JP2007073833A - 減圧乾燥装置及び基板乾燥方法 - Google Patents
減圧乾燥装置及び基板乾燥方法 Download PDFInfo
- Publication number
- JP2007073833A JP2007073833A JP2005260835A JP2005260835A JP2007073833A JP 2007073833 A JP2007073833 A JP 2007073833A JP 2005260835 A JP2005260835 A JP 2005260835A JP 2005260835 A JP2005260835 A JP 2005260835A JP 2007073833 A JP2007073833 A JP 2007073833A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- drying apparatus
- support
- support surface
- lift plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Drying Of Solid Materials (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005260835A JP2007073833A (ja) | 2005-09-08 | 2005-09-08 | 減圧乾燥装置及び基板乾燥方法 |
KR1020060070671A KR100875347B1 (ko) | 2005-09-08 | 2006-07-27 | 감압 건조 장치 및 기판 건조 방법 |
CNB2006101081815A CN100517570C (zh) | 2005-09-08 | 2006-07-31 | 减压干燥装置及基板干燥方法 |
TW095131598A TWI312857B (en) | 2005-09-08 | 2006-08-28 | Low pressure dryer and substrate drying method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005260835A JP2007073833A (ja) | 2005-09-08 | 2005-09-08 | 減圧乾燥装置及び基板乾燥方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007073833A true JP2007073833A (ja) | 2007-03-22 |
Family
ID=37858546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005260835A Pending JP2007073833A (ja) | 2005-09-08 | 2005-09-08 | 減圧乾燥装置及び基板乾燥方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2007073833A (zh) |
CN (1) | CN100517570C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114688853A (zh) * | 2022-04-02 | 2022-07-01 | 永新县华纬生物质能源有限公司 | 一种生物质颗粒燃料干燥成型设备及其使用方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103272539B (zh) | 2013-05-07 | 2015-08-12 | 李光武 | 减压干燥制备气凝胶的方法 |
JP6639175B2 (ja) * | 2015-09-29 | 2020-02-05 | 東京エレクトロン株式会社 | 乾燥装置及び乾燥処理方法 |
CN105783438B (zh) * | 2016-03-09 | 2018-09-18 | 武汉华星光电技术有限公司 | 一种减压加热干燥装置 |
CN106111487B (zh) * | 2016-06-27 | 2019-11-12 | 昆山国显光电有限公司 | 一种基板减压干燥系统及其干燥方法 |
CN107894741B (zh) * | 2017-11-06 | 2020-03-17 | 西安交通大学 | 一种溶液环境可控的高性能薄膜制备装备 |
JP2021096961A (ja) * | 2019-12-17 | 2021-06-24 | 東京エレクトロン株式会社 | 減圧乾燥装置および減圧乾燥方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6414919A (en) * | 1987-07-09 | 1989-01-19 | Dainippon Printing Co Ltd | Chucking device |
JPH02122741U (zh) * | 1989-03-16 | 1990-10-09 | ||
JP2002198416A (ja) * | 2000-12-27 | 2002-07-12 | Tokyo Electron Ltd | 処理装置 |
JP2002313895A (ja) * | 2001-04-12 | 2002-10-25 | Dainippon Screen Mfg Co Ltd | 基板保持装置および基板処理装置 |
JP2003017402A (ja) * | 2001-04-17 | 2003-01-17 | Tokyo Electron Ltd | 基板の処理方法及び基板の処理システム |
-
2005
- 2005-09-08 JP JP2005260835A patent/JP2007073833A/ja active Pending
-
2006
- 2006-07-31 CN CNB2006101081815A patent/CN100517570C/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6414919A (en) * | 1987-07-09 | 1989-01-19 | Dainippon Printing Co Ltd | Chucking device |
JPH02122741U (zh) * | 1989-03-16 | 1990-10-09 | ||
JP2002198416A (ja) * | 2000-12-27 | 2002-07-12 | Tokyo Electron Ltd | 処理装置 |
JP2002313895A (ja) * | 2001-04-12 | 2002-10-25 | Dainippon Screen Mfg Co Ltd | 基板保持装置および基板処理装置 |
JP2003017402A (ja) * | 2001-04-17 | 2003-01-17 | Tokyo Electron Ltd | 基板の処理方法及び基板の処理システム |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114688853A (zh) * | 2022-04-02 | 2022-07-01 | 永新县华纬生物质能源有限公司 | 一种生物质颗粒燃料干燥成型设备及其使用方法 |
CN114688853B (zh) * | 2022-04-02 | 2023-04-25 | 永新县华纬生物质能源有限公司 | 一种生物质颗粒燃料干燥成型设备及其使用方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1928475A (zh) | 2007-03-14 |
CN100517570C (zh) | 2009-07-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4795899B2 (ja) | 基板載置機構および基板受け渡し方法 | |
JP2007073833A (ja) | 減圧乾燥装置及び基板乾燥方法 | |
TWI567863B (zh) | Plasma processing device, substrate unloading device and method | |
TWI460805B (zh) | 處理基板的裝置與方法 | |
JP5248038B2 (ja) | 載置台およびそれを用いたプラズマ処理装置 | |
TWI529842B (zh) | Substrate collection method | |
KR101800504B1 (ko) | 기판 탑재 장치 및 기판 처리 장치 | |
KR101400453B1 (ko) | 기판 반송 방법 및 기판 반송 시스템 | |
JP2009122666A (ja) | 基板貼り合わせ装置及び方法 | |
JP2008235472A (ja) | 基板処理装置 | |
JP3597321B2 (ja) | 減圧乾燥装置 | |
TW201347078A (zh) | 基板處理裝置及基板處理方法 | |
JP2009004545A (ja) | 基板載置装置および基板処理装置 | |
KR100875347B1 (ko) | 감압 건조 장치 및 기판 건조 방법 | |
JP2007073827A (ja) | 減圧乾燥装置 | |
JP4971730B2 (ja) | プラズマ表面処理装置 | |
JP2018040512A (ja) | 減圧乾燥装置、減圧乾燥システム、減圧乾燥方法 | |
JP6595276B2 (ja) | 基板処理装置および基板処理方法 | |
JP2008311466A (ja) | 基板保持装置および基板処理装置 | |
TWI754070B (zh) | 基板處理裝置及基板處理方法 | |
TW201528415A (zh) | 升降銷總成及具有升降銷總成之基板處理裝置 | |
JP2015207691A (ja) | 基板処理システム、基板処理方法、プログラム及びコンピュータ記憶媒体 | |
JP3602359B2 (ja) | 平板状ワークの位置決め装置 | |
JP2007235094A (ja) | 減圧乾燥処理装置 | |
JP2018129337A (ja) | 基板処理装置および基板処理方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20071218 |
|
RD04 | Notification of resignation of power of attorney |
Effective date: 20091210 Free format text: JAPANESE INTERMEDIATE CODE: A7424 |
|
A977 | Report on retrieval |
Effective date: 20091221 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
|
A131 | Notification of reasons for refusal |
Effective date: 20100126 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100317 |
|
A02 | Decision of refusal |
Effective date: 20100518 Free format text: JAPANESE INTERMEDIATE CODE: A02 |