JP2007089007A - 受信装置 - Google Patents
受信装置 Download PDFInfo
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- JP2007089007A JP2007089007A JP2005277682A JP2005277682A JP2007089007A JP 2007089007 A JP2007089007 A JP 2007089007A JP 2005277682 A JP2005277682 A JP 2005277682A JP 2005277682 A JP2005277682 A JP 2005277682A JP 2007089007 A JP2007089007 A JP 2007089007A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/16—Circuits
- H04B1/26—Circuits for superheterodyne receivers
- H04B1/28—Circuits for superheterodyne receivers the receiver comprising at least one semiconductor device having three or more electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
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- H—ELECTRICITY
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- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6616—Vertical connections, e.g. vias
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0723—Shielding provided by an inner layer of PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09327—Special sequence of power, ground and signal layers in multilayer PCB
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Structure Of Receivers (AREA)
- Noise Elimination (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
【解決手段】 多層基板30の一方の面にチューナー部10を備え、他方の面に復調部20を備える。また、この多層基板30に、チューナー部10に接続されるアナログGND層33と、復調部20に接続されるデジタルGND層35と、アナログGND層33とデジタルGND層35との間に設けられ、当該両GND層間を電気的に遮蔽するためのシールドGND層34を設ける。
【選択図】 図1
Description
20 復調部
30 基板
31a〜31h 配線層
32a〜32h 絶縁層
33 アナログGND(アナログGND層)
34 シールドGND(シールドGND層)
35 デジタルGND(デジタルGND層)
41 周辺部品
42 接着部
51 端子電極
52 GND電極
70 受信装置搭載基板(基板)
80 インダクタ(流出防止手段)
100 受信装置
Claims (6)
- 多層基板の一方の面に、デジタル変調された複数の高周波信号から特定の高周波信号を抽出して低周波信号に変換するチューナー部を備え、
上記多層基板の他方の面に、チューナー部から出力される低周波信号をデジタル信号に変換して復調処理を行う復調部とを備えてなる受信装置であって、
上記多層基板に、
上記チューナー部に接続されたアナログGND層と、
上記復調部に接続されたデジタルGND層と、
上記アナログGND層とデジタルGND層との間に設けられ、当該両GND層と絶縁層によって隔てられたシールドGND層と、を備えていることを特徴とする受信装置。 - 上記多層基板は、複数の絶縁層と複数の配線層とが積層されてなり、
上記アナログGND層と上記シールドGND層との間、および/または、上記デジタルGND層と上記シールドGND層との間に備えられる絶縁層の厚さが、他の絶縁層の厚さよりも厚いことを特徴とする請求項1に記載の受信装置。 - 上記多層基板は、複数の絶縁層と複数の配線層とが積層されてなり、
上記各絶縁層の厚さは一定であって、かつ、
上記アナログGND層と上記シールドGND層との間、および/または、上記デジタルGND層と上記シールドGND層との間に、複数の絶縁層が備えられていることを特徴とする請求項1に記載の受信装置。 - 上記シールドGND層における上記アナログGND層またはデジタルGND層との対向面の面積が、当該対向面に対向する上記いずれかのGND層の対向面の面積よりも小さいことを特徴とする請求項1に記載の受信装置。
- 上記シールドGND層を上記受信装置の外部のGNDに接続するためのシールドGND接続端子を備え、
上記シールドGND層と上記アナログGND層との間に形成される寄生容量、および/または、上記シールドGND層と上記デジタルGND層との間に形成される寄生容量の上記特定の高周波信号の周波数におけるインピーダンスが、
上記シールドGND層と上記シールドGND接続端子との間の上記特定の高周波信号の周波数におけるインピーダンスよりも大きいことを特徴とする請求項1に記載の受信装置。 - 上記チューナー部および/または上記復調部は、半導体集積回路からなることを特徴とする請求項1に記載の受信装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005277682A JP3949695B2 (ja) | 2005-09-26 | 2005-09-26 | 受信装置 |
CNB2006101285244A CN100568747C (zh) | 2005-09-26 | 2006-08-31 | 信号接收装置 |
US11/515,763 US7301775B2 (en) | 2005-09-26 | 2006-09-06 | Receiving device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005277682A JP3949695B2 (ja) | 2005-09-26 | 2005-09-26 | 受信装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007089007A true JP2007089007A (ja) | 2007-04-05 |
JP3949695B2 JP3949695B2 (ja) | 2007-07-25 |
Family
ID=37893187
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005277682A Expired - Fee Related JP3949695B2 (ja) | 2005-09-26 | 2005-09-26 | 受信装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7301775B2 (ja) |
JP (1) | JP3949695B2 (ja) |
CN (1) | CN100568747C (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011155560A (ja) * | 2010-01-28 | 2011-08-11 | Murata Mfg Co Ltd | 高周波受信モジュール |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4148214B2 (ja) * | 2004-11-09 | 2008-09-10 | 船井電機株式会社 | 液晶テレビジョン装置 |
JP2010135374A (ja) * | 2008-12-02 | 2010-06-17 | Sanyo Electric Co Ltd | 多層プリント配線基板 |
US8629795B2 (en) | 2009-09-09 | 2014-01-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Micro-electro-mechanical systems (MEMS), systems, and operating methods thereof |
KR20120007812A (ko) * | 2010-07-15 | 2012-01-25 | 삼성전자주식회사 | 신호수신장치 및 그 신호처리방법 |
CN103297898B (zh) * | 2013-06-24 | 2017-04-12 | 深圳Tcl新技术有限公司 | 低频扩展方法和装置 |
US10334718B2 (en) | 2013-11-21 | 2019-06-25 | Zf Friedrichshafen Ag | Multi-functional high-current circuit board |
KR102469292B1 (ko) * | 2015-11-25 | 2022-11-22 | 삼성전자주식회사 | 무선 전력 송신기 및 무선 전력 수신기 |
US9483028B1 (en) * | 2016-02-19 | 2016-11-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Hybrid analog-to-digital converter |
US10165640B2 (en) | 2016-07-06 | 2018-12-25 | Lumileds Llc | Printed circuit board for integrated LED driver |
US10251270B2 (en) * | 2016-09-15 | 2019-04-02 | Innovium, Inc. | Dual-drill printed circuit board via |
WO2019188968A1 (ja) * | 2018-03-30 | 2019-10-03 | 株式会社村田製作所 | 高周波モジュール及びそれを備える通信装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0514015A (ja) | 1991-07-03 | 1993-01-22 | Tdk Corp | 高周波smdモジユール |
JPH0997993A (ja) | 1995-09-29 | 1997-04-08 | Matsushita Electric Ind Co Ltd | 高周波装置 |
JPH10197662A (ja) | 1996-12-28 | 1998-07-31 | Casio Comput Co Ltd | 受信装置 |
JPH11145570A (ja) | 1997-11-10 | 1999-05-28 | Mitsubishi Electric Corp | プリント基板 |
JP3895501B2 (ja) | 1999-06-10 | 2007-03-22 | 三菱電機株式会社 | プリント配線板 |
JP2004128288A (ja) | 2002-10-04 | 2004-04-22 | Renesas Technology Corp | 半導体装置および電子装置 |
TWI287421B (en) * | 2005-06-27 | 2007-09-21 | Delta Electronics Inc | Communication circuit module |
-
2005
- 2005-09-26 JP JP2005277682A patent/JP3949695B2/ja not_active Expired - Fee Related
-
2006
- 2006-08-31 CN CNB2006101285244A patent/CN100568747C/zh not_active Expired - Fee Related
- 2006-09-06 US US11/515,763 patent/US7301775B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011155560A (ja) * | 2010-01-28 | 2011-08-11 | Murata Mfg Co Ltd | 高周波受信モジュール |
Also Published As
Publication number | Publication date |
---|---|
CN100568747C (zh) | 2009-12-09 |
US7301775B2 (en) | 2007-11-27 |
CN1941641A (zh) | 2007-04-04 |
US20070069932A1 (en) | 2007-03-29 |
JP3949695B2 (ja) | 2007-07-25 |
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