JPH06104139A - Ceramic chip part - Google Patents

Abstract

PURPOSE:To prevent the occurrence of cracks in a ceramic chip part or solder by forming a soldering lead by bending part of an electrode outwardly thereby giving spring characteristics to the electrode and absorbing mechanical stresses applied to jointed solder by the electrode having the spring characteristics. CONSTITUTION:In a ceramic chip part comprising a construction having a ceramic 1 and metal electrodes 6 covering both the ends of the ceramic 1, part of the electrode 6 is bent outwardly thereby forming a soldering lead 2. Then, if the temperature of an aluminum substrate 5 rises, the aluminum substrate 5 is deformed more than the ceramic chip part because the coefficient of linear expansion of the aluminum substrate 5 is higher than that of the ceramic chip part, so that mechanical stresses are applied to a solder part 3 which joints the ceramic chip part to the aluminum substrate 5 but the mechanical stresses can be absorbed by the deformation of the soldering lead 2, thereby preventing the occurrence of cracks in solder connecting the ceramic chip part to the aluminum substrate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic chip component used in various electronic devices.

[0002]

2. Description of the Related Art In recent years, ceramic chip parts having no lead have been widely used.

A conventional ceramic chip component will be described below with reference to FIG. In FIG. 2, 1 is a ceramic, 3 is a solder, 4 is a copper foil forming an electric circuit, 5 is an aluminum substrate, 6 is an electrode, and an electrode 6 is formed by the solder 3.
Is bonded to the copper foil 4 so as to cover.

[0004]

However, in the above-mentioned conventional structure, when the temperature of the aluminum substrate is repeatedly raised and lowered, the displacement of the aluminum substrate having a large linear expansion coefficient is Larger than a small ceramic chip component, mechanical stress is applied to the ceramic chip component and the solder that joins the ceramic chip component to the aluminum substrate, causing cracks 8 in the ceramic chip component or the boundary between the solder and the copper foil 4. There is a problem in that cracks 7 occur in the inner part of the wire, resulting in poor electrical conduction.

The present invention solves the above-mentioned conventional problems, and an object thereof is to provide a highly reliable ceramic chip component.

[0006]

To achieve this object, in the ceramic chip component of the present invention, a part of the electrode is bent outward to form a soldering lead so that the electrode has a spring property.

[0007]

According to the present invention, with the above-described structure, when a temperature stress such that the temperature of the aluminum substrate repeatedly rises and falls is applied, the aluminum substrate having a large linear expansion coefficient and the ceramic chip component having a small linear expansion coefficient are provided. Prevents generation of cracks in the ceramic chip parts or solder due to absorption of mechanical stress applied to the solder that joins the ceramic chip parts and the ceramic chip parts to the aluminum substrate due to the stress generated on the electrodes. can do.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG.

In FIG. 1, 1 is a ceramic and 2 is an electrode 6.
, A soldering lead formed by bending a part of the
3 is solder and 4 is copper foil forming an electric circuit.
Is joined to the copper foil 4. Reference numeral 5 is an aluminum substrate, and 6 is an electrode, which is mechanically and firmly connected to the ceramic 1.

The operation of the ceramic chip component of this embodiment having the above structure will be described below. First, when the temperature of the aluminum substrate rises, the aluminum substrate, which has a large linear expansion coefficient, has a larger displacement than the ceramic chip component, which has a small linear expansion coefficient. Although mechanical stress is applied, deformation of the soldering leads absorbs mechanical stress and prevents cracks from occurring in the ceramic chip components and the solder joining the ceramic chip components and the aluminum substrate. .

[0011]

As described above, according to the present invention, when a ceramic chip component is mounted on a substrate such as an aluminum substrate having a coefficient of linear expansion significantly different from that of ceramic, thermal stress is applied to the substrate to cause the ceramic chip component or the solder to be soldered. It is possible to solve the problem that the cracks are generated and the current flow becomes defective. Further, even when a bending stress is applied to the substrate, the soldering lead absorbs the stress and prevents the ceramic chip component from cracking.

[Brief description of drawings]

FIG. 1 is a diagram showing a joined state of a ceramic chip component and an aluminum substrate in an embodiment of the present invention.

FIG. 2 is a diagram showing a joined state of a conventional ceramic chip component and an aluminum substrate.

[Explanation of symbols]

 1 Ceramic 2 Soldering Lead 3 Solder 4 Copper Foil 5 Aluminum Substrate 6 Electrode 7 Solder Crack 8 Crack in Ceramic Chip Component

Claims (1)

[Claims] 1. A ceramic chip component having a structure in which a ceramic and a metal electrode are placed on both ends of the ceramic, wherein a part of the electrode is bent outward to form a soldering lead.