JP2007109967A - 半導体処理装置 - Google Patents

半導体処理装置 Download PDF

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Publication number
JP2007109967A
JP2007109967A JP2005300637A JP2005300637A JP2007109967A JP 2007109967 A JP2007109967 A JP 2007109967A JP 2005300637 A JP2005300637 A JP 2005300637A JP 2005300637 A JP2005300637 A JP 2005300637A JP 2007109967 A JP2007109967 A JP 2007109967A
Authority
JP
Japan
Prior art keywords
authority
semiconductor processing
display
operator
screen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005300637A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007109967A5 (https=
Inventor
Takahito Matsuzawa
貴仁 松沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2005300637A priority Critical patent/JP2007109967A/ja
Priority to US12/089,309 priority patent/US20090037699A1/en
Priority to PCT/JP2006/320454 priority patent/WO2007043646A1/ja
Priority to CNA2006800382029A priority patent/CN101288153A/zh
Priority to KR1020087008352A priority patent/KR20080053365A/ko
Publication of JP2007109967A publication Critical patent/JP2007109967A/ja
Publication of JP2007109967A5 publication Critical patent/JP2007109967A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0618—Apparatus for monitoring, sorting, marking, testing or measuring using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Storage Device Security (AREA)
JP2005300637A 2005-10-14 2005-10-14 半導体処理装置 Withdrawn JP2007109967A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005300637A JP2007109967A (ja) 2005-10-14 2005-10-14 半導体処理装置
US12/089,309 US20090037699A1 (en) 2005-10-14 2006-10-13 Apparatus and method for processing semiconductor
PCT/JP2006/320454 WO2007043646A1 (ja) 2005-10-14 2006-10-13 半導体処理装置、および方法
CNA2006800382029A CN101288153A (zh) 2005-10-14 2006-10-13 半导体处理装置以及方法
KR1020087008352A KR20080053365A (ko) 2005-10-14 2006-10-13 반도체 처리 장치 및 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005300637A JP2007109967A (ja) 2005-10-14 2005-10-14 半導体処理装置

Publications (2)

Publication Number Publication Date
JP2007109967A true JP2007109967A (ja) 2007-04-26
JP2007109967A5 JP2007109967A5 (https=) 2008-09-18

Family

ID=37942867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005300637A Withdrawn JP2007109967A (ja) 2005-10-14 2005-10-14 半導体処理装置

Country Status (5)

Country Link
US (1) US20090037699A1 (https=)
JP (1) JP2007109967A (https=)
KR (1) KR20080053365A (https=)
CN (1) CN101288153A (https=)
WO (1) WO2007043646A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011021984A (ja) * 2009-07-15 2011-02-03 Micronics Japan Co Ltd 検査システム
JP2013153216A (ja) * 2008-03-18 2013-08-08 Hitachi Kokusai Electric Inc 基板処理装置及びその制御方法並びにプログラム
US8806370B2 (en) 2006-10-04 2014-08-12 Hitachi Kokusai Electric Inc. Substrate processing apparatus

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4737472B2 (ja) * 2009-10-26 2011-08-03 シャープ株式会社 製品の製造方法、および製造システム
US8173451B1 (en) * 2011-02-16 2012-05-08 Tokyo Electron Limited Etch stage measurement system
US9281251B2 (en) 2013-08-09 2016-03-08 Tokyo Electron Limited Substrate backside texturing
CN108140556B (zh) 2015-08-22 2022-07-26 东京毅力科创株式会社 基片背侧纹理化
JP6934407B2 (ja) * 2017-11-27 2021-09-15 株式会社ディスコ 加工装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08227835A (ja) * 1995-02-20 1996-09-03 Tokyo Electron Ltd 半導体製造装置の操作システム、液晶ディスプレイ基板製造装置の操作システム、制御装置の操作システム及び制御装置の操作方法
PT932398E (pt) * 1996-06-28 2006-09-29 Ortho Mcneil Pharm Inc Utilizacao do topiramento ou dos seus derivados para a producao de um medicamento para o tratamento de disturbios bipolares maniaco- depressivos
JPH1195878A (ja) * 1997-09-25 1999-04-09 Casio Comput Co Ltd データ処理装置、ネットワークシステム、及び記録媒体
US6198996B1 (en) * 1999-01-28 2001-03-06 International Business Machines Corporation Method and apparatus for setting automotive performance tuned preferences set differently by a driver
US6615123B2 (en) * 2000-12-01 2003-09-02 Hewlett-Packard Development Company, L.P. Personality module for configuring a vehicle
US6998956B2 (en) * 2000-12-28 2006-02-14 Cnh America Llc Access control system for a work vehicle

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8806370B2 (en) 2006-10-04 2014-08-12 Hitachi Kokusai Electric Inc. Substrate processing apparatus
JP2013153216A (ja) * 2008-03-18 2013-08-08 Hitachi Kokusai Electric Inc 基板処理装置及びその制御方法並びにプログラム
JP2011021984A (ja) * 2009-07-15 2011-02-03 Micronics Japan Co Ltd 検査システム

Also Published As

Publication number Publication date
WO2007043646A1 (ja) 2007-04-19
CN101288153A (zh) 2008-10-15
US20090037699A1 (en) 2009-02-05
KR20080053365A (ko) 2008-06-12

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