JP2007123606A - 電気機器の冷却構造 - Google Patents

電気機器の冷却構造 Download PDF

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Publication number
JP2007123606A
JP2007123606A JP2005314756A JP2005314756A JP2007123606A JP 2007123606 A JP2007123606 A JP 2007123606A JP 2005314756 A JP2005314756 A JP 2005314756A JP 2005314756 A JP2005314756 A JP 2005314756A JP 2007123606 A JP2007123606 A JP 2007123606A
Authority
JP
Japan
Prior art keywords
cooling medium
cooling
passages
electric device
flow rate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005314756A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007123606A5 (enrdf_load_stackoverflow
Inventor
Takeshi Asakura
健 朝倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Priority to JP2005314756A priority Critical patent/JP2007123606A/ja
Priority to DE112006002840T priority patent/DE112006002840T5/de
Priority to CN200680040152.8A priority patent/CN101297400A/zh
Priority to PCT/JP2006/321933 priority patent/WO2007049809A1/ja
Priority to US12/091,923 priority patent/US20090114371A1/en
Publication of JP2007123606A publication Critical patent/JP2007123606A/ja
Publication of JP2007123606A5 publication Critical patent/JP2007123606A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)
  • Electric Propulsion And Braking For Vehicles (AREA)
  • Transformer Cooling (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2005314756A 2005-10-28 2005-10-28 電気機器の冷却構造 Pending JP2007123606A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005314756A JP2007123606A (ja) 2005-10-28 2005-10-28 電気機器の冷却構造
DE112006002840T DE112006002840T5 (de) 2005-10-28 2006-10-26 Kühlstruktur für eine elektrische Vorrichtung
CN200680040152.8A CN101297400A (zh) 2005-10-28 2006-10-26 用于电气器件的冷却结构
PCT/JP2006/321933 WO2007049809A1 (ja) 2005-10-28 2006-10-26 電気機器の冷却構造
US12/091,923 US20090114371A1 (en) 2005-10-28 2006-10-26 Cooling structure for electric device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005314756A JP2007123606A (ja) 2005-10-28 2005-10-28 電気機器の冷却構造

Publications (2)

Publication Number Publication Date
JP2007123606A true JP2007123606A (ja) 2007-05-17
JP2007123606A5 JP2007123606A5 (enrdf_load_stackoverflow) 2008-01-31

Family

ID=37967910

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005314756A Pending JP2007123606A (ja) 2005-10-28 2005-10-28 電気機器の冷却構造

Country Status (5)

Country Link
US (1) US20090114371A1 (enrdf_load_stackoverflow)
JP (1) JP2007123606A (enrdf_load_stackoverflow)
CN (1) CN101297400A (enrdf_load_stackoverflow)
DE (1) DE112006002840T5 (enrdf_load_stackoverflow)
WO (1) WO2007049809A1 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012146759A (ja) * 2011-01-10 2012-08-02 Toyota Motor Corp 冷却器及びそれを用いた電力変換装置
JP2013255414A (ja) * 2012-05-09 2013-12-19 Yaskawa Electric Corp インバータ装置
JP2014135457A (ja) * 2013-01-11 2014-07-24 Honda Motor Co Ltd 半導体モジュール用冷却器及び半導体モジュール

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5664878B2 (ja) * 2012-11-05 2015-02-04 三菱自動車工業株式会社 インバータの冷却構造
DE102013004337A1 (de) * 2013-03-14 2014-09-18 Wilo Se Elektromotor mit leistungselektronischem Umrichtersystem und daraus gespeister aktiver Kühleinrichtung
CN111525819B (zh) * 2020-03-31 2021-07-09 华为技术有限公司 一种逆变器、逆变器与变压器的互连系统和箱式变电站

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60254798A (ja) * 1984-05-31 1985-12-16 富士通株式会社 冷却器
US5504378A (en) 1994-06-10 1996-04-02 Westinghouse Electric Corp. Direct cooled switching module for electric vehicle propulsion system
DE19514545A1 (de) * 1995-04-20 1996-10-24 Daimler Benz Ag Anordnung von mehreren mit elektronischen Bauelementen versehenen Mikrokühleinrichtungen
DE19643717A1 (de) * 1996-10-23 1998-04-30 Asea Brown Boveri Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul
JP2001352025A (ja) * 2000-06-05 2001-12-21 Toshiba Corp 発熱体冷却装置
JP3915609B2 (ja) 2002-06-24 2007-05-16 株式会社デンソー 発熱体冷却器
JP2004295718A (ja) * 2003-03-28 2004-10-21 Hitachi Ltd 情報処理装置の液例システム
JP4023416B2 (ja) 2003-08-19 2007-12-19 株式会社デンソー 冷却器

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012146759A (ja) * 2011-01-10 2012-08-02 Toyota Motor Corp 冷却器及びそれを用いた電力変換装置
JP2013255414A (ja) * 2012-05-09 2013-12-19 Yaskawa Electric Corp インバータ装置
KR101475602B1 (ko) * 2012-05-09 2014-12-22 가부시키가이샤 야스카와덴키 전력 변환 장치
JP2014135457A (ja) * 2013-01-11 2014-07-24 Honda Motor Co Ltd 半導体モジュール用冷却器及び半導体モジュール

Also Published As

Publication number Publication date
DE112006002840T5 (de) 2008-10-02
US20090114371A1 (en) 2009-05-07
CN101297400A (zh) 2008-10-29
WO2007049809A1 (ja) 2007-05-03

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