JP2007095879A - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP2007095879A
JP2007095879A JP2005281426A JP2005281426A JP2007095879A JP 2007095879 A JP2007095879 A JP 2007095879A JP 2005281426 A JP2005281426 A JP 2005281426A JP 2005281426 A JP2005281426 A JP 2005281426A JP 2007095879 A JP2007095879 A JP 2007095879A
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JP
Japan
Prior art keywords
nitrogen gas
boat
path
chamber
standby chamber
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Pending
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JP2005281426A
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English (en)
Japanese (ja)
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JP2007095879A5 (enExample
Inventor
Shigeo Nakada
茂夫 中田
Yukito Haneda
幸人 羽田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Denki Electric Inc
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Hitachi Kokusai Electric Inc
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Application filed by Hitachi Kokusai Electric Inc filed Critical Hitachi Kokusai Electric Inc
Priority to JP2005281426A priority Critical patent/JP2007095879A/ja
Publication of JP2007095879A publication Critical patent/JP2007095879A/ja
Publication of JP2007095879A5 publication Critical patent/JP2007095879A5/ja
Pending legal-status Critical Current

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JP2005281426A 2005-09-28 2005-09-28 基板処理装置 Pending JP2007095879A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005281426A JP2007095879A (ja) 2005-09-28 2005-09-28 基板処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005281426A JP2007095879A (ja) 2005-09-28 2005-09-28 基板処理装置

Publications (2)

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JP2007095879A true JP2007095879A (ja) 2007-04-12
JP2007095879A5 JP2007095879A5 (enExample) 2008-10-23

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JP2005281426A Pending JP2007095879A (ja) 2005-09-28 2005-09-28 基板処理装置

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009065113A (ja) * 2007-08-14 2009-03-26 Hitachi Kokusai Electric Inc 基板処理装置
JP2012094805A (ja) * 2010-06-14 2012-05-17 Hitachi Kokusai Electric Inc 基板処理装置
US8443484B2 (en) 2007-08-14 2013-05-21 Hitachi Kokusai Electric Inc. Substrate processing apparatus
JP2014067979A (ja) * 2012-09-27 2014-04-17 Hitachi Kokusai Electric Inc 基板処理装置、基板処理方法及び半導体装置の製造方法
JP2018206874A (ja) * 2017-05-31 2018-12-27 Tdk株式会社 Ｅｆｅｍ及びｅｆｅｍへの乾燥空気の導入方法
KR20190035523A (ko) 2017-09-26 2019-04-03 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 반도체 장치의 제조 방법, 및 프로그램
KR20210078679A (ko) * 2019-12-19 2021-06-29 주식회사 원익아이피에스 기판처리장치
US11521880B2 (en) 2018-07-27 2022-12-06 Kokusai Electric Corporation Substrate processing apparatus and recording medium for changing atmosphere of transfer chamber

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06177054A (ja) * 1992-12-01 1994-06-24 Shinko Electric Co Ltd 縦型半導体製造装置における主室のガス置換方法、及びその装置
JPH06177066A (ja) * 1992-12-04 1994-06-24 Tokyo Electron Ltd 処理装置
JPH06224144A (ja) * 1993-01-21 1994-08-12 Tokyo Electron Tohoku Ltd 処理装置
JPH07161656A (ja) * 1993-12-10 1995-06-23 Tokyo Electron Ltd 熱処理装置
JP2002299262A (ja) * 2001-03-30 2002-10-11 Tokyo Electron Ltd ロードロック室及びその排気方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06177054A (ja) * 1992-12-01 1994-06-24 Shinko Electric Co Ltd 縦型半導体製造装置における主室のガス置換方法、及びその装置
JPH06177066A (ja) * 1992-12-04 1994-06-24 Tokyo Electron Ltd 処理装置
JPH06224144A (ja) * 1993-01-21 1994-08-12 Tokyo Electron Tohoku Ltd 処理装置
JPH07161656A (ja) * 1993-12-10 1995-06-23 Tokyo Electron Ltd 熱処理装置
JP2002299262A (ja) * 2001-03-30 2002-10-11 Tokyo Electron Ltd ロードロック室及びその排気方法

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101051027B1 (ko) * 2007-08-14 2011-07-21 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치
US8443484B2 (en) 2007-08-14 2013-05-21 Hitachi Kokusai Electric Inc. Substrate processing apparatus
JP2009065113A (ja) * 2007-08-14 2009-03-26 Hitachi Kokusai Electric Inc 基板処理装置
US9698037B2 (en) 2010-06-14 2017-07-04 Hitachi Kokusai Electric Inc. Substrate processing apparatus
JP2012094805A (ja) * 2010-06-14 2012-05-17 Hitachi Kokusai Electric Inc 基板処理装置
KR101295436B1 (ko) 2010-06-14 2013-08-09 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치
KR101295459B1 (ko) * 2010-06-14 2013-08-09 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치
JP2014067979A (ja) * 2012-09-27 2014-04-17 Hitachi Kokusai Electric Inc 基板処理装置、基板処理方法及び半導体装置の製造方法
JP2018206874A (ja) * 2017-05-31 2018-12-27 Tdk株式会社 Ｅｆｅｍ及びｅｆｅｍへの乾燥空気の導入方法
JP6992283B2 (ja) 2017-05-31 2022-01-13 Tdk株式会社 Ｅｆｅｍ及びｅｆｅｍへの乾燥空気の導入方法
KR20190035523A (ko) 2017-09-26 2019-04-03 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 반도체 장치의 제조 방법, 및 프로그램
US10519543B2 (en) 2017-09-26 2019-12-31 Kokusai Electric Corporation Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
US11521880B2 (en) 2018-07-27 2022-12-06 Kokusai Electric Corporation Substrate processing apparatus and recording medium for changing atmosphere of transfer chamber
KR20210078679A (ko) * 2019-12-19 2021-06-29 주식회사 원익아이피에스 기판처리장치
KR102582276B1 (ko) 2019-12-19 2023-09-25 주식회사 원익아이피에스 기판처리장치

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