動が発生した場合であっても、主として端子電極５との固定部分から絶縁性基板６の第１の面６ａに至るまでの部分でリード端子１２，１２が撓むことによって電歪振動が緩和され、音鳴きの発生を防止できる。また、絶縁性基板６とリード端子１２，１２との係合を簡単な構成で実現でき、絶縁性基板６への固定を行わずに、リード端子１２の抜けを防止できる。また、リード端子１２の張出部１２ｄによって素体４が押さえられるので、音鳴きの防止効果が高められる。 In such a mounting structure K2 of the multilayer capacitor 11 as well as in the first embodiment, even when electrostrictive vibration occurs in the multilayer capacitor 11 when a voltage is applied, the mounting structure K2 mainly starts from a portion fixed to the terminal electrode 5. Since the lead terminals 12 and 12 are bent in the portion up to the first surface 6a of the insulating substrate 6, electrostrictive vibration is mitigated, and generation of noise can be prevented. Further, the engagement between the insulating substrate 6 and the lead terminals 12 and 12 can be realized with a simple configuration, and the lead terminal 12 can be prevented from coming off without being fixed to the insulating substrate 6. Further, since the element body 4 is pressed by the overhanging portion 12d of the lead terminal 12, the effect of preventing noise is enhanced.
［第３実施形態］
続いて、本発明の第３実施形態について説明する。図５は、本発明の第３実施形態に係る積層コンデンサの実装構造を示す分解斜視図である。また、図６は、その側面図である。
[Third Embodiment]
Subsequently, a third embodiment of the present invention will be described. FIG. 5 is an exploded perspective view showing the multilayer capacitor mounting structure according to the third embodiment of the present invention. FIG. 6 is a side view thereof.
図５及び図６に示す積層コンデンサ２１の実装構造Ｋ３は、貫通孔９，９に代えて、絶縁性基板６に貫通溝２４，２４を設けている点で第１実施形態と異なっている。すなわち、積層コンデンサ１の実装構造Ｋ１では、絶縁性基板２３の長手方向の両端面２３ｃ，２３ｄが素体４の両端面４ａ，４ｂと略面一となるように絶縁性基板２３の長さが設定されており、この両端面２３ｃ，２３ｄに第１実施形態の貫通孔９，９と略同径の断面半円形状の貫通溝２４，２４がそれぞれ設けられている。また、絶縁性基板２３の第２の面２３ｂには、第１実施形態と同様に収容溝１０，１０が設けられている。収容溝１０，１０は、貫通溝２４，２４の真下の位置で貫通溝２４，２４の下端部と連通している。 The mounting structure K3 of the multilayer capacitor 21 shown in FIGS. 5 and 6 is different from the first embodiment in that through grooves 24 and 24 are provided in the insulating substrate 6 instead of the through holes 9 and 9. That is, in the mounting structure K1 of the multilayer capacitor 1, the length of the insulating substrate 23 is such that both end surfaces 23c, 23d in the longitudinal direction of the insulating substrate 23 are substantially flush with both end surfaces 4a, 4b of the element body 4. The both end faces 23c and 23d are provided with through-grooves 24 and 24 having a semicircular cross section having the same diameter as the through-holes 9 and 9 of the first embodiment. Further, the housing grooves 10 are provided on the second surface 23b of the insulating substrate 23 as in the first embodiment. The housing grooves 10, 10 communicate with the lower ends of the through grooves 24, 24 at positions immediately below the through grooves 24, 24.
リード端子２５の基端部２５ａは、素体４の両端面４ａ，４ｂにおいて端子電極５，５の表面にそれぞれハンダで固定され、リード端子２５の先端部２５ｂは、絶縁性基板２３には固定されない状態で貫通溝２４，２４にそれぞれ収容されている。リード端子２５の先端部２５ｂのうち、第２の面２３ｂに突出している部分は、第２の面２３ｂの面内方向に向かって内側に屈曲する屈曲部２５ｃとなっており、収容溝１０，１０に収容された状態で絶縁性基板２３の長手方向の端面２３ｃ，２３ｄから第２の面２３ｂの表面に沿って所定の長さだけ内側に伸びている。 The base end portion 25 a of the lead terminal 25 is fixed to the surfaces of the terminal electrodes 5 and 5 on both end faces 4 a and 4 b of the element body 4 by soldering, and the tip end portion 25 b of the lead terminal 25 is fixed to the insulating substrate 23. In the state which is not carried out, it is accommodated in the penetration grooves 24 and 24, respectively. A portion of the leading end portion 25b of the lead terminal 25 that protrudes to the second surface 23b is a bent portion 25c that bends inward in the in-plane direction of the second surface 23b. 10 extends inward from the longitudinal end faces 23c, 23d of the insulating substrate 23 by a predetermined length along the surface of the second surface 23b.
このような積層コンデンサ２１の実装構造Ｋ３においても、第１実施形態と同様に、電圧印加時の積層コンデンサ２１に電歪振動が発生した場合であっても、主として端子電極５との固定部分から絶縁性基板２３の第１の面２３ａに至るまでの部分でリード端子２５，２５が撓むことによって電歪振動が緩和され、音鳴きの発生を防止できる。また、絶縁性基板２３とリード端子２５，２５との係合を簡単な構成で実現でき、絶縁性基板２３への固定を行わずに、リード端子２５の抜けを防止できる。 In such a mounting structure K3 of the multilayer capacitor 21 as well as in the first embodiment, even when electrostrictive vibration occurs in the multilayer capacitor 21 when a voltage is applied, the mounting structure K3 mainly starts from a portion fixed to the terminal electrode 5. When the lead terminals 25 and 25 are bent in the portion up to the first surface 23a of the insulating substrate 23, electrostrictive vibration is alleviated and generation of noise can be prevented. Further, the engagement between the insulating substrate 23 and the lead terminals 25, 25 can be realized with a simple configuration, and the lead terminal 25 can be prevented from coming off without being fixed to the insulating substrate 23.
また、絶縁性基板２３の長手方向の両端面２３ｃ，２３ｄに貫通溝２４，２４を設けることで、素体４の長さとほぼ同じ長さにまで絶縁性基板２３の長さを小さくすることが可能となるので、積層コンデンサ２１の実装密度を高めることができる。 In addition, by providing the through grooves 24 and 24 on both end faces 23c and 23d in the longitudinal direction of the insulating substrate 23, the length of the insulating substrate 23 can be reduced to substantially the same length as the length of the element body 4. Therefore, the mounting density of the multilayer capacitor 21 can be increased.
［第４実施形態］
続いて、本発明の第４実施形態について説明する。図７は、本発明の第４実施形態に係る積層コンデンサの実装構造を示す分解斜視図である。また、図８は、その側面図である。
[Fourth Embodiment]
Subsequently, a fourth embodiment of the present invention will be described. FIG. 7 is an exploded perspective view showing the multilayer capacitor mounting structure according to the fourth embodiment of the present invention. FIG. 8 is a side view thereof.
図７及び図８に示す積層コンデンサ３１の実装構造Ｋ４は、リード端子３２，３２の中間部分に凸部３３を設けている点で、このような凸部３３を設けていない第１実施形態と異なっている。すなわち、積層コンデンサ３１の実装構造Ｋ４では、端子電極５との固定部分から絶縁性基板６の第１の面６ａに至るまでの部分で、素体４に対して外向きとなるように、リード端子３２，３２に略Ｖ字状の凸部３３がそれぞれ設けられている。凸部３３の突出長さは、例えば０．５ｍｍとなっている。 The mounting structure K4 of the multilayer capacitor 31 shown in FIG. 7 and FIG. 8 is different from the first embodiment in which the convex portion 33 is not provided in that the convex portion 33 is provided in the intermediate portion between the lead terminals 32 and 32. Is different. That is, in the mounting structure K4 of the multilayer capacitor 31, the lead from the portion fixed to the terminal electrode 5 to the first surface 6a of the insulating substrate 6 is directed outward with respect to the element body 4. The terminals 32 and 32 are each provided with a substantially V-shaped convex portion 33. The protruding length of the convex portion 33 is, for example, 0.5 mm.
このような積層コンデンサ３１の実装構造Ｋ４においても、第１実施形態と同様に、電圧印加時の積層コンデンサ３１に電歪振動が発生した場合であっても、主として端子電極５との固定部分から絶縁性基板６の第１の面６ａに至るまでの部分でリード端子３２，３２が撓むことによって電歪振動が緩和され、音鳴きの発生を防止できる。また、絶縁性基板６とリード端子３２，３２との係合を簡単な構成で実現でき、絶縁性基板６への固定を行わずに、リード端子３２の抜けを防止できる。 In such a mounting structure K4 of the multilayer capacitor 31, as in the first embodiment, even when electrostrictive vibration occurs in the multilayer capacitor 31 when a voltage is applied, the mounting structure K4 mainly starts from a portion fixed to the terminal electrode 5. Since the lead terminals 32 and 32 are bent in the portion up to the first surface 6a of the insulating substrate 6, electrostrictive vibration is mitigated, and generation of noise can be prevented. Further, the engagement between the insulating substrate 6 and the lead terminals 32 and 32 can be realized with a simple configuration, and the lead terminal 32 can be prevented from coming off without being fixed to the insulating substrate 6.
また、リード端子３２に外向きの凸部３３を設けることにより、リード端子３２の長さが長くなり、リード端子３２，３２の撓み量を十分に確保でき、電歪振動の緩和効果をより向上させることができる。また、この外向きの凸部３３は、リード端子３２，３２を絶縁性基板６の貫通孔９，９に通す際に絶縁性基板６の第１の面６ａに当接し、絶縁性基板６に対する素体４の高さ方向の位置を決める位置決め部としても機能する。 Further, by providing the lead terminal 32 with the outwardly protruding portion 33, the length of the lead terminal 32 is increased, the amount of bending of the lead terminals 32 and 32 can be sufficiently secured, and the effect of mitigating electrostrictive vibration is further improved. Can be made. Further, the outward projecting portion 33 contacts the first surface 6 a of the insulating substrate 6 when the lead terminals 32, 32 are passed through the through holes 9, 9 of the insulating substrate 6. It also functions as a positioning part that determines the position of the element body 4 in the height direction.
これにより、素体４の底面と絶縁性基板６の第１の面６ａとの間には、凸部３３の大きさによって調整可能な一定の隙間が形成される。この隙間の形成により、積層コンデンサ３１の電歪振動が素体４から絶縁性基板６に直接伝播することを抑えられるので、音鳴きの発生をより確実に防止できる。 Thereby, a constant gap that can be adjusted by the size of the convex portion 33 is formed between the bottom surface of the element body 4 and the first surface 6 a of the insulating substrate 6. By forming this gap, it is possible to prevent the electrostrictive vibration of the multilayer capacitor 31 from directly propagating from the element body 4 to the insulating substrate 6, thereby making it possible to more reliably prevent the generation of noise.
さらに、この積層コンデンサ３１の実装構造Ｋ４では、絶縁性基板６の第２の面６ｂから突出するリード端子３２，３２の先端部３２ｂを第２の面６ｂの面内方向に屈曲させる際の曲げ応力が凸部３３によって吸収され、素体４側への曲げ応力の伝播を抑制できる。したがって、素体４の破損や、端子電極５からのリード端子３２の剥がれなどを抑止できる。 Further, in the mounting structure K4 of the multilayer capacitor 31, the bending when the tip portions 32b of the lead terminals 32, 32 protruding from the second surface 6b of the insulating substrate 6 are bent in the in-plane direction of the second surface 6b. The stress is absorbed by the convex portion 33 and the propagation of the bending stress to the element body 4 side can be suppressed. Therefore, damage to the element body 4 and peeling of the lead terminal 32 from the terminal electrode 5 can be suppressed.
［第５実施形態］
続いて、本発明の第５実施形態について説明する。図９は、本発明の第５実施形態に係る積層コンデンサの実装構造を示す分解斜視図である。また、図１０は、その側面図である。
[Fifth Embodiment]
Subsequently, a fifth embodiment of the present invention will be described. FIG. 9 is an exploded perspective view showing the multilayer capacitor mounting structure in accordance with the fifth embodiment of the present invention. FIG. 10 is a side view thereof.
図９及び図１０に示す積層コンデンサ４１の実装構造Ｋ５は、上述した第４実施形態の更なる変形例であり、リード端子４２，４２の中間部分における凸部４３の向きが第４実施形態と異なっている。すなわち、積層コンデンサ４１の実装構造Ｋ５では、端子電極５との固定部分から絶縁性基板６の第１の面６ａに至るまでの部分で、素体４に対して内向きとなるように、リード端子４２，４２に略Ｖ字状の凸部４３がそれぞれ設けられている。凸部４３の突出長さは、例えば０．５ｍｍとなっている。 The mounting structure K5 of the multilayer capacitor 41 shown in FIGS. 9 and 10 is a further modification of the above-described fourth embodiment, and the direction of the convex portion 43 in the intermediate portion between the lead terminals 42 and 42 is different from that of the fourth embodiment. Is different. That is, in the mounting structure K5 of the multilayer capacitor 41, the lead from the portion fixed to the terminal electrode 5 to the first surface 6a of the insulating substrate 6 is inward with respect to the element body 4. The terminals 42 and 42 are each provided with a substantially V-shaped convex portion 43. The protruding length of the convex portion 43 is, for example, 0.5 mm.
このような積層コンデンサ４１の実装構造Ｋ５においても、第１実施形態と同様に、電圧印加時の積層コンデンサ４１に電歪振動が発生した場合であっても、主として端子電極５との固定部分から絶縁性基板６の第１の面６ａに至るまでの部分でリード端子４２，４２が撓むことによって電歪振動が緩和され、音鳴きの発生を防止できる。また、絶縁性基板６とリード端子４２，４２との係合を簡単な構成で実現でき、絶縁性基板６への固定を行わずに、リード端子４２の抜けを防止できる。 In such a mounting structure K5 of the multilayer capacitor 41, as in the first embodiment, even when electrostrictive vibration occurs in the multilayer capacitor 41 when a voltage is applied, the mounting structure K5 mainly starts from a portion fixed to the terminal electrode 5. When the lead terminals 42 and 42 are bent in the portion up to the first surface 6a of the insulating substrate 6, electrostrictive vibration is mitigated, and generation of noise can be prevented. Further, the engagement between the insulating substrate 6 and the lead terminals 42 and 42 can be realized with a simple configuration, and the lead terminal 42 can be prevented from coming off without being fixed to the insulating substrate 6.
また、リード端子４２に内向きの凸部４３を設けることにより、リード端子４２の長さが長くなり、リード端子４２，４２の撓み量を十分に確保でき、電歪振動の緩和効果をより向上させることができる。また、この内向きの凸部４３は、素体４の底面に当接することにより、リード端子４３に対する素体４の高さ方向の位置を決める位置決め部として機能する。また、凸部４３は、リード端子４３，４３を絶縁性基板６の貫通孔９，９に通す際に絶縁性基板６の第１の面６ａに当接し、絶縁性基板６に対する素体４の高さ方向の位置を決める位置決め部としても機能する。 Further, by providing the lead terminal 42 with the inward convex portion 43, the length of the lead terminal 42 is increased, the amount of bending of the lead terminals 42 and 42 can be sufficiently secured, and the effect of mitigating electrostrictive vibration is further improved. Can be made. In addition, the inwardly protruding portion 43 functions as a positioning portion that determines the position of the element body 4 in the height direction with respect to the lead terminal 43 by contacting the bottom surface of the element body 4. Further, the protrusion 43 abuts on the first surface 6 a of the insulating substrate 6 when the lead terminals 43, 43 are passed through the through holes 9, 9 of the insulating substrate 6, so that the element body 4 with respect to the insulating substrate 6 It also functions as a positioning part that determines the position in the height direction.
これにより、素体４の底面と絶縁性基板６の第１の面６ａとの間には、凸部４３の大きさによって調整可能な一定の隙間が形成される。この隙間の形成により、積層コンデンサ４１の電歪振動が素体４から絶縁性基板６に直接伝播することを抑えられるので、音鳴きの発生をより確実に防止できる。 Thereby, a constant gap that can be adjusted by the size of the convex portion 43 is formed between the bottom surface of the element body 4 and the first surface 6 a of the insulating substrate 6. By forming this gap, it is possible to prevent the electrostrictive vibration of the multilayer capacitor 41 from directly propagating from the element body 4 to the insulating substrate 6, thereby making it possible to more reliably prevent the generation of noise.
本発明は、上記実施形態に限られるものではない。例えば上述した実施形態では、線状或いは平板状のリード端子を例示したが、他の断面形状を有するリード端子を用いてもよい。この場合、貫通孔、貫通溝、及び収容溝の形状は、リード端子の断面形状に合わせて適宜変更することが好ましい。 The present invention is not limited to the above embodiment. For example, in the above-described embodiment, a linear or flat lead terminal is illustrated, but a lead terminal having another cross-sectional shape may be used. In this case, it is preferable that the shape of the through hole, the through groove, and the housing groove is appropriately changed according to the cross-sectional shape of the lead terminal.
また、素体４の配置数は、要求される特性に応じて適宜変更してもよい。例えば図１１に示す積層コンデンサ５１の実装構造Ｋ６のように、素体４の幅方向に２つの素体４を配置してもよく、例えば図１２に示す積層コンデンサ６１の実装構造Ｋ７のように、素体４の高さ方向に２つの素体４を配置してもよい。 Further, the number of the element bodies 4 may be appropriately changed according to required characteristics. For example, as shown in the mounting structure K6 of the multilayer capacitor 51 shown in FIG. 11, two element bodies 4 may be arranged in the width direction of the element body 4. For example, like the mounting structure K7 of the multilayer capacitor 61 shown in FIG. Two element bodies 4 may be arranged in the height direction of the element body 4.
１，１１，２１，３１，４１，５１，６１…積層コンデンサ、２…実装基板、２ａ…ランド電極、３…誘電体層、４…素体、４ａ，４ｂ…端面、５…端子電極、６，２３…絶縁性基板、６ａ，２３ａ…第１の面、６ｂ，２３ｂ…第２の面、６ｃ，６ｄ，２３ｃ，２３ｄ…端面、７，１２，２５，３２，４２…リード端子、７ｂ，１２ｂ，２５ｂ，３２ｂ，４２ｂ…先端部、７ｃ，１２ｃ，２５ｃ，３２ｃ，４２ｃ…屈曲部、９，１３…貫通孔（貫通部）、１０…収容溝、２４…貫通溝（貫通部）、３３，４３…凸部、Ｋ１〜Ｋ７…実装構造。 DESCRIPTION OF SYMBOLS 1,11,21,31,41,51,61 ... Multilayer capacitor, 2 ... Mounting board, 2a ... Land electrode, 3 ... Dielectric layer, 4 ... Element body, 4a, 4b ... End face, 5 ... Terminal electrode, 6 , 23 ... Insulating substrate, 6a, 23a ... First surface, 6b, 23b ... Second surface, 6c, 6d, 23c, 23d ... End surface, 7, 12, 25, 32, 42 ... Lead terminal, 7b, 12b, 25b, 32b, 42b ... tip, 7c, 12c, 25c, 32c, 42c ... bent part, 9, 13 ... through hole (through part), 10 ... receiving groove, 24 ... through groove (through part), 33 , 43 ... convex portions, K1 to K7 ... mounting structure.
Claims (8)
前記素体の両端面を覆うように形成された端子電極と、
前記端子電極に固定されたリード端子と、
前記素体に面する第１の面、及び実装基板への実装面となる第２の面を有する絶縁性基板と、を備え、
前記絶縁性基板には、前記第１の面から前記第２の面に至る貫通部が設けられ、
前記リード端子の先端部は、前記絶縁性基板に固定されない状態で前記貫通部を通って前記第２の面に突出し、
前記リード端子の先端部のうち、前記第２の面に突出している部分は、前記第２の面の面内方向に屈曲する屈曲部となっており、
前記第２の面には、前記屈曲部を収容する収容溝が形成され、
前記屈曲部は、一方側部分が前記収容溝に収容され、他方側部分が前記第２の面から突出していることを特徴とする積層コンデンサ。 An element body formed by laminating a plurality of dielectric layers;
Terminal electrodes formed so as to cover both end faces of the element body;
A lead terminal fixed to the terminal electrode;
An insulating substrate having a first surface facing the element body and a second surface serving as a mounting surface to the mounting substrate;
The insulating substrate is provided with a penetrating portion from the first surface to the second surface,
The tip portion of the lead terminal projects in the said the through portion I through in a state not fixed to the insulating substrate second surface,
Of the tip portion of the lead terminal, the portion protruding to the second surface is a bent portion that bends in the in-plane direction of the second surface,
An accommodation groove for accommodating the bent portion is formed on the second surface,
The multilayer capacitor is characterized in that one side portion of the bent portion is housed in the housing groove, and the other side portion projects from the second surface .
前記リード端子の先端部は、前記貫通孔に挿通されていることを特徴とする請求項１記載の積層コンデンサ。 The through portion is a through hole formed inside the insulating substrate,
The multilayer capacitor according to claim 1, wherein a tip portion of the lead terminal is inserted through the through hole.
前記貫通部は、前記絶縁性基板の端面に形成された貫通溝であり、
前記リード端子の先端部は、前記貫通溝に収容されていることを特徴とする請求項１記載の積層コンデンサ。 The insulating substrate has end faces that are substantially flush with both end faces of the element body,
The penetrating portion is a through groove formed on an end surface of the insulating substrate,
The multilayer capacitor according to claim 1, wherein a tip end portion of the lead terminal is accommodated in the through groove.
前記第２の面から突出する前記リード端子の先端部を実装基板のランド電極に電気的に接合してなることを特徴とする積層コンデンサの実装構造。 A multilayer capacitor mounting structure using the multilayer capacitor according to any one of claims 1 to 7 ,
A multilayer capacitor mounting structure, wherein a tip end portion of the lead terminal protruding from the second surface is electrically joined to a land electrode of a mounting substrate.
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