DE112006002840T5 - Kühlstruktur für eine elektrische Vorrichtung - Google Patents

Kühlstruktur für eine elektrische Vorrichtung Download PDF

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Publication number
DE112006002840T5
DE112006002840T5 DE112006002840T DE112006002840T DE112006002840T5 DE 112006002840 T5 DE112006002840 T5 DE 112006002840T5 DE 112006002840 T DE112006002840 T DE 112006002840T DE 112006002840 T DE112006002840 T DE 112006002840T DE 112006002840 T5 DE112006002840 T5 DE 112006002840T5
Authority
DE
Germany
Prior art keywords
coolant
inlet
cooling structure
electrical device
paths
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112006002840T
Other languages
German (de)
English (en)
Inventor
Ken Asakura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Publication of DE112006002840T5 publication Critical patent/DE112006002840T5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)
  • Electric Propulsion And Braking For Vehicles (AREA)
  • Transformer Cooling (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE112006002840T 2005-10-28 2006-10-26 Kühlstruktur für eine elektrische Vorrichtung Withdrawn DE112006002840T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005-314756 2005-10-28
JP2005314756A JP2007123606A (ja) 2005-10-28 2005-10-28 電気機器の冷却構造
PCT/JP2006/321933 WO2007049809A1 (ja) 2005-10-28 2006-10-26 電気機器の冷却構造

Publications (1)

Publication Number Publication Date
DE112006002840T5 true DE112006002840T5 (de) 2008-10-02

Family

ID=37967910

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112006002840T Withdrawn DE112006002840T5 (de) 2005-10-28 2006-10-26 Kühlstruktur für eine elektrische Vorrichtung

Country Status (5)

Country Link
US (1) US20090114371A1 (enrdf_load_stackoverflow)
JP (1) JP2007123606A (enrdf_load_stackoverflow)
CN (1) CN101297400A (enrdf_load_stackoverflow)
DE (1) DE112006002840T5 (enrdf_load_stackoverflow)
WO (1) WO2007049809A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013004337A1 (de) * 2013-03-14 2014-09-18 Wilo Se Elektromotor mit leistungselektronischem Umrichtersystem und daraus gespeister aktiver Kühleinrichtung

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5655575B2 (ja) * 2011-01-10 2015-01-21 トヨタ自動車株式会社 冷却器及びそれを用いた電力変換装置
JP5655873B2 (ja) * 2012-05-09 2015-01-21 株式会社安川電機 インバータ装置
JP5664878B2 (ja) * 2012-11-05 2015-02-04 三菱自動車工業株式会社 インバータの冷却構造
JP6093186B2 (ja) * 2013-01-11 2017-03-08 本田技研工業株式会社 半導体モジュール用冷却器
CN111525819B (zh) * 2020-03-31 2021-07-09 华为技术有限公司 一种逆变器、逆变器与变压器的互连系统和箱式变电站

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5504378A (en) 1994-06-10 1996-04-02 Westinghouse Electric Corp. Direct cooled switching module for electric vehicle propulsion system
JP2004028403A (ja) 2002-06-24 2004-01-29 Denso Corp 発熱体冷却器
JP2005064382A (ja) 2003-08-19 2005-03-10 Denso Corp 冷却器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60254798A (ja) * 1984-05-31 1985-12-16 富士通株式会社 冷却器
DE19514545A1 (de) * 1995-04-20 1996-10-24 Daimler Benz Ag Anordnung von mehreren mit elektronischen Bauelementen versehenen Mikrokühleinrichtungen
DE19643717A1 (de) * 1996-10-23 1998-04-30 Asea Brown Boveri Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul
JP2001352025A (ja) * 2000-06-05 2001-12-21 Toshiba Corp 発熱体冷却装置
JP2004295718A (ja) * 2003-03-28 2004-10-21 Hitachi Ltd 情報処理装置の液例システム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5504378A (en) 1994-06-10 1996-04-02 Westinghouse Electric Corp. Direct cooled switching module for electric vehicle propulsion system
JP2004028403A (ja) 2002-06-24 2004-01-29 Denso Corp 発熱体冷却器
JP2005064382A (ja) 2003-08-19 2005-03-10 Denso Corp 冷却器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013004337A1 (de) * 2013-03-14 2014-09-18 Wilo Se Elektromotor mit leistungselektronischem Umrichtersystem und daraus gespeister aktiver Kühleinrichtung

Also Published As

Publication number Publication date
US20090114371A1 (en) 2009-05-07
CN101297400A (zh) 2008-10-29
JP2007123606A (ja) 2007-05-17
WO2007049809A1 (ja) 2007-05-03

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OP8 Request for examination as to paragraph 44 patent law
8139 Disposal/non-payment of the annual fee