JP2017195310A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve connectability of an inner conductor and an external electrode while suppressing immersion of a plating liquid into an element assembly.SOLUTION: An electronic component 1 comprises: an element assembly 2 including a pair of end surfaces 2a and 2b which is formed by laminating a plurality of insulation layers 6, has a rectangular parallelepiped shape, and is faced each other, a pair of main surfaces 2c and 2d that is faced each other, and a pair of side surfaces 2e and 2f that is opposite each other; a plurality of inner conductors 16a to 16f that are placed side by side in the element assembly 2; a glass layer 3 that is arranged on the pair of end surfaces 2a and 2b of the element assembly 2, the pair of main surfaces 2c and 2d, and the pair of side surfaces 2e and 2f; and a pair of external electrodes 4 and 5 that is arranged on the pair of end surfaces 2a and 2b on the glass layer 3, and is electrically connected to the inner conductors 16a to 16f. A thickness of a part which is not covered with the pair of external electrodes 4 and 5 in the glass layer 3 is thicker than the thickness of the part which is covered with the pair of external electrodes 4 and 5.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electronic component.

  Patent Document 1 discloses an electronic component. The electronic component described in Patent Document 1 includes an element body, an inner conductor disposed in the element body, and an external electrode disposed on the outer surface of the element body and electrically connected to the inner conductor. . In the electronic component described in Patent Document 1, a glass layer is formed on the outer surface of an element body on which no external electrode is arranged.

JP 2004-128448 A

  However, in the conventional electronic component, since the glass layer is not formed on the outer surface of the element body on which the external electrode is disposed, when forming the plating layer in the process of forming the outer electrode, There is a risk that the plating solution may enter the body. If the plating solution enters the element body, the characteristics of the electronic component may be deteriorated.

  An object of one embodiment of the present invention is to provide an electronic component that can improve the connectivity between an internal conductor and an external electrode while suppressing the penetration of a plating solution into the element body.

  An electronic component according to one embodiment of the present invention is formed by stacking a plurality of insulator layers, has a rectangular parallelepiped shape, a pair of end surfaces facing each other, a pair of main surfaces facing each other, and facing each other An element body having a pair of side surfaces, a plurality of internal conductors juxtaposed in the element body, a pair of end surfaces, a pair of main surfaces, and a pair of side surfaces of the element body, and a glass layer A pair of external electrodes disposed on each of the pair of end surfaces and electrically connected to the internal conductor, and the thickness of the portion of the glass layer not covered by the pair of external electrodes is It is larger than the thickness of the portion covered with the electrode.

  In the electronic component according to one embodiment of the present invention, a glass layer is disposed on each surface of the element body. Therefore, it is possible to prevent the plating solution from entering the element body from the outer surface of the element body. As a result, deterioration of the characteristics of the electronic component can be suppressed. Moreover, in the electronic component of this aspect, the thickness of the part which is not covered with the external electrode in the glass layer is larger than the thickness of the part covered with the external electrode. If the thickness of the glass layer disposed between the external electrode and the element body is large, the electrical connectivity between the internal conductor and the external electrode may be reduced. In the electronic component of this aspect, the thickness of the glass layer covered with the external electrode is smaller than the thickness of the portion not covered with the external electrode. Therefore, the connectivity between the internal conductor and the external electrode can be ensured. Therefore, in the electronic component of this aspect, it is possible to improve the connectivity between the internal conductor and the external electrode while suppressing the penetration of the plating solution into the element body.

  In one embodiment, each of the pair of external electrodes is positioned on each of the first electrode portion located on the end surface, the second electrode portion located on each of the pair of main surfaces, and each of the pair of side surfaces. And a thickness of the glass layer disposed between the end surface and the first electrode portion, and a thickness and a side surface of the glass layer disposed between the main surface and the second electrode portion. You may be smaller than the thickness of the glass layer arrange | positioned between 3rd electrode parts. The plating solution easily enters from the end of the external electrode. In the electronic component of one embodiment, the thickness of the glass layer disposed between the end surface and the first electrode portion is set to the thickness and the side surface of the glass layer disposed between the main surface and the second electrode portion. It is smaller than the thickness of the glass layer disposed between the electrode portions. That is, in the electronic component of one embodiment, by relatively increasing the thickness of the glass layer between the end portion of the external electrode and the element body, while suppressing the intrusion of the plating solution from the end portion of the external electrode, The connectivity between the internal conductor and the external electrode can be improved.

  According to one aspect of the present invention, it is possible to improve the connectivity between the internal conductor and the external electrode while suppressing the penetration of the plating solution into the element body.

It is a perspective view of the electronic component which concerns on one Embodiment. It is a figure which shows the cross-sectional structure along the II-II line | wire in FIG. It is a perspective view which shows a coil conductor.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or equivalent elements will be denoted by the same reference numerals, and redundant description will be omitted.

  As shown in FIG. 1, the laminated coil component (electronic component) 1 includes an element body 2 and a pair of external electrodes 4 and 5 disposed at both ends of the element body 2.

  The element body 2 has a rectangular parallelepiped shape. The element body 2 has, as its outer surface, a pair of end faces 2a, 2b facing each other and a pair of main faces 2c, 2d extending so as to connect the pair of end faces 2a, 2b and facing each other. And a pair of side surfaces 2e and 2f extending so as to connect the pair of main surfaces 2c and 2d and facing each other. The main surface 2d is defined as a surface facing the other electronic device when the laminated coil component 1 is mounted on another electronic device (for example, a circuit board or an electronic component) (not shown), for example.

  The facing direction of each end surface 2a, 2b, the facing direction of each main surface 2c, 2d, and the facing direction of each side surface 2e, 2f are substantially orthogonal to each other. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which corners and ridge lines are chamfered and a rectangular parallelepiped shape in which corners and ridge lines are rounded.

  The element body 2 is configured by laminating a plurality of insulator layers 6 (see FIG. 3). Each insulator layer 6 is laminated in the opposing direction of each main surface 2c, 2d of the element body 2. That is, the stacking direction of each insulator layer 6 coincides with the opposing direction of each main surface 2c, 2d of the element body 2. Hereinafter, the facing direction of the main surfaces 2c and 2d is also referred to as a “stacking direction”. Each insulator layer 6 has a substantially rectangular shape. In the actual element body 2, each insulator layer 6 is integrated to such an extent that the boundary between the layers cannot be visually recognized.

  Each insulator layer 6 is made of, for example, glass made of strontium, calcium, alumina, and silicon oxide, and glass-based ceramic made of alumina. Each insulator layer 6 may be made of ferrite (Ni—Cu—Zn ferrite, Ni—Cu—Zn—Mg ferrite, Cu—Zn ferrite, Ni—Cu ferrite, etc.). The insulator layer 6 may be made of nonmagnetic ferrite.

  The external electrode 4 is disposed on the end surface 2 a of the element body 2. The external electrode 5 is disposed on the end surface 2 b of the element body 2. In other words, the external electrodes 4 and 5 are spaced apart from each other in the opposing direction of the pair of end faces 2a and 2b. Each of the external electrodes 4 and 5 has a substantially rectangular shape in plan view, and its corners are rounded.

  The external electrode 4 has a baked electrode layer 7, a first plating layer 8, and a second plating layer 9. As for the external electrode 4, the baking electrode layer 7, the 1st plating layer 8, and the 2nd plating layer 9 are arrange | positioned in this order from the element body 2 side. The baking electrode layer 7 contains a conductive material. The baked electrode layer 7 is configured as a sintered body of a conductive paste containing conductive metal powder (Ag and / or Pd powder) and glass frit. The first plating layer 8 is, for example, a Ni plating layer. The second plating layer 9 is, for example, a Sn plating layer.

  The external electrode 4 includes an electrode portion (first electrode portion) 4a located on the end surface 2a, an electrode portion (second electrode portion) 4b located on the main surface 2d, and an electrode portion (on the main surface 2c ( The second electrode portion 4c, the electrode portion (third electrode portion) 4d located on the side surface 2e, and the electrode portion (third electrode portion) 4e located on the side surface 2f are included. Yes. The electrode portion 4a covers the entire end surface 2a. The electrode portion 4b covers a part of the main surface 2d. The electrode portion 4c covers a part of the main surface 2c. The electrode portion 4d covers a part of the side surface 2e. The electrode portion 4e covers a part of the side surface 2f. The five electrode portions 4a, 4b, 4c, 4d, and 4e are integrally formed.

  The external electrode 5 has a baked electrode layer 10, a first plating layer 11, and a second plating layer 12. As for the external electrode 5, the baking electrode layer 10, the 1st plating layer 11, and the 2nd plating layer 12 are arrange | positioned in this order from the element | base_body 2 side. The baking electrode layer 10 contains a conductive material. The baking electrode layer 10 is configured as a sintered body of a conductive paste containing conductive metal powder (Ag and / or Pd powder) and glass frit. The first plating layer 11 is, for example, a Ni plating layer. The second plating layer 12 is, for example, a Sn plating layer.

  The external electrode 5 includes an electrode portion (first electrode portion) 5a located on the end surface 2b, an electrode portion (second electrode portion) 5b located on the main surface 2d, and an electrode portion (on the main surface 2c). The second electrode portion 5c, the electrode portion (third electrode portion) 5d located on the side surface 2e, and the electrode portion (third electrode portion) 5e located on the side surface 2f are included. Yes. The electrode portion 5a covers the entire end surface 2b. The electrode portion 5b covers a part of the main surface 2d. The electrode portion 5c covers a part of the main surface 2c. The electrode portion 5d covers a part of the side surface 2e. The electrode portion 5e covers a part of the side surface 2f. The five electrode portions 5a, 5b, 5c, 5d, and 5e are integrally formed.

  As shown in FIG. 2, the laminated coil component 1 includes a glass layer 3 disposed on the surface of the element body 2. The glass layer 3 is arrange | positioned at each end surface 2a, 2b of each element | base_body 2, each main surface 2c, 2d, and each side surface 2e, 2f. That is, the glass layer 3 is disposed so as to cover the entire surface of the element body 2. The glass layer 3 is formed by, for example, applying a glass slurry containing glass powder, a binder resin, a solvent, and the like to the base body 2 and baking it.

The thickness of the glass layer 3 disposed between the end surfaces 2a, 2b and the electrode portions 4a, 5a of the external electrodes 4, 5 is T1, and the main surfaces 2c, 2d and the electrode portions 4b, 5b, 4c of the external electrodes 4, 5 are , 5c is the thickness of the glass layer 3 disposed between the side surfaces 2e, 2f and the electrode portions 4d, 5d, 4e, 5e of the external electrodes 4, 5 When T3, the following relationship is satisfied.
T1 <T2 <T3
That is, in the glass layer 3, the thickness T3 of the portion not covered with the external electrodes 4 and 5 is larger than the thickness T1 and T2 of the portion covered with the external electrodes 4 and 5. Further, in the glass layer 3, the thickness T1 of the glass layer 3 disposed between the end faces 2a, 2b and the electrode portions 4a, 5a is between the main surfaces 2c, 2d and the electrode portions 4b, 5b, 4c, 5c. Is smaller than the thickness T2 of the glass layer disposed on the side surface and the thickness T2 of the glass layer 3 disposed between the side surfaces 2e, 2f and the electrode portions 4d, 5d, 4e, 5e.

Further, the thickness T1 of the glass layer 3 disposed between the end faces 2a, 2b and the electrode portions 4a, 5a is set to be a baked electrode of the external electrodes 4, 5 (electrode portions 4a, 5a) located on the end faces 2a, 2b. It is smaller than the thickness T4 of the layers 7 and 10. In other words, the thickness T4 of the baked electrode layers 7 and 10 of the external electrodes 4 and 5 positioned on the end surfaces 2a and 2b is the thickness of the glass layer 3 disposed between the end surfaces 2a and 2b and the electrode portions 4a and 5a. Greater than T1. Further, the thickness T1 of the glass layer 3 disposed between the end surfaces 2a, 2b and the electrode portions 4a, 5a, the thickness T3 of the glass layer 3 in the portion not covered with the external electrodes 4, 5, and the end surfaces 2a, The thickness T4 of the baked electrode layers 7 and 10 of the external electrodes 4 and 5 positioned on 2b satisfies the following relationship.
T1 + T4> T3

  The laminated coil component 1 includes a coil 15 disposed in the element body 2. As shown in FIG. 3, the coil 15 includes a plurality of coil conductors (internal conductors) 16a, 16b, 16c, 16d, 16e, and 16f.

  The plurality of coil conductors 16a to 16f are formed including, for example, Ag and / or Pd as a conductive material. The plurality of coil conductors 16a to 16f are configured as a sintered body of a conductive paste containing Ag and / or Pd as a conductive material. The coil conductor 16 a has a connection conductor 17. The connection conductor 17 electrically connects the coil conductor 16a and the external electrode 5. The coil conductor 16 f has a connection conductor 18. The connection conductor 18 electrically connects the coil conductor 16f and the external electrode 4. The connection conductor 17 and the connection conductor 18 are formed using Ag and Pd as conductive materials. In the present embodiment, the conductor pattern of the coil conductor 16a and the conductor pattern of the connection conductor 17 are integrally formed continuously, and the conductor pattern of the coil conductor 16f and the conductor pattern of the connection conductor 18 are formed integrally and continuously. Is done.

  The coil conductors 16 a to 16 f are juxtaposed in the stacking direction of the insulator layer 6 in the element body 2. The coil conductors 16a to 16f are arranged in the order of the coil conductor 16a, the coil conductor 16b, the coil conductor 16c, the coil conductor 16d, the coil conductor 16e, and the coil conductor 16f from the side closest to the outermost layer.

  The ends of the coil conductors 16a to 16f are connected by through-hole conductors 19a to 19e. Thereby, the coil conductors 16 a to 16 f are electrically connected to each other, and the coil 15 is formed in the element body 2. The through-hole conductors 19a to 19e include, for example, Ag and / or Pd as a conductive material, and are configured as a sintered body of a conductive paste including a conductive material.

  As shown in FIG. 2, the connection conductor 17 has a protrusion 20. The protruding portion 20 is disposed on the end surface 2 a side of the element body 2 in the connection conductor 17. The protruding portion 20 protrudes from the end surface 2 a of the element body 2 toward the external electrode 5. The protruding part 20 penetrates the glass layer 3 and is connected to the baked electrode layer 10 of the external electrode 5.

  The connection conductor 18 has a protruding portion 21. The protruding portion 21 is disposed on the end surface 2 b side of the element body 2 in the connection conductor 18. The protruding portion 21 protrudes from the end surface 2 b of the element body 2 to the external electrode 4 side. The protruding portion 21 penetrates the glass layer 3 and is connected to the baked electrode layer 7 of the external electrode 4.

  As described above, in the laminated coil component 1 according to the present embodiment, the glass layer 3 is disposed on the entire surfaces 2 a to 2 f of the element body 2. Therefore, it is possible to suppress the plating solution from entering the element body 2 from the outer surface of the element body 2. As a result, the deterioration of the characteristics of the laminated coil component 1 can be suppressed. Further, the thickness of the portion of the glass layer 3 not covered with the external electrodes 4 and 5 is larger than the thickness of the portion covered with the external electrodes 4 and 5. If the thickness of the glass layer 3 disposed between the external electrodes 4 and 5 and the element body 2 is large, the electrical connectivity between the coil 15 and the external electrodes 4 and 5 may be reduced. In the laminated coil component 1, the thickness of the glass layer 3 covered with the external electrodes 4 and 5 is smaller than the thickness of the portion not covered with the external electrodes 4 and 5. Therefore, the connectivity between the internal conductor and the external electrodes 4 and 5 can be ensured. Therefore, in the laminated coil component 1, the connectivity between the internal conductor and the external electrodes 4, 5 is suppressed while suppressing the intrusion of the plating solution from the surfaces 2 a to 2 f of the element body 2 on which the external electrodes 4, 5 are arranged. Improvement can be achieved.

  In the multilayer coil component 1 according to the present embodiment, the external electrodes 4 and 5 are respectively provided with electrode portions 4a and 5a located on the end surfaces 2a and 2b and electrode portions located on the pair of main surfaces 2c and 2d, respectively. 4c, 5c, 4d, 5d, and electrode portions 4d, 5d, 4e, 5e positioned on the pair of side surfaces 2e, 2f, respectively. In the laminated coil component 1, the thickness of the glass layer 3 disposed between the end surfaces 2a, 2b and the electrode portions 4a, 5a is disposed between the main surfaces 2c, 2d and the electrode portions 4c, 5c, 4d, 5d. The thickness of the glass layer 3 and the thickness of the glass layer 3 disposed between the side surfaces 2e, 2f and the electrode portions 4d, 5d, 4e, 5e are smaller. The plating solution easily enters from the end portions of the external electrodes 4 and 5. In the laminated coil component 1, the thickness of the glass layer 3 disposed between the end surfaces 2a, 2b and the electrode portions 4a, 5a is set between the main surfaces 2c, 2d and the electrode portions 4c, 5c, 4d, 5d. The thickness of the glass layer 3 and the thickness of the glass layer 3 disposed between the side surfaces 2e, 2f and the electrode portions 4d, 5d, 4e, 5e are made smaller. That is, in the laminated coil component 1, the thickness of the glass layer 3 between the end portions of the external electrodes 4 and 5 and the element body 2 is relatively increased, so that the plating solution from the end portions of the external electrodes 4 and 5 is reduced. The connectivity between the coil conductors 16a and 16f and the external electrodes 4 and 5 can be improved while suppressing intrusion.

  In the multilayer coil component 1 according to the present embodiment, the external electrodes 4 and 5 include the baked electrode layers 7 and 10, the first plating layers 8 and 11, and the second plating layers 9 and 12. As described above, the multilayer coil component 1 can suppress the plating solution from entering the element body 2 in the process of forming the external electrodes 4 and 5 having the first plating layers 8 and 11 and the second plating layers 8 and 12. .

  As mentioned above, although embodiment of this invention has been described, this invention is not necessarily limited to embodiment mentioned above, A various change is possible in the range which does not deviate from the summary.

  In the said embodiment, the internal conductor was coil conductors 16a-16f and the electronic component was demonstrated to the laminated coil component 1 as an example. However, the electronic component may be a capacitor.

  In the above embodiment, the external electrodes 4 and 5 have been described as an example in which the external electrodes 4 and 5 include the electrode portions 4a and 4b, the electrode portions 4c, 5c, 4d, and 5d and the electrode portions 4d, 5d, 4e, and 5e. However, the shape of the external electrode is not limited to this. For example, the external electrode may be formed only on the end surface, or may be formed on at least one of the end surface, the main surface, and the side surface.

  DESCRIPTION OF SYMBOLS 1 ... Laminated coil component (electronic component), 2 ... Element body, 2a, 2b ... End surface, 2c, 2d ... Main surface, 2e, 2f ... Side surface, 3 ... Glass layer, 4, 5 ... External electrode, 4a, 4b ... Electrode part (first electrode part), 4c, 5c, 4d, 5d ... Electrode part (second electrode part), 4d, 5d, 4e, 5e ... Electrode part (third electrode part), 16a-16f ... Coil conductor ( Inner conductor).

Claims (2)

An element body formed by laminating a plurality of insulator layers and having a rectangular parallelepiped shape, and having a pair of end faces facing each other, a pair of main faces facing each other, and a pair of side faces facing each other ,
A plurality of internal conductors juxtaposed in the element body;
A glass layer disposed on the pair of end surfaces of the element body, the pair of main surfaces, and the pair of side surfaces;
A pair of external electrodes disposed on each of the pair of end face sides on the glass layer and electrically connected to the internal conductor;
The electronic component in which the thickness of the part which is not covered with a pair of said external electrode in the said glass layer is larger than the thickness of the part covered with a pair of said external electrode. Each of the pair of external electrodes includes a first electrode portion positioned on the end surface, a second electrode portion positioned on each of the pair of main surfaces, and a third electrode positioned on each of the pair of side surfaces. An electrode portion, and
The thickness of the glass layer disposed between the end surface and the first electrode portion is equal to the thickness of the glass layer disposed between the main surface and the second electrode portion, the side surface, and the third surface. The electronic component according to claim 1, wherein the electronic component is smaller than a thickness of the glass layer disposed between the electrode portions.

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