JP4235417B2 - Surface mount type electronic component and manufacturing method thereof - Google Patents

Surface mount type electronic component and manufacturing method thereof Download PDF

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Publication number
JP4235417B2
JP4235417B2 JP2002253308A JP2002253308A JP4235417B2 JP 4235417 B2 JP4235417 B2 JP 4235417B2 JP 2002253308 A JP2002253308 A JP 2002253308A JP 2002253308 A JP2002253308 A JP 2002253308A JP 4235417 B2 JP4235417 B2 JP 4235417B2
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Prior art keywords
electrode
plate portion
electronic component
electrode member
top plate
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JP2004095759A (en
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良人 河西
慎一郎 角館
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Okaya Electric Industry Co Ltd
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Okaya Electric Industry Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors

Description

【０００１】
【発明の属する技術分野】
この発明は、表面実装型電子部品及びその製造方法に係り、特に、樹脂製の外装体や折曲げ加工（フォーミング加工）されたリード端子が不要な表面実装型電子部品及びその製造方法に関する。
【０００２】
【従来の技術】
図６は、従来使用されている表面実装型電子部品の一例を示すものであり、この表面実装型電子部品70は、底面電極72及び上面電極74が形成された電子素子としてのダイオード76を、エポキシ樹脂等の樹脂材料より成る直方体形状の外装体78で被覆して成る。
上記底面電極72には第１のリード端子80の一端80ａが接続されると共に、該第１のリード端子80の他端80ｂは、上記外装体78の側面78ａを貫通して外部へ導出されており、導出された第１のリード端子80の他端80ｂは、外装体78の側面78ａ及び底面78ｂに沿って折曲げ加工（フォーミング加工）されている。
また、上面電極74には第２のリード端子82の一端82ａが接続されると共に、該第２のリード端子82の他端82ｂは、上記第１のリード端子80とは反対側の外装体側面78ａを貫通して外部へ導出されており、導出された第２のリード端子82の他端82ｂは、外装体78の側面78ａ及び底面78ｂに沿って折曲げ加工されている。
この結果、外装体78の底面78ｂに沿って折曲げ加工された第１のリード端子80及び第２のリード端子82の外面は略面一となされる。
尚、外装体78の底面78ｂに沿う第１のリード端子80及び第２のリード端子82の先端間は、離間されており絶縁性が確保されている。
【０００３】
上記表面実装型電子部品70にあっては、図６に示すように、外装体78の底面78ｂに沿って折曲げ加工された第１のリード端子80及び第２のリード端子82を回路基板84上に載置すると共に、ハンダ86を介して回路基板84へ接続することにより、回路基板84への表面実装を行うことができる。
【０００４】
上記従来の表面実装型電子部品70は、図７に示すように、先ず、ダイオード76の底面電極72及び上面電極74に、第１のリード端子80の一端80ａ及び第２のリード端子82の一端82ａをそれぞれ接続した後、図８に示すように、直方体形状の外装体78で上記ダイオード76、第１のリード端子80の一端80ａ及び第２のリード端子82の一端80ａを被覆し、その後、第１のリード端子80の他端80ｂ及び第２のリード端子82の他端82ｂを、外装体78の側面78ａ及び底面78ｂに沿って折曲げ加工することにより製造される。
【０００５】
【発明が解決しようとする課題】
上記従来の表面実装型電子部品70にあっては、直方体形状の外装体78の側面78ａ及び底面78ｂに沿って第１のリード端子80の他端80ｂ及び第２のリード端子82の他端82ｂを折曲げ加工することにより、外装体78の底面78ｂに沿う第１のリード端子80及び第２のリード端子82の外面を略面一と成し、以て、回路基板84への表面実装を可能にしていた。
【０００６】
このため、電子素子（ダイオード76）を樹脂製の外装体78で被覆する工程及び
第１のリード端子80及び第２のリード端子82を折曲げ加工する工程が不可欠であり、製造工程の煩雑化をもたらしていた。
また、折曲げ加工された第１のリード端子80及び第２のリード端子82の他端80ｂ，82ｂは、バネ性を生じるため変形し易く、実装時やメンテナンス時等に小さな外力が加えられただけで容易に変形して回路基板84から剥離することがあった。
さらに、従来の表面実装型電子部品70にあっては、樹脂製の外装体78によって、電子素子（ダイオード76）と、リード端子80，82の大部分が封止されているため、電子素子（ダイオード76）で生じた熱が外装体78内部に籠もってしまい、電子素子（ダイオード76）の熱劣化を生じる恐れがあった。
【０００７】
本発明は、上記した従来例の問題点に鑑みてなされたものであり、その目的とするところは、樹脂製の外装体や折曲げ加工（フォーミング加工）されたリード端子が不要な表面実装型電子部品及びその製造方法の実現にある。
【０００８】
【課題を解決するための手段】
上記の目的を達成するために、本発明の請求項１に記載の表面実装型電子部品は、底面電極及び上面電極が形成された電子素子と、天板部、該天板部の周縁から下方向に延設された側板部、該側板部の周縁から略水平方向に延設されたフランジ部を有する銅又はステンレスより成る電極部材とを備えた表面実装型電子部品であって、上記電極部材の天板部の内面と、上記電子素子の上面電極の外面とが、ハンダ材の内部に銅より成る芯材を有するハンダプリフォームを介して接続されると共に、上記電極部材のフランジ部の内面と、上記電子素子の底面電極の外面とが略面一且つ平坦面と成されていることを特徴とする。
【０００９】
本発明の表面実装型電子部品にあっては、電極部材のフランジ部の内面と電子素子の底面電極の外面とが、略面一且つ平坦面と成されていることから、電子素子の底面電極を下側にして回路基板上に載置すると、底面電極の外面が回路基板に接続されると共に、電極部材のフランジ部の内面も回路基板に接続されるため、ハンダ等を介して、電子素子の底面電極及び電極部材のフランジ部を回路基板へ接続固定することにより、回路基板への表面実装を実現することができる。
従って、本発明の表面実装型電子部品にあっては、従来の表面実装型電子部品70のように樹脂製の外装体78や、折曲げ加工（フォーミング加工）されたリード端子80，82が不要である。
【００１０】
また、上記電極部材が銅又はステンレスで構成されており、銅又はステンレスは熱伝導性が良好な導電材料であることから、電子素子の発熱を効率良く放熱できる。
さらに、ハンダ材の内部に銅より成る芯材を有するハンダプリフォームを介して、上記電極部材の天板部の内面と、上記電子素子の上面電極の外面とを接続しており、銅は熱伝導性が良好な材料であることから、電子素子の発熱が上記芯材を介して電極部材に速やかに伝わるため、放熱効果が高まる。
【００１１】
本発明に係る表面実装型電子部品の製造方法は、底面電極及び上面電極が形成された電子素子と、天板部、該天板部の周縁から下方向に延設された側板部、該側板部の周縁から略水平方向に延設されたフランジ部を有する銅又はステンレスより成る電極部材とを備え、上記電極部材の天板部の内面と、上記電子素子の上面電極の外面とが、ハンダ材の内部に銅より成る芯材を有するハンダプリフォームを介して接続されると共に、上記電極部材のフランジ部の内面と、上記電子素子の底面電極の外面とが略面一且つ平坦面と成されている請求項１に記載の表面実装型電子部品の製造方法であって、
上記電極部材と電子素子との接続前に、電極部材の天板部の内面、上記電子素子の上面電極の外面、及びハンダ材の内部に銅より成る芯材を有するハンダプリフォームを還元させた後、該ハンダプリフォームを介して、上記電極部材の天板部の内面と、上記電子素子の上面電極の外面とを接続することを特徴とする。
本発明の表面実装型電子部品の製造方法は、電極部材の天板部の内面と、電子素子の上面電極の外面とをハンダプリフォームを介して接続するだけで簡単に製造することができ、従来の表面実装型電子部品70のように電子素子（ダイオード76）を樹脂製の外装体78で被覆する工程及びリード端子80，82を折曲げ加工する工程が不要である。
また、電極部材と電子素子との接続前に、電極部材の天板部の内面、上記電子素子の上面電極の外面、及びハンダプリフォームを還元させておくことにより、ハンダ接続強度を向上させることができる。
【００１２】
【発明の実施の形態】
図１及び図２に示すように、本発明に係る表面実装型電子部品10は、底面電極12及び上面電極14が形成された電子素子としてのシリコンダイオード16と、上記上面電極14と接続されてシリコンダイオード16を覆う略キャップ状の電極部材18と、上記シリコンダイオード16のＰＮ接合の露出部16ａを被覆して保護する樹脂材20を有している。
上記底面電極12及び上面電極14は、金等の導電材料より成り、シリコンダイオード16の底面及び上面をメッキ、蒸着等することにより形成される。上記底面電極12及び上面電極14の外面12ａ，14ａは、それぞれ平坦面と成されている。
また、上記樹脂材20は、エポキシ樹脂やウレタン樹脂等で構成されている。
【００１３】
上記電極部材18は、上面電極14の外面14ａと接続される略水平方向に延設された矩形状の天板部22と、該天板部22の周縁から所定角度で下方向に延設された側板部24と、左右の側板部24の周縁から略水平方向に延設されたフランジ部26とを有している。尚、上記フランジ部26が延設されない前後の側板部24は、その下端が若干切り欠かれている。
上記天板部22の内面22ａは、平坦面と成されている。また、上記フランジ部26の内面26ａは、平坦面と成されていると共に、シリコンダイオード16の底面電極12の外面12ａと略面一と成されている。
上記電極部材18は、銅やステンレス等の熱伝導性が良好な導電材料によって構成されており、天板部22の内面22と、シリコンダイオード16の上面電極14の外面14ａとを接続した場合に、フランジ部26の内面26ａがシリコンダイオード16の底面電極12の外面12ａと略面一となるように、厚さ0.2mm〜0.3mmの金属板を所定形状・所定寸法にプレス加工して形成されるものである。
【００１４】
次に、図３乃至図５に基づき、本発明の表面実装型電子部品10の製造方法について説明する。
先ず、予め所定形状・所定寸法にプレス加工して形成された上記電極部材18を、シリコンダイオード16に被せ、電極部材18の天板部22の内面22ａと、シリコンダイオード16の上面電極14の外面14ａとを図示しないハンダを介して接続する（図３）。
この場合、電極部材18の天板部22の内面22ａ、シリコンダイオード16の上面電極14の外面14ａ及びハンダが酸化されているとハンダ接続強度が小さくなってしまう。そこで、電極部材18の天板部22とシリコンダイオード16の上面電極14とのハンダ接続強度を向上させるため、事前に、電極部材18、シリコンダイオード16及びハンダを、還元性ガス雰囲気中において約４５０℃の温度で加熱し、電極部材18の天板部22の内面22ａ、シリコンダイオード16の上面電極14の外面14ａ及びハンダを還元させ、その後、上記ハンダ接続作業を行う。
【００１５】
この場合、上記ハンダは、図４に示すように、Ｓｎ−Ｐｂ−Ａｇ（溶融温度３２０℃）等より成るハンダ材32の内部に、銅やコバール等の熱伝導性が良好な材料より成る芯材34を有する厚さが均一な薄板状のハンダプリフォーム36を好適に用いることができる。このハンダプリフォーム36は、厚さが均一な薄板状に成形されているため、電極部材18の天板部22とシリコンダイオード16の上面電極14とを略水平状態で接続することができる。
【００１６】
尚、上記ハンダとして、Ｓｎ−Ｐｂ、Ｓｎ−Ｐｂ−Ａｇより成り、溶融温度が３００〜３１５℃のクリームハンダを用い、大気中においてハンダ接続作業を行うようにしても良い。
【００１７】
次に、図５に示すように、シリコンダイオード16の底面電極12及び電極部材18のフランジ部26を上側に向けた状態で、キャップ状の電極部材18内に未硬化状態の樹脂材20を所定量注入した後硬化させて、シリコンダイオード16のＰＮ接合の露出部16ａを被覆することにより、本発明の表面実装型電子部品10が完成する。
【００１８】
上記本発明の表面実装型電子部品10にあっては、シリコンダイオード16の底面電極12の外面12ａ及び電極部材18のフランジ部26の内面26ａが、略面一且つ平坦面と成されていることから、図１に示すように、シリコンダイオード16の底面電極12を下側にして回路基板28上に載置すると、底面電極12の外面12ａが回路基板28に接続されると共に、上面電極14と接続されている電極部材18のフランジ部26の内面26ａも回路基板28に接続されることとなり、ハンダ30を介して底面電極12及びフランジ部26を回路基板28へ接続固定することにより、回路基板28への表面実装を実現することができる。
【００１９】
従って、本発明の表面実装型電子部品10にあっては、従来の表面実装型電子部品70のように樹脂製の外装体78や、折曲げ加工（フォーミング加工）されたリード端子80，82が不要であり、従来の表面実装型電子部品70の如く、リード端子80，82が変形して回路基板84から剥離したり、外装体78内部に籠もった熱による電子素子（ダイオード76）の劣化を生じることがない。
また、本発明の表面実装型電子部品10は、予め所定形状・所定寸法にプレス加工して形成された電極部材18の天板部22の内面22と、シリコンダイオード16の上面電極14の外面14ａとを接続するだけで簡単に製造することができ、従来の表面実装型電子部品70のように電子素子（ダイオード76）を樹脂製の外装体78で被覆する工程及びリード端子80，82を折曲げ加工する工程が不要である。
【００２０】
さらに、本発明の表面実装型電子部品10にあっては、電極部材18を銅やステンレス等の熱伝導性が良好な導電材料によって構成しているので、シリコンダイオード16の発熱を効率良く放熱できる。
尚、ハンダ材32の内部に熱伝導性が良好な材料より成る芯材34を有する上記ハンダプリフォーム36を用いて、電極部材18の天板部22の内面22ａと、シリコンダイオード16の上面電極14の外面14ａとを接続した場合には、シリコンダイオード16の発熱が上記芯材34を介して電極部材18に速やかに伝わるため、放熱効果が高い。
【００２１】
上記においては、電子素子としてシリコンダイオード16を例に挙げて説明したが、本発明はこれに限定されるものではなく、例えば、コンデンサ、サージ吸収素子、抵抗器等、他の電子素子についても適用可能である。
【００２２】
【発明の効果】
本発明の表面実装型電子部品にあっては、電極部材のフランジ部の内面と電子素子の底面電極の外面とが、略面一且つ平坦面と成されていることから、電子素子の底面電極を下側にして回路基板上に載置すると、底面電極の外面が回路基板に接続されると共に、電極部材のフランジ部の内面も回路基板に接続されるため、ハンダ等を介して、電子素子の底面電極及び電極部材のフランジ部を回路基板へ接続固定することにより、回路基板への表面実装を実現することができる。
従って、本発明の表面実装型電子部品にあっては、従来の表面実装型電子部品70のように樹脂製の外装体78や、折曲げ加工（フォーミング加工）されたリード端子80，82が不要である。
【図面の簡単な説明】
【図１】 本発明に係る表面実装型電子部品の概略断面図である。
【図２】 本発明に係る表面実装型電子部品の平面図である。
【図３】 本発明に係る表面実装型電子部品の製造方法を示す説明図である。
【図４】 ハンダプリフォームを示す説明図である。
【図５】 本発明に係る表面実装型電子部品の製造方法を示す説明図である。
【図６】 従来の表面実装型電子部品を示す概略断面図である。
【図７】 従来の表面実装型電子部品の製造方法を示す説明図である。
【図８】 従来の表面実装型電子部品の製造方法を示す説明図である。
【符号の説明】
10 表面実装型電子部品
12 底面電極
14 上面電極
16 シリコンダイオード
18 電極部材
20 樹脂材
22 電極部材の天板部
24 電極部材の側板部
26 電極部材のフランジ部
30 ハンダ
36 ハンダプリフォーム[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a surface-mount type electronic component and a method for manufacturing the same, and more particularly to a surface-mount type electronic component that does not require a resin-made exterior body or a bent (formed) lead terminal and a method for manufacturing the same.
[0002]
[Prior art]
FIG. 6 shows an example of a surface-mount type electronic component conventionally used. The surface-mount type electronic component 70 includes a diode 76 as an electronic element on which a bottom electrode 72 and a top electrode 74 are formed. It is covered with a rectangular parallelepiped exterior body 78 made of a resin material such as an epoxy resin.
One end 80a of the first lead terminal 80 is connected to the bottom electrode 72, and the other end 80b of the first lead terminal 80 penetrates the side surface 78a of the outer package 78 and is led out to the outside. The other end 80b of the first lead terminal 80 thus derived is bent along the side surface 78a and the bottom surface 78b of the exterior body 78 (forming process).
One end 82 a of the second lead terminal 82 is connected to the upper surface electrode 74, and the other end 82 b of the second lead terminal 82 is connected to the side of the outer package opposite to the first lead terminal 80. The other end 82b of the second lead terminal 82 led out through the 78a is bent along the side surface 78a and the bottom surface 78b of the exterior body 78.
As a result, the outer surfaces of the first lead terminal 80 and the second lead terminal 82 bent along the bottom surface 78b of the outer package 78 are substantially flush.
It should be noted that the leading ends of the first lead terminal 80 and the second lead terminal 82 along the bottom surface 78b of the outer package 78 are spaced apart to ensure insulation.
[0003]
In the surface mount electronic component 70, as shown in FIG. 6, the first lead terminal 80 and the second lead terminal 82 bent along the bottom surface 78b of the outer package 78 are connected to the circuit board 84. By mounting on the circuit board 84 and connecting to the circuit board 84 via the solder 86, surface mounting on the circuit board 84 can be performed.
[0004]
As shown in FIG. 7, the conventional surface-mount electronic component 70 first has a bottom electrode 72 and a top electrode 74 of a diode 76 on one end 80 a of a first lead terminal 80 and one end of a second lead terminal 82. After connecting the terminals 82a, as shown in FIG. 8, the diode 76, one end 80a of the first lead terminal 80 and one end 80a of the second lead terminal 82 are covered with a rectangular parallelepiped outer body 78, and then The other end 80b of the first lead terminal 80 and the other end 82b of the second lead terminal 82 are manufactured by bending along the side surface 78a and the bottom surface 78b of the exterior body 78.
[0005]
[Problems to be solved by the invention]
In the conventional surface mount electronic component 70, the other end 80b of the first lead terminal 80 and the other end 82b of the second lead terminal 82 are provided along the side surface 78a and the bottom surface 78b of the rectangular parallelepiped outer package 78. Is bent so that the outer surfaces of the first lead terminal 80 and the second lead terminal 82 along the bottom surface 78b of the exterior body 78 are substantially flush with each other. It was possible.
[0006]
For this reason, the process of covering the electronic element (diode 76) with the resin outer package 78 and the process of bending the first lead terminal 80 and the second lead terminal 82 are indispensable, and the manufacturing process is complicated. Had brought.
Also, the other ends 80b and 82b of the bent first lead terminal 80 and second lead terminal 82 are easily deformed due to their spring properties, and a small external force is applied during mounting or maintenance. It may be easily deformed and peeled off from the circuit board 84.
Further, in the conventional surface mount electronic component 70, since the electronic element (diode 76) and most of the lead terminals 80 and 82 are sealed by the resin exterior body 78, the electronic element ( The heat generated by the diode 76) may be trapped inside the outer package 78, which may cause thermal deterioration of the electronic element (diode 76).
[0007]
The present invention has been made in view of the above-described problems of the conventional example, and the object of the present invention is a surface-mount type that does not require a resin-made exterior body or a bent terminal (forming process). The realization of an electronic component and its manufacturing method.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, a surface-mounted electronic component according to claim 1 of the present invention includes an electronic element on which a bottom electrode and a top electrode are formed, a top plate portion, and a peripheral portion of the top plate portion. A surface mount type electronic component comprising: a side plate portion extending in a direction; and an electrode member made of copper or stainless steel having a flange portion extending in a substantially horizontal direction from a peripheral edge of the side plate portion, The inner surface of the top plate portion and the outer surface of the upper surface electrode of the electronic element are connected via a solder preform having a core material made of copper inside the solder material, and the inner surface of the flange portion of the electrode member And the outer surface of the bottom electrode of the electronic element is substantially flush and flat.
[0009]
In the surface mount type electronic component of the present invention, the inner surface of the flange portion of the electrode member and the outer surface of the bottom electrode of the electronic element are substantially flush and flat. Is placed on the circuit board, the outer surface of the bottom electrode is connected to the circuit board, and the inner surface of the flange portion of the electrode member is also connected to the circuit board. By mounting and fixing the bottom electrode and the flange portion of the electrode member to the circuit board, surface mounting on the circuit board can be realized.
Therefore, the surface-mount type electronic component of the present invention does not require the resin-made outer package 78 and the lead terminals 80 and 82 that are bent (formed) like the conventional surface-mount type electronic component 70. It is.
[0010]
In addition, the electrode member is made of copper or stainless steel, and copper or stainless steel is a conductive material having good thermal conductivity, so that heat of the electronic element can be efficiently radiated.
Furthermore, the inner surface of the top plate portion of the electrode member and the outer surface of the upper surface electrode of the electronic element are connected via a solder preform having a core material made of copper inside the solder material. Since the material has good conductivity, the heat generation of the electronic element is quickly transmitted to the electrode member through the core material, so that the heat dissipation effect is enhanced.
[0011]
A method for manufacturing a surface-mount type electronic component according to the present invention includes an electronic element having a bottom electrode and a top electrode formed thereon, a top plate portion, a side plate portion extending downward from a peripheral edge of the top plate portion, and the side plate. An electrode member made of copper or stainless steel having a flange portion extending in a substantially horizontal direction from the periphery of the portion, and the inner surface of the top plate portion of the electrode member and the outer surface of the upper surface electrode of the electronic element are soldered The inside of the material is connected via a solder preform having a core made of copper, and the inner surface of the flange portion of the electrode member and the outer surface of the bottom electrode of the electronic element are substantially flush with each other and a flat surface. A method of manufacturing a surface mount electronic component according to claim 1, wherein
Prior to the connection between the electrode member and the electronic element, the solder preform having a core made of copper in the inner surface of the top plate portion of the electrode member, the outer surface of the upper surface electrode of the electronic element, and the solder material was reduced. Then, the inner surface of the top plate portion of the electrode member and the outer surface of the upper surface electrode of the electronic element are connected via the solder preform.
The method of manufacturing the surface-mount type electronic component of the present invention can be easily manufactured by simply connecting the inner surface of the top plate portion of the electrode member and the outer surface of the upper surface electrode of the electronic element via a solder preform, There is no need for the step of covering the electronic element (diode 76) with the resin outer package 78 and the step of bending the lead terminals 80 and 82 as in the conventional surface mount electronic component 70.
In addition, before connecting the electrode member and the electronic element, the solder connection strength is improved by reducing the inner surface of the top plate portion of the electrode member, the outer surface of the upper surface electrode of the electronic element, and the solder preform. Can do.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
As shown in FIGS. 1 and 2, a surface mount electronic component 10 according to the present invention is connected to a silicon diode 16 as an electronic element on which a bottom electrode 12 and a top electrode 14 are formed, and the top electrode 14. A substantially cap-shaped electrode member 18 that covers the silicon diode 16 and a resin material 20 that covers and protects the exposed portion 16a of the PN junction of the silicon diode 16 are provided.
The bottom electrode 12 and the top electrode 14 are made of a conductive material such as gold, and are formed by plating, vapor deposition, or the like on the bottom and top surfaces of the silicon diode 16. The outer surfaces 12a and 14a of the bottom electrode 12 and the top electrode 14 are respectively flat surfaces.
The resin material 20 is made of an epoxy resin, a urethane resin, or the like.
[0013]
The electrode member 18 is connected to the outer surface 14a of the upper surface electrode 14 and extends in a substantially horizontal direction, and extends downward from the periphery of the top plate 22 at a predetermined angle. Side plate portions 24 and flange portions 26 extending from the peripheral edges of the left and right side plate portions 24 in a substantially horizontal direction. The front and rear side plate portions 24 where the flange portion 26 is not extended are slightly cut off at the lower ends.
The inner surface 22a of the top plate portion 22 is a flat surface. The inner surface 26a of the flange portion 26 is a flat surface and is substantially flush with the outer surface 12a of the bottom electrode 12 of the silicon diode 16.
The electrode member 18 is made of a conductive material having good thermal conductivity such as copper or stainless steel, and when the inner surface 22 of the top plate portion 22 and the outer surface 14a of the upper surface electrode 14 of the silicon diode 16 are connected. The metal plate having a thickness of 0.2 mm to 0.3 mm is pressed into a predetermined shape and a predetermined size so that the inner surface 26a of the flange portion 26 is substantially flush with the outer surface 12a of the bottom electrode 12 of the silicon diode 16. Is.
[0014]
Next, based on FIG. 3 thru | or FIG. 5, the manufacturing method of the surface mounted electronic component 10 of this invention is demonstrated.
First, the electrode member 18 formed by pressing into a predetermined shape and a predetermined dimension in advance is covered with a silicon diode 16, and the inner surface 22a of the top plate portion 22 of the electrode member 18 and the outer surface of the upper surface electrode 14 of the silicon diode 16 are covered. 14a is connected via solder (not shown) (FIG. 3).
In this case, if the inner surface 22a of the top plate portion 22 of the electrode member 18, the outer surface 14a of the upper surface electrode 14 of the silicon diode 16 and the solder are oxidized, the solder connection strength is reduced. Therefore, in order to improve the solder connection strength between the top plate portion 22 of the electrode member 18 and the upper surface electrode 14 of the silicon diode 16, the electrode member 18, the silicon diode 16 and the solder are preliminarily placed in a reducing gas atmosphere for about 450 times. The inner surface 22a of the top plate portion 22 of the electrode member 18, the outer surface 14a of the upper surface electrode 14 of the silicon diode 16 and the solder are reduced by heating at a temperature of 0 ° C., and then the solder connection operation is performed.
[0015]
In this case, as shown in FIG. 4, the solder is a core made of a material having good thermal conductivity such as copper or Kovar inside a solder material 32 made of Sn-Pb-Ag (melting temperature: 320 ° C.). A thin plate-like solder preform 36 having the material 34 and a uniform thickness can be suitably used. Since the solder preform 36 is formed in a thin plate shape having a uniform thickness, the top plate portion 22 of the electrode member 18 and the upper surface electrode 14 of the silicon diode 16 can be connected in a substantially horizontal state.
[0016]
The solder may be made of Sn-Pb, Sn-Pb-Ag, and cream solder having a melting temperature of 300 to 315 ° C., and solder connection work may be performed in the atmosphere.
[0017]
Next, as shown in FIG. 5, the uncured resin material 20 is placed in the cap-shaped electrode member 18 with the bottom electrode 12 of the silicon diode 16 and the flange portion 26 of the electrode member 18 facing upward. The surface-mount type electronic component 10 of the present invention is completed by covering the exposed portion 16a of the PN junction of the silicon diode 16 by injecting a fixed amount and then curing.
[0018]
In the surface mount electronic component 10 of the present invention, the outer surface 12a of the bottom electrode 12 of the silicon diode 16 and the inner surface 26a of the flange portion 26 of the electrode member 18 are substantially flush and flat. 1, when the bottom electrode 12 of the silicon diode 16 is placed on the circuit board 28 with the bottom electrode 12 facing down, the outer surface 12a of the bottom electrode 12 is connected to the circuit board 28, and the top electrode 14 and The inner surface 26a of the flange part 26 of the connected electrode member 18 is also connected to the circuit board 28. By connecting and fixing the bottom electrode 12 and the flange part 26 to the circuit board 28 via the solder 30, the circuit board Surface mounting to 28 can be realized.
[0019]
Therefore, in the surface mount electronic component 10 of the present invention, the resin exterior body 78 and the lead terminals 80 and 82 which are bent (formed) are formed like the conventional surface mount electronic component 70. Unnecessary, like the conventional surface mount electronic component 70, the lead terminals 80 and 82 are deformed and peeled off from the circuit board 84, or the electronic element (diode 76) is deteriorated by heat trapped inside the exterior body 78. Will not occur.
In addition, the surface-mount type electronic component 10 of the present invention includes an inner surface 22 of the top plate portion 22 of the electrode member 18 that is formed by pressing in advance into a predetermined shape and a predetermined dimension, and an outer surface 14a of the upper surface electrode 14 of the silicon diode 16. And connecting the electronic element (diode 76) with a resin outer body 78 and folding the lead terminals 80 and 82 as in the conventional surface mount electronic component 70. A bending process is not required.
[0020]
Furthermore, in the surface mount electronic component 10 of the present invention, since the electrode member 18 is made of a conductive material having good thermal conductivity such as copper or stainless steel, the heat generated by the silicon diode 16 can be efficiently radiated. .
Note that the inner surface 22a of the top plate portion 22 of the electrode member 18 and the upper surface electrode of the silicon diode 16 are formed by using the solder preform 36 having the core material 34 made of a material having good thermal conductivity inside the solder material 32. When the outer surface 14a of 14 is connected, the heat generation of the silicon diode 16 is quickly transmitted to the electrode member 18 through the core member 34, so that the heat dissipation effect is high.
[0021]
In the above description, the silicon diode 16 has been described as an example of the electronic element. However, the present invention is not limited to this, and may be applied to other electronic elements such as a capacitor, a surge absorbing element, and a resistor. Is possible.
[0022]
【The invention's effect】
In the surface mount type electronic component of the present invention, the inner surface of the flange portion of the electrode member and the outer surface of the bottom electrode of the electronic element are substantially flush and flat. Is placed on the circuit board, the outer surface of the bottom electrode is connected to the circuit board, and the inner surface of the flange portion of the electrode member is also connected to the circuit board. By mounting and fixing the bottom electrode and the flange portion of the electrode member to the circuit board, surface mounting on the circuit board can be realized.
Therefore, the surface-mount type electronic component of the present invention does not require the resin-made outer package 78 and the lead terminals 80 and 82 that are bent (formed) like the conventional surface-mount type electronic component 70. It is.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view of a surface mount electronic component according to the present invention.
FIG. 2 is a plan view of a surface mount electronic component according to the present invention.
FIG. 3 is an explanatory view showing a method for manufacturing a surface-mounted electronic component according to the present invention.
FIG. 4 is an explanatory view showing a solder preform.
FIG. 5 is an explanatory diagram showing a method for manufacturing a surface-mounted electronic component according to the present invention.
FIG. 6 is a schematic cross-sectional view showing a conventional surface mount electronic component.
FIG. 7 is an explanatory view showing a conventional method for manufacturing a surface-mounted electronic component.
FIG. 8 is an explanatory view showing a conventional method for manufacturing a surface-mounted electronic component.
[Explanation of symbols]
10 Surface mount electronic components
12 Bottom electrode
14 Top electrode
16 Silicon diode
18 Electrode member
20 Resin material
22 Top plate of electrode member
24 Side plate of electrode member
26 Flange of electrode member
30 Solder
36 Solder preform

Claims (2)

底面電極及び上面電極が形成された電子素子と、天板部、該天板部の周縁から下方向に延設された側板部、該側板部の周縁から略水平方向に延設されたフランジ部を有する銅又はステンレスより成る電極部材とを備えた表面実装型電子部品であって、上記電極部材の天板部の内面と、上記電子素子の上面電極の外面とが、ハンダ材の内部に銅より成る芯材を有するハンダプリフォームを介して接続されると共に、上記電極部材のフランジ部の内面と、上記電子素子の底面電極の外面とが略面一且つ平坦面と成されていることを特徴とする表面実装型電子部品。  An electronic device having a bottom electrode and a top electrode, a top plate portion, a side plate portion extending downward from the periphery of the top plate portion, and a flange portion extending substantially horizontally from the periphery of the side plate portion And an electrode member made of copper or stainless steel, wherein the inner surface of the top plate portion of the electrode member and the outer surface of the upper surface electrode of the electronic element are copper inside the solder material. The inner surface of the flange portion of the electrode member and the outer surface of the bottom electrode of the electronic element are substantially flush with each other and are connected via a solder preform having a core material made of the core member. A featured surface mount electronic component. 底面電極及び上面電極が形成された電子素子と、天板部、該天板部の周縁から下方向に延設された側板部、該側板部の周縁から略水平方向に延設されたフランジ部を有する銅又はステンレスより成る電極部材とを備え、上記電極部材の天板部の内面と、上記電子素子の上面電極の外面とが、ハンダ材の内部に銅より成る芯材を有するハンダプリフォームを介して接続されると共に、上記電極部材のフランジ部の内面と、上記電子素子の底面電極の外面とが略面一且つ平坦面と成されている請求項１に記載の表面実装型電子部品の製造方法であって、
上記電極部材と電子素子との接続前に、電極部材の天板部の内面、上記電子素子の上面電極の外面、及びハンダ材の内部に銅より成る芯材を有するハンダプリフォームを還元させた後、該ハンダプリフォームを介して、上記電極部材の天板部の内面と、上記電子素子の上面電極の外面とを接続することを特徴とする表面実装型電子部品の製造方法。 An electronic device having a bottom electrode and a top electrode, a top plate portion, a side plate portion extending downward from the periphery of the top plate portion, and a flange portion extending substantially horizontally from the periphery of the side plate portion A solder preform in which the inner surface of the top plate portion of the electrode member and the outer surface of the upper surface electrode of the electronic element have a core material made of copper inside the solder material 2. The surface-mount type electronic component according to claim 1, wherein an inner surface of the flange portion of the electrode member and an outer surface of the bottom electrode of the electronic element are substantially flush and flat. A manufacturing method of
Prior to the connection between the electrode member and the electronic element, the solder preform having a core made of copper in the inner surface of the top plate portion of the electrode member, the outer surface of the upper surface electrode of the electronic element, and the solder material was reduced. Then, the manufacturing method of the surface-mount type electronic component characterized by connecting the inner surface of the top plate portion of the electrode member and the outer surface of the upper surface electrode of the electronic element through the solder preform.
JP2002253308A 2002-08-30 2002-08-30 Surface mount type electronic component and manufacturing method thereof Expired - Fee Related JP4235417B2 (en)

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