DE60130717D1 - Leiterplatte mit Kontaktflächen zur Verbindung mit einem darauf montierten elektronischen Bauteil - Google Patents

Leiterplatte mit Kontaktflächen zur Verbindung mit einem darauf montierten elektronischen Bauteil

Info

Publication number
DE60130717D1
DE60130717D1 DE60130717T DE60130717T DE60130717D1 DE 60130717 D1 DE60130717 D1 DE 60130717D1 DE 60130717 T DE60130717 T DE 60130717T DE 60130717 T DE60130717 T DE 60130717T DE 60130717 D1 DE60130717 D1 DE 60130717D1
Authority
DE
Germany
Prior art keywords
connection
circuit board
electronic component
contact surfaces
component mounted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60130717T
Other languages
English (en)
Other versions
DE60130717T2 (de
Inventor
Takanori Unou
Hiroyuki Kawata
Kimio Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Application granted granted Critical
Publication of DE60130717D1 publication Critical patent/DE60130717D1/de
Publication of DE60130717T2 publication Critical patent/DE60130717T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE60130717T 2000-08-10 2001-08-03 Leiterplatte mit Kontaktflächen zur Verbindung mit einem darauf montierten elektronischen Bauteil Expired - Lifetime DE60130717T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000243282 2000-08-10
JP2000243282A JP3514221B2 (ja) 2000-08-10 2000-08-10 プリント配線基板

Publications (2)

Publication Number Publication Date
DE60130717D1 true DE60130717D1 (de) 2007-11-15
DE60130717T2 DE60130717T2 (de) 2008-07-17

Family

ID=18734158

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60130717T Expired - Lifetime DE60130717T2 (de) 2000-08-10 2001-08-03 Leiterplatte mit Kontaktflächen zur Verbindung mit einem darauf montierten elektronischen Bauteil

Country Status (4)

Country Link
US (1) US6582238B2 (de)
EP (1) EP1179971B1 (de)
JP (1) JP3514221B2 (de)
DE (1) DE60130717T2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6793500B1 (en) * 2003-09-18 2004-09-21 International Business Machines Corporation Radial contact pad footprint and wiring for electrical components
JP4707095B2 (ja) 2005-05-09 2011-06-22 ルネサスエレクトロニクス株式会社 半導体回路
JP5084153B2 (ja) * 2005-08-15 2012-11-28 キヤノン株式会社 プリント基板
US8063480B2 (en) 2006-02-28 2011-11-22 Canon Kabushiki Kaisha Printed board and semiconductor integrated circuit
DE102007032092A1 (de) 2006-11-27 2008-05-29 Conti Temic Microelectronic Gmbh Schaltungsanordnung zur Energieversorgung eines integrierten Schaltkreises
JP2009004689A (ja) * 2007-06-25 2009-01-08 Mitsubishi Electric Corp プリント配線基板
WO2010095006A1 (en) * 2009-02-23 2010-08-26 Freescale Semiconductor, Inc. Package assembly and method of tuning a natural resonant frequency of a package
US9014085B2 (en) * 2011-11-28 2015-04-21 At&T Intellectual Property I, L.P. Internet protocol session persistence for mobile communications

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63142894A (ja) * 1986-12-06 1988-06-15 株式会社東芝 フラツトパツケ−ジ集積回路の配線基板
FR2620587B1 (fr) * 1987-09-16 1993-07-02 Telemecanique Electrique Circuit imprime equipe d'un drain thermique
US4880386A (en) * 1988-11-18 1989-11-14 Amp Incorporated Socketing a semiconductor device
US5138429A (en) * 1990-08-30 1992-08-11 Hewlett-Packard Company Precisely aligned lead frame using registration traces and pads
US5131852A (en) * 1991-08-23 1992-07-21 Amp Incorporated Electrical socket
JPH0745936A (ja) * 1993-07-31 1995-02-14 Nippon Seiki Co Ltd プリント配線基板
JPH07142673A (ja) * 1993-11-15 1995-06-02 Matsushita Electric Ind Co Ltd 集積回路装置
JPH08288626A (ja) * 1995-04-19 1996-11-01 Canon Inc Ｉｃ及びプリント配線基板
JP3231225B2 (ja) * 1995-09-18 2001-11-19 アルプス電気株式会社 プリント配線基板
US5777853A (en) * 1996-05-03 1998-07-07 Ast Research, Inc. Printed circuit board having a dual square pattern footprints for receiving one of two electronic components having equal printouts per size
JPH10223997A (ja) 1997-02-12 1998-08-21 Canon Inc プリント配線基板

Also Published As

Publication number Publication date
JP2002057418A (ja) 2002-02-22
US6582238B2 (en) 2003-06-24
EP1179971A2 (de) 2002-02-13
JP3514221B2 (ja) 2004-03-31
DE60130717T2 (de) 2008-07-17
US20020019155A1 (en) 2002-02-14
EP1179971A3 (de) 2005-12-07
EP1179971B1 (de) 2007-10-03

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Legal Events

Date Code Title Description
8320 Willingness to grant licences declared (paragraph 23)
8364 No opposition during term of opposition