KR20080053365A - 반도체 처리 장치 및 방법 - Google Patents

반도체 처리 장치 및 방법 Download PDF

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Publication number
KR20080053365A
KR20080053365A KR1020087008352A KR20087008352A KR20080053365A KR 20080053365 A KR20080053365 A KR 20080053365A KR 1020087008352 A KR1020087008352 A KR 1020087008352A KR 20087008352 A KR20087008352 A KR 20087008352A KR 20080053365 A KR20080053365 A KR 20080053365A
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KR
South Korea
Prior art keywords
authority
display
unit
operator
screen
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020087008352A
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English (en)
Korean (ko)
Inventor
다카히토 마츠자와
Original Assignee
도쿄엘렉트론가부시키가이샤
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Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20080053365A publication Critical patent/KR20080053365A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0618—Apparatus for monitoring, sorting, marking, testing or measuring using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Storage Device Security (AREA)
KR1020087008352A 2005-10-14 2006-10-13 반도체 처리 장치 및 방법 Ceased KR20080053365A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00300637 2005-10-14
JP2005300637A JP2007109967A (ja) 2005-10-14 2005-10-14 半導体処理装置

Publications (1)

Publication Number Publication Date
KR20080053365A true KR20080053365A (ko) 2008-06-12

Family

ID=37942867

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087008352A Ceased KR20080053365A (ko) 2005-10-14 2006-10-13 반도체 처리 장치 및 방법

Country Status (5)

Country Link
US (1) US20090037699A1 (https=)
JP (1) JP2007109967A (https=)
KR (1) KR20080053365A (https=)
CN (1) CN101288153A (https=)
WO (1) WO2007043646A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190062191A (ko) * 2017-11-27 2019-06-05 가부시기가이샤 디스코 가공 장치

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5224744B2 (ja) 2006-10-04 2013-07-03 株式会社日立国際電気 基板処理装置
JP5281037B2 (ja) * 2008-03-18 2013-09-04 株式会社日立国際電気 基板処理システム、基板処理システムの表示方法及びそのプログラム
JP5367484B2 (ja) * 2009-07-15 2013-12-11 株式会社日本マイクロニクス 検査システム
JP4737472B2 (ja) * 2009-10-26 2011-08-03 シャープ株式会社 製品の製造方法、および製造システム
US8173451B1 (en) * 2011-02-16 2012-05-08 Tokyo Electron Limited Etch stage measurement system
US9281251B2 (en) 2013-08-09 2016-03-08 Tokyo Electron Limited Substrate backside texturing
CN108140556B (zh) 2015-08-22 2022-07-26 东京毅力科创株式会社 基片背侧纹理化

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08227835A (ja) * 1995-02-20 1996-09-03 Tokyo Electron Ltd 半導体製造装置の操作システム、液晶ディスプレイ基板製造装置の操作システム、制御装置の操作システム及び制御装置の操作方法
PT932398E (pt) * 1996-06-28 2006-09-29 Ortho Mcneil Pharm Inc Utilizacao do topiramento ou dos seus derivados para a producao de um medicamento para o tratamento de disturbios bipolares maniaco- depressivos
JPH1195878A (ja) * 1997-09-25 1999-04-09 Casio Comput Co Ltd データ処理装置、ネットワークシステム、及び記録媒体
US6198996B1 (en) * 1999-01-28 2001-03-06 International Business Machines Corporation Method and apparatus for setting automotive performance tuned preferences set differently by a driver
US6615123B2 (en) * 2000-12-01 2003-09-02 Hewlett-Packard Development Company, L.P. Personality module for configuring a vehicle
US6998956B2 (en) * 2000-12-28 2006-02-14 Cnh America Llc Access control system for a work vehicle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190062191A (ko) * 2017-11-27 2019-06-05 가부시기가이샤 디스코 가공 장치

Also Published As

Publication number Publication date
WO2007043646A1 (ja) 2007-04-19
CN101288153A (zh) 2008-10-15
US20090037699A1 (en) 2009-02-05
JP2007109967A (ja) 2007-04-26

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