TWI312857B - Low pressure dryer and substrate drying method - Google Patents

Description

1312857 IX. OBJECTS OF THE INVENTION: TECHNICAL FIELD The present invention relates to a vacuum drying apparatus for a treatment liquid in a vacuum treatment chamber. [Prior Art] On a glass square substrate for liquid crystal, a semi-substrate, a substrate for a photomask, and a color light-emitting light; in a flexible step for thin film liquid crystal, a substrate is coated on the surface of the substrate. The treatment liquid such as π # ^ photoresist liquid is treated, and a dry solution is used to dry the treatment liquid of the base ψ, W, and Han. As the drying device, there is known a drying device which reduces the boiling point of the environmental treatment gas in the processing chamber of the earth plate by reducing the boiling point of the low-treatment liquid of the umbrella and drying it in a short time. Substrate ^ "Responsible for the rectification of the treatment liquid. (For example, refer to the patent document!) [Patent Document 1] Japanese Patent Laid-Open Publication No. 2004- 217 No. 2 [Problems to be Solved by the Invention] Generally, the vacuum drying apparatus is supported When the pin is in contact with the pin, the substrate n is supported. (If the substrate is n-pointed under decompression and drying, the temperature difference will be generated in the knife, &gt;, and the P button. The reason is that although the pressure is reduced In the drying, with the vaporization of the treatment liquid, the heat of vaporization will be absorbed from the substrate, but a substantial difference in heat capacity is generated between the support portion and other portions, or a gas flow is generated in a space other than the branch knife and absorbs heat, etc. If a local temperature difference is generated, the state of the treatment liquid on the substrate will be affected, and unevenness will occur in the treatment liquid. The present invention has been made in view of the above problems, and the object thereof is to provide a treatment liquid which can prevent the treatment liquid. In order to solve the above problems, the invention of claim 1 is a dust-reducing and drying device for decompressing the ambient gas in the chamber and drying the treatment liquid on the substrate, and includes a branching mechanism for supporting the substrate when the processing liquid on the substrate is dried to be in contact with at least the entire back side of the product region where the processing liquid exists; and a transfer mechanism that transmits the support When the surface is in contact with the substrate, the transfer of the substrate is performed between the transfer mechanism and the transfer mechanism outside the processing chamber; and the transmission support surface is at least a part of the processing support surface. The invention relates to a vacuum drying device of the present invention, wherein the processing support surface and the transmission supporting surface are composed of the same member, and the invention of claim 3 is as claimed in claim d, and the transmission branch is provided. The surface is composed of a plurality of ith plates that are disposed apart from each other, and the processing support surface is composed of the plurality of slabs and the other second slabs. In the vacuum drying apparatus of the present invention, in the case of forming the processing support surface, the distance between the adjacent slab and the second flat plate is 1 mm or less. Further, the invention of claim 5 is as follows. The vacuum drying apparatus according to claim 3 or 4, further comprising a closing mechanism that closes a space between the adjacent first flat plate and the second flat plate when the processing support surface is formed. The invention relates to the vacuum drying apparatus of claim 3 or 4, further comprising a temperature adjustment mechanism for adjusting a temperature difference between the first flat plate and the second flat plate. a 112324.doc χ312857 Fresh = please, item 7 invention For example, in the request item, the term "reduction" is set to "the above-mentioned processing support surface is composed of a conductor material and is grounded. Dry = please, the invention is as requested. In the 4th - the decompression of the item, the above-mentioned treatment support surface is composed of an insulating material. The invention of claim 9 is characterized in that: the drying device for treating the ambient gas in the chamber and the processing liquid on the substrate, and comprising: supporting machine: when the processing liquid on the substrate is dried, the surface is contacted by the support surface Supporting the substrate on the surface side; and leaving the mechanism to separate the dried substrate from the gram floor in a reduced pressure state of the processing chamber. Further, the invention of claim H) is the vacuum drying apparatus of claim 9, wherein the leaving mechanism has an injury from the above-mentioned support surface and the support of the substrate 2 is awarded. Further, the invention of claim 11 is the vacuum drying apparatus of claim 1 , wherein the leaving mechanism further includes a linking member that transmits the lifting surface lifting motion to the branch pin, and the supporting surface The lifting and lowering interlocking causes the support pin to appear on the support surface. Further, the invention of claim 2 is the dehumidification device of claim 1 (), wherein the support pin is opposite to (4) the processing chamber, and the leaving mechanism is provided with: a lifting mechanism 'by making the above-mentioned supporting surface The support chamber is relatively lifted and lowered in the processing chamber to cause the support to be present on the support surface. Further, the invention of claim 13 is as claimed in any one of claims 9 to 12, wherein the support surface is made of a conductor material and grounded. The invention of claim 14 is the decompression device of any one of claims 9 to 324, doc 1312857, wherein said support surface is comprised of an insulating material. Further, the invention of the present invention is a method for drying a substrate for drying a processing liquid on a substrate, and comprising: a drying step of supporting the substrate while supporting the substrate while reducing the ambient gas while drying the processing liquid on the substrate 'and after the drying step, - (d) holding the above-mentioned ambient gas, β, shape 1, and leaving the substrate away from the support surface [effect of the invention] according to the invention of claims 1 to 8, When the pressure is reduced in the treatment chamber, the entire surface on the back side of the product region where the treatment liquid is present is contacted and supported, and the substrate is prevented from being uneven. Moreover, since the support surface system and the support portion are at least "partial", it is not necessary to support the support surface. Since the through hole of the support pin does not need to be formed on the processing support surface, the unevenness of the treatment liquid caused by the through hole can be prevented. The invention is based on the invention of the claim 2, due to the treatment of the support surface and the transmission. Since the supporting surface is composed of the same member, the device configuration can be simplified, and when the substrate is transferred, the product (4) having the processing liquid exists in the region and supported, and stable substrate transfer is performed. Further, according to claim 3夕旅 nn « , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , It can prevent the generation of airflow... The unevenness of the treatment liquid. 』 And 'especially according to the request item $1, 、,, can prevent the airflow between the first flat plate and the second 112324.doc 1312857 flat plate. Moreover, it is possible to prevent unevenness of the treatment liquid. Moreover, 'in particular according to the invention of claim 6', since the temperature difference between the plates of the second plate is adjusted, the unevenness of the treatment liquid can be prevented. The invention of the items 7 and 8 prevents accumulation of static electricity and prevents damage to the substrate due to peeling electrification. According to the inventions of claims 9 to 15, since the substrate after drying is removed from the supporting surface under reduced pressure, The force for pressing the substrate to the support surface becomes small, whereby the friction between the support surface and the substrate disappears, and the charging of the substrate when it is separated from the support surface can be effectively prevented. Further, according to the invention of claim 1, The support pin is in contact with the base plate that is separated from the support surface by the contact point. Therefore, the transmission of the substrate can be prevented from being generated. In addition, according to the invention of the request item, the linkage between the support lock and the support surface is caused by the rise and fall of the support surface. There is no need for a special lifting mechanism for supporting the pin, so that the device can be simplified. In particular, according to the invention of claim 12, since the support pin is fixed and the support pin is lifted out of the support surface by the lifting and lowering of the support surface, The device can be simplified without the need for a special lifting mechanism for the pin. Further, according to the inventions of claims 13 and 14, it is possible to prevent the component from being damaged by contact charging. Embodiments of the present invention will be described below with reference to the drawings. <1. First Embodiment> Fig. 1 is a view showing a schematic configuration 112324.doc 1312857 of a vacuum drying apparatus 1a according to a first embodiment. The drying device 1a has a function of decompressing the atmosphere in the processing chamber 2 while the substrate w is placed in the processing chamber, and drying the processing liquid such as the photoresist on the substrate W. The vacuum drying apparatus 1a includes a chamber 2 in which a processing chamber 20 for processing the substrate 1 is formed. The chamber 2 includes a detachable base body 21 and a lid body 22. The base body η port is disposed in another aspect. It is connected to the cantilever 23 and can be moved up and down with respect to the base body 21 by the driving of the cantilever 23. Further, in the following description, as long as it is not particularly mentioned, the movement of each member is made to be the position of the predetermined processing chamber 20. The relative movement of the base body 21 in a fixed configuration is referred to as a reference. When the substrate w is carried in and out, the lid 22 is raised and the chamber 2 is opened. On the other hand, when the substrate is dried, the lid 22 is lowered and joined to the base body 21, and the chamber 2 is closed. A cymbal 24 in which the lid body 22 and the base body are joined to each other to ensure airtightness to the treatment is provided, and a cymbal ring 24 made of ruthenium rubber or the like is provided. Further, inside the chamber 2, a lifting plate 3 for supporting the substrate w is provided substantially horizontally. The lifting plate 3 is fixed to the lifting mechanism 3, 2 provided outside the chamber 2, and is movable up and down. A support lock or the like for supporting the substrate W is not provided on the lift plate 3. The lift plate 3 has its upper surface 仏 as a support surface, and is in surface contact with the substrate W and supports (surface supports) the substrate w substantially horizontally. The substrate w to be processed by the vacuum drying apparatus 1a has a treatment liquid layer formed on the upper surface thereof, and the lower surface of the back surface side is supported by the elevation plate 3. In the substrate w, for example, the region from the end portion, for example, 10 is not a product region (hereinafter referred to as a "non-product region"), and is on the upper surface of the substrate, and includes an area in which the non-112324.doc -10- 1312857 system-area is removed (below A zone-shaped treatment liquid called 'product area'). And I (4). The surface 3a of the surface 3a is contacted with at least the entire back side of the region where the treatment liquid is located, and supports the substrate W. : 'Subtraction: The drying device 13 is provided with a pressure reducing mechanism 40 for The decompression chamber is used to supply the gas to the mechanism 50 for supplying the processing gas to the processing chamber 2A. The decompression mechanism 40 has: as a suction:; 4 1. Field, / broadcast and ~ pump a plurality of suction pipes 4 of the extracted ambient gas, etc., etc., a plurality of suction pipes 4 or a base passage 2 to 2, and connected to the right to the closed chamber 2 The vacuum pump 4 is driven, and the suction pipe 4 is sucked into the processing chamber 2, and is exhausted by the outside of the set h. ΓΙΓ The vacuum is dried and dried, and the ambient gas of the processing chamber 2 is depressurized. The system will be able to restore the environmental gas to the large chaos of the ship in such a ship's domain, and then borrow the 气体 Ζ Ζ . . 七 七 七 七 七 七 七 七 七 七 七 七 七 七 七 七 七 七 七 ' ' ' ' ' ' ' ' ' ' a plurality of supply pipes 5 to the processing chamber 20, and a plurality of supply pipes 5 are also connected to the processing chamber 2 through the base body of the chamber 2 0.#神A a* ρ The hard emulsion is made of an inert gas such as nitrogen. The 'decompression drying device U is equipped with a device for controlling the wearing operation as a whole: As shown in the figure, the 诘懕 and the supply mechanism 5G are connected to the controller 6, and the movements are controlled by the control of the above-mentioned cantilever 23 and the lift (four), etc. The operation of the vacuum drying apparatus 1 a configured as described above is also described. Fig. 2 is a flow chart showing the operation of the drying apparatus h. The operation 112324.doc 1312857 is based on the processing target 4 __ At the start time of the operation, the cover 22 is raised and the chamber 2 is opened. The substrate W is completed. The substrate W does not exist in the chamber 2

The shuttle product area of the 2 external transport mechanism enters the open chamber 2 on one side. Thereby, one substrate W which is the object in the place is carried into the cavity to 2. The sulfone enthalpy of the substrate W is formed with a treatment liquid layer (step S 1) 〇 91 5 — a non-product region of the end portion of the surface supporting substrate W

Next, as shown in Fig. 4, the elevating plate 3 is raised by the driving of the elevating mechanism 32, and the substrate w is transferred from the shuttle 91 to the elevating plate 3. At this time, the upper surface 3a of the elevating plate 3 is in surface contact with the back side of the product region not covered by the shuttle 9, and supports the substrate w (step S2). If the base is transferred to the lift plate 3, the shuttle 91 will exit to the outside of the chamber 2 (step S3). As shown in FIG. 5, by the driving of the lifting mechanism 32, the lifting plate 3 is lowered to a position where the substrate W is dried. During this descent and after the gamma is lowered, the substrate w is also in contact with and supported by the upper surface 33 of the elevating plate 3 (step S4). Then, the lid body 22 is lowered and adhered to the base body 21, and the chamber 2 is closed. As a result, the vacuum drying apparatus is in the state shown in Fig. ,, and the processing chamber 2 is formed in an airtight state (step S5). Next, the ambient gas in the processing chamber 20 is depressurized, and the treatment liquid on the substrate w is dried. Specifically, the vacuum pump 4 is driven to suck the ambient gas in the processing chamber 20 via the suction. As a result, the amount of gas in the processing chamber 20 is reduced. With the decompression of the ambient gas, the processing point on the substrate W is lowered, and the processing liquid is vaporized. After the vaporization, the treatment liquid will pass through the suction pipe 4 of H2324.doc -12- 1312857 to the external pressure α of the vacuum drying device, and the shape will be dried for the second treatment: the rapid vaporization of the dead liquid (stagnation) And the stage dr gas (step S6). In the drying process, the support substrate w is also in contact with the lifting plate 3 &; ... and is supported by it. Therefore, the back of the product area of the substrate W is not J Space is formed, and airflow is not generated on the back side of the product area. ^The ambient gas of the process chamber is reduced to almost vacuum to end the drying; 'then' the service gas is supplied by the supply mechanism 5〇 Returning to the processing chamber 2' to return the ambient gas of the processing chamber 20 to atmospheric pressure (step (7). Second, as shown in FIG. 5, the lid 22 is raised, and the chamber 2 is opened (step is called. Secondly) by the lifting mechanism 32 The drive plate 3 is raised to the position where the transfer substrate W is transferred. During the ascending process and after the rise, the substrate W is also in contact with and supported by the upper surface of the lift plate 3 (step. Second, the shuttle 91 enters the chamber 2 (step S1), as shown in FIG. The substrate W is transferred from the lift plate 3 to the shuttle 91. Further, as shown in Fig. 3, when the lift plate 3 is lowered (step S11), the shuttle 91 is withdrawn to the outside of the chamber 2, and the substrate w is carried out to The outside of the vacuum drying apparatus 1a (step si2). In the vacuum drying apparatus 1a of the first embodiment, when the processing liquid on the substrate w is dried, the upper surface 3 & surface of the lifting plate 3 is in contact with at least the treatment. The substrate W is integrally supported and supported (surface supported) on the back side of the product region where the liquid is present. Thereby, since the space is not formed on the back side of the product region of the substrate W, the substantial heat capacity in the entire product region becomes uniform, and Also, no airflow is generated on the back side of the substrate W. Thereby, the temperature of the entire product region of the substrate w can be made uniform, and the unevenness of the treatment liquid can be effectively prevented. 112324.doc 1312857 Subtracting c & drying device la 'When the substrate|transfer is made between the shuttle and the shuttle 9i, the substrate w is not cut, but only the lifting plate 3 is surface-contacted with the upper surface 3a and the substrate W1 is supported, and the upper surface 3a of the lift plate 3 It will be used as the support for the following two sides, ie, the drying solution The surface and the support surface when the substrate w is transferred. Since the support pin or the like for the base board is not required to be provided separately, the device configuration can be simplified, and the stable substrate W can be transferred. The right side is provided on the lift plate 3. In the case where there is a support for the transfer of the substrate w, the lifter 3 must be provided on the lift plate 3 to lift the support pin. If the hole is formed in the lift plate 3, then the lift plate is When the upper surface 3a buryes the support pin and dries the treatment liquid on the substrate w, a portion which is in surface contact with the lift plate 3 and which is not in contact with the back surface side of the substrate W is formed. The trowel (with the space caused by the through hole) Part of the contact). Thereby, there is a possibility that a temperature difference is generated between the portions to cause unevenness of the treatment liquid. In the 'decompression drying apparatus 1 &amp;, since it is not necessary to provide the support pin', it is possible to effectively prevent the unevenness of the treatment liquid caused by the through hole of the support pin. &lt;2. Second embodiment&gt; Next, a second embodiment will be described. In the embodiment, the support surface when the substrate is dried and the support surface when the substrate is transferred are composed of the same member, and the entire surface of the back side of the product region is also selected when the substrate is transferred. However, in recent years, the size of the substrate tends to increase, and if only the non-product region of the end portion of the substrate is supported, the substrate is bent. Therefore, the transfer mechanism may support the back side of the product region near the center portion of the substrate. If this is the case, as shown in the embodiment of the "112324.doc 1312857", when the substrate is transferred to the transport mechanism, the entire surface of the back side of the product region of the substrate cannot be supported. Reduction in the second embodiment: The drying device corresponds to the transfer mechanism. Fig. 6 is a schematic block diagram showing a dust collecting and drying device of the second embodiment. The same components as those of the vacuum drying apparatus of the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. The vacuum drying apparatus 1b of the second embodiment differs from the decompression drying apparatus ha of the first embodiment in the configuration of the supporting surface of the branch substrate. More specifically, in the reduced-pressure drying apparatus, only one of the support faces supporting the substrate w is constituted by the lift plate 33, and the other portion is constituted by the fixed plate 25 fixedly disposed. As shown in Fig. 6, the vacuum drying apparatus is provided with two lifting plates 33 which are disposed apart from each other, and the two lifting plates 33 are disposed substantially horizontally at the same height and are fixed to the same one which can be lifted up and down. The lifting mechanism is on the fence. Therefore, the two elevating plates 33 are maintained in a substantially horizontal state by the elevating mechanism 34, and only the same amount of movement is raised and lowered in the same direction. Further, the reduced-pressure drying device 1b is provided with three fixing plates 25 which are disposed substantially horizontally at the same height. These fixing plates 25 are fixed to the base body 21 via coupling members such as bolts. Further, for convenience of explanation, the illustration of the joint member is omitted in the drawings. Fig. 6 shows a state in which the two lift plates 33 are lowered to the lower end. If the elevating plate 33 is lowered to the lower end in this manner, the elevating plates 33 will be disposed on the fixed plate. One another. Further, the upper surface 33a of the two lift plates 33 and the upper surface 25a of the three fixed plates 25 have the same height and form a substantially horizontal plane. In the embodiment, the surface formed by the lift plate 33 and the fixed plate 25 functions as a support surface for drying the substrate W. Further, when the two lift plates 33 are raised, the upper surfaces 33a protrude from the position of the support surface when the substrate W is dried to form a substantially horizontal surface. In the present embodiment, the surface composed of the two lift plates 33 functions as a supporting floor when the substrate W is transferred.

Hereinafter, the operation of the vacuum drying apparatus 1b configured as described above will be described. This operation is almost the same as that of Fig. 2, and therefore will be described using Fig. 2 . Further, in the present embodiment, the substrate W is not present in the chamber 2 at the start of the operation of Fig. 2, and the lid 22 is raised and the chamber 2 is opened. First, as shown in Fig. 7, the hand 92' of the manipulator, which is the external transport mechanism of the chamber 2, supports the substrate w, and the surface enters the chamber 2 which is opened in a direction corresponding to the direction perpendicular to the plane of the drawing. The robot supports the back side of the product region at the center portion of the substrate 1 by the three hand portions, in addition to the non-product region of the end portion of the support substrate W (step s i).

Next, as shown in Fig. 8, by the driving of the elevating mechanism 34, the two lifting plates 33 are raised by the 'hands 92'. Further, the two lifting plates like the upper surface 33a serve as a supporting surface which is in contact with a portion which is not cut by the hand 92 of the substrate|seat, and the branching plate w. Thereby, the substrate is transferred from the hand to the lifting plate 33, and the hand 92 is ejected to a direction which is substantially perpendicular to the plane of the drawing (step S2). As shown in Fig. 9, by the driving of the elevator, the upper surface 33a of the upper surface 33 of the lifting plate A has a uniform height of the upper surface 25a. In the lowering, the substrate W is also in contact with the end portion of the substrate w supported by the robot of 112324.doc -16 - 1312857 of the two lifting plates 33, and may be supported while supporting the substrate W while being in surface contact. Accept/transfer substrate w. Further, the upper surfaces 33a of the two lift plates 33 are lowered to form a support surface for drying the substrate w together with the upper surface 25a of the fixed plate 25, and support the entire surface of the back surface of the substrate w. As a result, in the present embodiment, when the processing liquid of the substrate is dried, a space such as a through hole for supporting the lock is not formed on the back side of the product region of the substrate W, so that unevenness of the processing liquid can be effectively prevented. Further, in the case of forming the support surface when the substrate W is dried, there is a gap between the adjacent lift plate 33 and the fixed plate 25, but the gap is relatively small compared with the through hole of the support pin, and the like. The effect of the gap on the state of the treatment liquid is almost negligible. In particular, if the adjacent elevating plate 33 and the fixing plate 25 are separated by more than 〇 mm or more! Below the claws, it is possible to suppress the generation of airflow between the claws, and it hardly affects the state of the treatment liquid. Further, when the lift plate 33 and the fixed plate 25 are disposed in close proximity, both of the lift plate 33 and the fixed plate 25 may be chamfered in order to maintain the accuracy of the operation. Further, the gap between the adjacent elevating plate 33 and the fixed plate 25 can be closed. Fig. ίο and Fig. 11 are diagrams showing the schematic configuration of the deflation drying device lb in this case. As shown in Fig. 10, in this case, a closing plate 26 made of an elastic material such as resin is provided on the lower surface of the fixing plate 25. The occlusion plate % is disposed at a position adjacent to the fixed plate 25 and the lift plate 33, and the self-fixing plate is horizontally larger. As shown in FIG. 11, if the lift plate 33 is lowered to the height of the fixed plate, the occlusion plate 26 is closed. The space between the fixed plate 25 and the lift plate 33 is closed and the space is separated from other spaces in the process chamber 2〇. In the vacuum drying apparatus (4) of the second embodiment described above, the branch surface when the substrate w is dried is constituted by the lift plate 33 and the fixed plate 25. Here, since the lift plate % is connected to the lift mechanism 34, the other side fixing plate 25 is larger than the base body 21, so there is a substantial difference in heat capacity between the lift plate 33 and the fixed plate 25, so that it is strictly possible These create a temperature difference between each other. Therefore, in order to eliminate the temperature difference between Wen and the like, a temperature adjuster may be provided.

Fig. 12 is a view showing a schematic configuration of a vacuum drying apparatus in this case. As shown in Fig. 12, the temperature-reducing device 27 having a heating function is provided on the pillar of the lifting and lowering plate n. The temperature adjuster 27 is connected to the controller 6 and operates under the control of the controller 6. In the case of the decimating device, since the lifting plate 33 has a smaller heat capacity than the fixed core, the temperature of the lifting plate 33 is lower than the temperature of the fixing plate 25 when the drying process is performed. Thereby drying

At the time of processing, the temperature adjuster 27 is driven to heat the lift plate 33 so as to eliminate the temperature difference between the lift plate 33 and the fixed plate 25. If so, the iM removes the temperature difference between the lift plate 33 and the fixed plate 25, so that the processing liquid of the substrate Wj1 can be prevented from being uneven. Furthermore, it is possible to eliminate the shackles of the lifting plate 33 and the fixing plate 25, and the sorrow & can be placed on the side of the fixing plate 25, and the cold cooling is performed. The temperature adjuster of the dish is disposed on both the lift plate 33 and the fixed plate. &lt; 3 - 3 · Other Modifications&gt; In the first embodiment, in the process of drying the substrate, the contact with the surface of the beef plate is present, and the mouth of the night is "side" but if it is in surface contact The entire back side of the βσ region of 112324.doc -20- 1312857 to v ° can also be in surface contact with a wider area. For example, the surface of the lifting plate 3 can be contacted with the entire back surface of the substrate W and the substrate can be supported. Further, the upper surface 3a of the elevating plate 3 is used alone as a supporting surface for processing the substrate w. However, the upper surface 3a may be used as a part of the supporting surface when the substrate w is processed. For example, 2 In the same embodiment, the upper surface 3a of the lift plate 3 and the upper surface of the other fixedly disposed flat plate may be opened to form a support floor when the substrate W is processed, and the support surface may be used. In the second embodiment, the support surface of the substrate w is in contact with the entire back surface of the substrate W and supports the substrate w, but may be in surface contact with the support substrate w. At least the entire back side of the product area where the treatment liquid is present. In the embodiment, the two lift plates 33 are provided. However, three or more lift plates may be provided depending on the size of the substrate W, etc. <4. Third embodiment> Next, a third embodiment will be described. 13 is a schematic configuration diagram of the vacuum drying apparatus 20 1 a of the third embodiment. The vacuum drying apparatus 2 〇丨 &amp; has a pressure reducing processing chamber 220 in a state in which the substrate w is disposed in the processing chamber 220. The inside of the ambient gas is used to dry the processing liquid such as the photoresist liquid applied to the substrate w. The vacuum drying apparatus 2A1a includes a chamber 202 in which the processing chamber 22 of the processing substrate is formed. The chamber 202 The detachable base body 221 and the cover body 222 are included. The base body 221 is fixedly disposed, and the cover body 222 is connected to the cantilever 223 and can be lifted up and down with respect to the base body 221 by the driving of the cantilever 223 112324. .doc 21 1312857 Descending. In addition, in the following description, as long as there is no slap in the wood, the movement of each member is taken as the base of the fixed processing chamber 220, and the pedestal is fixed. The body 221 is described as a reference relative motion. At the time of loading and unloading, the lid body 222 is raised and the chamber 2〇2 is opened. On the other hand, when the substrate % is dried, the lid body 2 is lowered and the base body 221 is joined, and the cavity 202 is closed. In the portion where the lid body 222 is joined to the base body 221, a dome ring 224 made of Shishi rubber or the like is provided to ensure the airtightness of the processing chamber 22. Further, a lifting plate 203 for supporting the substrate W is provided substantially horizontally inside the chamber 202. The elevating plate 203 is fixed to the elevating mechanism 232 provided outside the chamber 2〇2, and is movable up and down. The substrate w to be processed by the reduced-pressure drying device 201a has a processing liquid layer formed on the upper surface thereof, and the lower surface of the back surface side is supported by the lifting plate 2〇3. A region of the substrate w which is, for example, 10 mm from the end portion is a non-product region where no product is formed, and a treatment liquid is formed on the upper surface of the substrate W in a region including the product region from which the non-product region is removed. Further, a plurality of through holes are formed in the lift plate 203, and the support pins 207 are respectively inserted into the through holes, and the upper ends of the support pins 2〇7 are pressed according to the operation state of the vacuum drying device 20 1 a. The upper surface 203a of the lifting plate 203 is in dog contact and contacts the substrate w. The connecting member 2·70 is provided on the lower surface ‘ below the lifting plate 203 corresponding to the branch pins 2〇7, respectively. The connecting member 270 serves as an interlocking member that transmits the lifting motion of the lifting plate 203 to the supporting pin 207' and interlocks with the lifting of the lifting plate 203 to cause the supporting pin 207 to exit from the upper surface 203a. 112324.doc -22- 1312857 FIGS. 14 and 15 are enlarged views showing the configuration of the periphery of the connecting member 27A. As shown in the figures, the structure of the connecting member 27 includes a fulcrum portion π, an expansion and contraction portion 272, and a returning portion 273. The fulcrum portion 271 is formed of a rod-shaped member and is fixedly disposed on the lower surface side of the elevating plate 203 so as to extend in the longitudinal direction in the longitudinal direction. The expansion/contraction portion 272 is a member that can expand and contract its length in the vertical direction, and is configured to include a piston portion 272a at the upper portion and a cylinder portion 272b at the lower portion. The cylinder portion 272b is constituted by a cylindrical member' and the piston portion 272a is reciprocally inserted into the inside thereof. The length of the stretchable portion 272 can be changed by changing the relative positional relationship between the piston portion 272a and the cylinder portion 272b. The piston portion 272a' is fixedly disposed on the lower side of the lift plate 2〇3, and a coil spring 27k is disposed around the piston plate 272a'. The coil spring 272c is disposed such that an upper portion contacts a lower surface of the lift plate 203, and a lower portion contacts an upper portion of the cylinder portion 2721. Thereby, the Ά rainbow portion 272b is relatively separated from the lift plate 203 and pressed downward. Further, the lower end portion of the piston portion 272a is formed with a claw portion, and even if the piston portion 272a and the cylinder portion 272b are relatively moved to the deviation direction (the direction in which the expansion-contraction portion 272 is extended), the same does not deviate. Further, the 'return portion 273 is a rod-shaped member, and the one end portion 273a is rotatably supported by the cylinder portion 272b of the expansion and contraction portion 272, and the other end portion 273b is rotatably supported by the lower end portion of the support lock 207, and the center portion 273c is The fulcrum portion 27 j is rotatably supported. As shown in Fig. 14, if the expansion/contraction portion 272 is not in contact with the base body 221, the expansion and contraction portion 272 is extended to the maximum by the pressing force of the coil spring 272c. In this state, the end portion 112324.doc • 23-1312857 273a connected to the return portion 273 of the cylinder portion 272b is relatively lower than the center portion 273c which becomes the fulcrum. Further, the end portion 73b of the returning portion 273 of the support pin 2〇7 connected to the opposite side is opposite to the center portion 2 7 3 c which becomes the fulcrum, and the upper end portion of the branch pin 2 〇7 is lifted and lowered. The upper surface 2〇3a of the plate 203 protrudes. When the elevating plate 2 is lowered from the state shown in Fig. 14, the lower portion of the elastic portion 272 is in contact with the base body 221 as shown in Fig. 15 . Thereby, contrary to the pressing force of the coil spring 272c, the cylinder portion 27 is relatively moved to the side of the lift plate 2〇3, and the length of the stretchable portion 272 is shortened. Further, the end portion 273a of the returning portion 273 connected to the cylinder portion 272b is relatively higher than the center portion 27 of the fulcrum. Thus, the end portion 273b' of the return portion 273 of the support pin 2〇7 connected to the opposite side thereof is relatively lower than the center portion 273c which becomes the fulcrum, and the upper end portion of the support pin 207 is lifted from the lift plate 2〇3 The upper surface 2〇3a is buried. Thus, if the elevating plate 203 is lowered until the connecting member 270 contacts the base body 22 1 , its movement will be transmitted to the support pin 2 〇 7 ′ via the connecting member 27 ' the support pin 207 is buried from the upper surface 203 a of the elevating plate 203 ( Figure 15). In contrast, if the lift plate 2〇3 rises to a position where the connecting member 270 is separated from the base body 221, its movement will be transmitted to the branch lock 207 via the connecting member 27'. The support pin 207 will be lifted from the lift plate 203. The upper surface 203a protrudes (Fig. 14). Thus, the state will be such that the substrate W is in contact with the upper surface 203a of the lift plate 203 and is supported by the upper surface 203a in a state where the lift plate 203 is lowered; and the substrate W is raised in a state where the lift plate 203 is raised. It is in contact with and supported by the support pin 207, and is separated from the upper surface of the lift plate 203 by 2 0 3 a. Returning to Fig. 13, the vacuum drying apparatus 20 1 a is provided with: a pressure reducing mechanism 24 环境 for decompressing the ambient gas of the chamber 112324.doc -24 - 1312857 220; for supplying the processing gas to the processing to 220 The supply mechanism is 25〇. The pressure reducing mechanism 24A has a vacuum pump 241 as a suction device, and a plurality of suction pipes 2G4 for guiding the suctioned ambient gas. The plurality of suction devices f are taken through the base body 221 of the chamber 2 () 2 and connected to the processing chamber 22A. When the vacuum pump 241 is driven in a state in which the chamber 2 is closed, the ambient gas in the processing chamber 22 is sucked through the suction pipe 2〇4, and is exhausted to the dry portion of the vacuum drying device 2 (). Thereby, the ambient gas of the treatment chamber 220 is decompressed. The supply mechanism 250 is a mechanism for returning the ambient gas in the processing chamber 22 after the pressure reduction to atmospheric pressure, and has a plurality of supply pipes for supplying the processing gas to the processing chamber 22 by the gas supply unit 1 for supplying the processing gas. 205. The plurality of supply pipes 2〇5 also pass through the base body 221 of the chamber 2〇2 and are connected to the processing chamber 22〇. The treatment gas may be an inert gas such as nitrogen. Further, the decompression drying apparatus 201a is provided with a controller 2?6 including a microcomputer or the like for controlling the operation of the apparatus as a whole. As shown, the pressure relief mechanism 24 and the supply mechanism 250 are coupled to the controller 鸠, which are controlled by the controller (10). Further, the above-mentioned cantilever 223, lifting mechanism 232, and the like are also connected to the controller 206, and the lifting of the lid 222 and the lifting and lowering of the lifting plate 2〇3 are also controlled by the controller 206. Eight people explained the action of the vacuum drying device 2〇ia constructed in the above manner. Fig. 16 is a flow chart showing the operation of the vacuum drying apparatus 2〇la. This action flow is completed based on each of the substrates to be processed. At the start time of the /action, the substrate w does not exist in the chamber 2〇2, the cover 112324.doc -25 · 1312857 222 rises and the chamber 202 is open. First, one of the substrates W to be processed is carried into the chamber 202. That is, as shown in Fig. 17, the shuttle 291 as the external transport mechanism of the chamber 202 enters the open chamber 202 while supporting the non-product region of the end portion of the substrate W. A treatment liquid layer is formed in a region including the product region of the substrate w. Further, as shown in Fig. 18, the elevating plate 203 is raised by the driving of the elevating mechanism 232, and the substrate w is transferred from the shuttle 291 to the elevating plate 203. At this time, since the support pin 207 protrudes from the upper surface 203a of the lift plate 203, the substrate W is in contact with and supported by the support pin 207. When the substrate W is transferred to the lift plate 203, the shuttle 29 1 will be withdrawn to the outside of the chamber 202 (step S21). Next, as shown in Fig. 19, by the driving of the elevating mechanism 232, the elevating plate 203 is lowered to a position where the substrate % is dried. If the lifting plate 2〇3 is lowered as such, it will become a state in which the branch pin 207 is buried from the upper surface 203a of the lifting plate 203. Thereby, the substrate-surface is in contact with the upper surface 2〇3&amp; of the lift plate 2〇3 and supported by the upper surface 203a. At this time, the upper surface 2〇3&amp; surface of the elevating plate 2〇3 is in contact with the entire back surface side of the product region where the processing liquid exists in the substrate W (step S22). Then, the lid body 222 is lowered and adhered to the base body 221, and the chamber 2〇2 is closed. Thereby, the vacuum drying apparatus 201a is in a state as shown in FIG. 13, and the processing chamber 220 in an airtight state is formed (step S23). ). Next, the ambient gas in the treatment chamber 220 is depressurized, and the treatment liquid on the substrate is dried. Specifically, the vacuum pump 241 is driven to suck the ambient gas in the chamber of the chamber via U2324.doc -26-I312857 = piping 2G4. Thereby, the ambient gas in the decompression to 220 is accompanied by the reduction of the ambient gas, and the boiling point of the treatment liquid on the substrate w is lowered, and the treatment liquid is gradually vaporized. The vaporized treatment liquid is discharged to the outside of the vacuum drying apparatus 2 via the suction port and the pipe 204. In order to prevent rapid vaporization (boiling) of the treatment liquid during the drying treatment, the ambient gas in the treatment chamber 220 is used (the step is called stepwise decompression. In the drying treatment, the substrate w is also in contact with the lifting plate 2〇) The upper surface of the surface is supported by the upper surface 2〇3a. Thereby, no space is formed on the back side of the product area of the substrate w, and airflow is not generated on the back side of the product area. When the ambient gas is almost reduced to a vacuum, the drying process is terminated. Further, while the ambient gas in the process chamber 220 is maintained under reduced pressure, as shown in FIG. 20, the lift plate 2〇3 is slightly raised to the connecting member 27〇. Since the support pin tree protrudes from the upper surface 2G3a of the lift plate 203, the substrate W is separated from the upper surface 203 &amp; that is, the dried substrate | will be processed in the chamber 22 In the decompressed state of the ambient gas in the crucible, the surface is separated from the upper surface 203a of the support floor during the drying process (step S25). Next, the processing gas is supplied to the processing chamber 220 by the supply mechanism 250 to be processed to 220 The gas returns to atmospheric pressure (step S26), and the lid 222 rises and the chamber 202 is opened (step S27). Next, by the driving of the lifting mechanism 232, the lifting plate 2〇3 is further raised to the position where the substrate W is transferred. During the ascending process and after the rise, the substrate w is also supported by the support H2324.doc • 27-1312857 pin 207 in a state of being separated from the upper surface 2〇33 of the lift plate 203 (step S28). 291 enters the chamber 202, and transfers the substrate W from the lift plate 203 to the shuttle 291. Further, after the lift plate 203 is lowered, the shuttle 291 is withdrawn to the outside of the chamber 202, and the substrate w is carried out to the outside of the vacuum drying device 201a. (Step S29) In the vacuum drying apparatus 2A of the third embodiment, when the processing liquid on the substrate W is dried, the surface of the upper surface of the lifting plate 203 is contacted with the surface.

At least the back side of the product region where the treatment liquid is present is integral and supports the (surface support) substrate W. Thereby, since a space is not formed on the back side of the product region of the substrate w, the substantial heat capacity of the entire product region is uniform, and no air flow is generated on the back side of the substrate W. Thereby, the temperature of the entire product region of the substrate w can be made uniform, and the unevenness of the treatment liquid can be effectively prevented. The ambient gas of the TM hard-working chamber 220 is further separated from the upper surface 203a of the lift plate 2〇3 as a support surface after the drying process. Generally, when the substrate w is brought into contact with the surface of the support surface, the base (4) (4) is generated by the difference in air pressure between the gas pressure of the ambient gas on the upper surface side of the substrate w and the gas pressure (substantially 0) between the substrate w and the support surface. The force of the support surface. If the substrate W on the upper surface side is not decompressed, and the substrate W that is in surface contact is separated from the support surface, friction will be generated between the substrate w and the support surface, and frictional charging occurs due to the friction. = Vacuum drying apparatus 2 of the present embodiment. Generally, if the substrate w is separated from the support surface in the reduced state of the atmosphere in the processing chamber 220, the substrate: the pressure of the ambient gas on the upper surface side of the substrate ^, thereby preventing the substrate U2324.doc -28 from being generated. - 1312857 w friction with the support surface. From the cloth, the US plate w is sparsely and effectively prevents the frictional electrification caused by the friction of the self-supporting surface leaving the earth plate. Furthermore, # JLjC W rti 4- 4Λ·Also causes stripping by leaving the substrate W and the supporting surface. 1 The stripping electrification does not change depending on the two kinds of substances depending on each other. Further, by means of the gift 2G7, the sheet W which is separated from the support surface by the point contact is used, and the transfer of the substrate 与 between the transfer mechanism and the conveyance mechanism is realized in the state of being supported by the point. That is, since the substrate W is not moved in the state of the self-supporting floor during the transfer of the substrate, the charging does not occur. Further, in the charging of the substrate w and the ruling surface, in addition to the above-described frictional charging, the material of the substrate W and the supporting surface is also used, and the contact f is generated only by the contact f generated by the contact. "Preventing the damage of the 7C piece due to such contact with the electric power, it is possible to form the surface of the elevating plate 2〇3 which constitutes the support surface of the substrate, and the coating layer is composed of, for example, a fluororesin such as A fl ο n (registered trademark of Japan). Insulation. Thereby, since the support surface is made of an insulating material, even if static electricity is generated as a contact charge, it is accumulated on the support surface. Before the support surface is grounded, if the static elimination device such as an ionizer is used, the component can be prevented from being destroyed. On the contrary, the conductor material can be coated on the surface of the lifting plate 203, and the lifting plate 203 can be grounded. For the conductor material, for example, a metal fine particle mixed with a fluororesin such as Aflon (registered trademark of Japan) can be used. Thereby, since the support surface is made of a conductor material and grounded, the static electricity can be actively released even if static electricity is generated on the surface of the support. Therefore, in this case, static electricity is accumulated on the support surface, and the destruction of the element can be effectively prevented. &lt;5. Fourth Embodiment Next, the fourth embodiment will be described. Fig. 21 is a view showing a schematic configuration of a pressure drying apparatus 2〇1b of the fourth embodiment minus 112324.doc -29-1312857. The same components as those of the decompression drying apparatus 20U of the embodiment are given the same reference numerals and the detailed description is omitted. In the third embodiment, the connecting member is used to cause the support pin 2〇7 to be ejected from the upper surface 2〇3a of the lift plate 203. On the other hand, the decompression drying apparatus 201b' of the fourth embodiment is provided with a dedicated lifting mechanism 275 for lifting and lowering the support pin 274. As shown in FIG. 21, the vacuum drying apparatus 2〇丨b has a plurality of support pins 2 for penetrating both the lift plate 203 and the base body 221. Further, corresponding to each of the support pins 274, the dedicated elevating mechanism 275 is disposed outside the chamber 2〇2 and is configured to be independently movable up and down. In the operation of the vacuum drying apparatus 201b, the support pin 274 is controlled in the same manner as in the third embodiment in the relative positional relationship with the upper surface 203a of the elevation plate 203. Therefore, in the vacuum drying apparatus 2011), when the substrate is dried, the support pin 274 is buried from the upper surface 203 of the lift plate 2〇3, and serves as the upper surface of the support surface 2〇3a. Contact and support the substrate W. Then, after the drying treatment, the support pin 274 is lifted from the upper surface 2〇3&amp; of the lift plate 203 while maintaining the pressure-reduced state, and the substrate W is separated from the support surface. Therefore, in the fourth embodiment, it is also possible to prevent charging of the substrate W when it is separated from the support surface. In the fourth embodiment, since the dedicated lifting mechanism 275 is required, and the airtight member 276 or the like is required to prevent air leakage around the lifting mechanism 275, the device configuration is changed as compared with the third embodiment. It’s complicated. Further, it is necessary to perform separate operation control of the elevating mechanism 275. Therefore, it is preferable that the connecting member 112324.doc -30- 1312857 2 70 as in the third embodiment can be provided to simplify the device configuration and operation control. &lt;6. Fifth embodiment&gt; Fig. 22 is a view showing a schematic configuration of a bird without a device in the fifth embodiment. In the configuration of the third embodiment, the same reference numerals will be given to the same components, and the detailed description will be omitted. The vacuum drying apparatus 2 of the fifth embodiment is configured such that the branch pin 277 is fixedly disposed, and the upper end portion of the support pin 277 is lifted from the lift plate 2〇3 by the upper and lower movements of the lift plate 2〇3. The upper surface 2 is infested. As shown in Fig. 22, the decompression drying skirt (10) support pins π are respectively inserted into the through holes of the lift plate 203, and the branches (4) 277 are fixed to the base body 221 of the chamber 2〇2. Since the base body 221 is used to define the position of the processing chamber 22, it can be said that the support pin 277 is relatively fixed to the processing chamber 22A. Further, the lifting plate 203' can be relatively lifted and lowered with respect to the base body 22 1 (processing chamber 220) in the same manner as the third embodiment. In the state shown in Fig. 22, the upper end portion of the support pin 277 is buried from the upper surface 203a of the lift plate 2〇3. Further, when the elevating plate 2〇3 is lowered from this state, as shown in Fig. 23, the upper end portion of the support pin 277 is relatively raised with respect to the elevating plate 2〇3 and protrudes from the upper surface 2〇3a of the elevating plate 203. In this state, the substrate w is in contact with the upper surface 203a of the lift plate 203 and supported by the upper surface 203a in a state where the lift plate 203 is raised. However, in a state where the lift plate 203 is lowered, the substrate w will become The point contacts the support pin 207 and is branched by the gift pin 207, and is separated from the upper surface 203a of the lift plate 203. In the vacuum drying apparatus 2 0 1 c, in the state shown in Fig. 22, drying treatment of 112324.doc -31 - 1312857 substrate w is performed. Thereby, the support pin 277 is buried from the upper surface 203a of the lift plate 2〇3 and is in surface contact with the surface 2〇3& as the support surface and supports the substrate W. Then, after the drying treatment, the elevating plate 2〇3 is lowered as shown in Fig. 23 while maintaining the decompressed state. Thereby, the support pin 277 protrudes from the upper surface 203a of the lift plate 203, and the substrate W is separated from the support surface. Therefore, in the fifth embodiment, it is possible to prevent charging of the substrate w when it is separated from the support surface. In the fifth embodiment, the support pin 277 is fixedly disposed, and the support pin 277 is ejected with respect to the support surface by the elevation of the lift plate 203. Therefore, the device does not need to be used for supporting the pin 277. very simple. &lt;7. Sixth embodiment&gt; Next, a sixth embodiment will be described. In the third to fifth embodiments described above, when the substrate is transferred between the transfer mechanism and the substrate, the substrate is supported by one lift plate. However, in recent years, since the size of the substrate has increased, and the substrate is bent only when the non-product region of the end portion of the substrate is supported, the transfer mechanism may support the back surface side of the product region near the center portion of the substrate. In this case, when the substrate is transferred between the transfer mechanism and the substrate, the substrate cannot be supported by one lift plate. The vacuum drying apparatus of the sixth embodiment is suitable for the person to be transported as described above. Fig. 24 is a view showing a schematic configuration of the vacuum drying apparatus 2〇ld of the sixth embodiment. The same components as those of the vacuum drying apparatus 201a of the third embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. The vacuum drying apparatus 2〇ld of the sixth embodiment differs from the pressure-reducing drying apparatus 20la of the third embodiment in that it supports the support of the support substrate w to the surface of the support 112324.doc - 32 - 1312857. More specifically, in the vacuum drying apparatus 20 Id, only one of the support surfaces of the support substrate W is constituted by the lift plate 23 3 only when the treatment liquid is dried, and the other portion is constituted by the fixed plate 225 which is fixedly disposed. As shown in Fig. 24, the reduced-pressure drying device 201d is provided with two lifting plates 233 which are disposed apart from each other. The two lifting plates 233 are disposed substantially horizontally at the same two degrees and are fixed to the same lifting mechanism 23 4 that can be raised and lowered in the vertical direction. Thus, by driving the elevating mechanism 234, the two elevating plates 233 are maintained in a substantially horizontal state while raising and lowering the same amount of movement in the same direction. Further, the vacuum drying apparatus 201 d is provided with three fixing plates 225 which are disposed substantially horizontally at the same height. These fixing plates 225 are fixed to the base body 221 via a coupling member such as a bolt. Further, for convenience of explanation, the illustration of the bonding members is omitted in the drawings. Fig. 24 shows a state in which the two lift plates 23 3 are lowered to the lower end. If the lifting plate 233 is lowered to the lower end as such, the lifting plates 233 will be disposed between the fixing plates 225. Further, the upper surface 233a of the two lifting plates 233 and the upper surface 225a of the three fixing plates 225 will have the same height and form a substantially horizontal plane. In the present embodiment, the surface formed by the lift plate 23 3 and the fixed plate 22 5 functions as a support floor when the substrate W is dried. Further, through holes are formed in each of the two lift plates 233, and support pins 207 are inserted into the through holes. Further, on the lower surface of the lift plate 23 3 , a connecting member 270 is provided on each of the support pins 207 . The structure of the connecting member 270 is the same as that of the third embodiment. Thereby, as shown in FIG. 24, in a state where the elevating plate 233 is lowered, the support pin 2〇7 is buried from the upper surface 233a of the elevating plate 23 3, but if the elevating plate 233 is raised, the support pin 207 will be lifted and lowered 112324. .doc • 33- 1312857 The upper surface 233a of the plate 233 protrudes. Hereinafter, the operation of the vacuum drying apparatus 2〇丨d configured as described above will be described. The 动作 operation 'is substantially the same as that shown in Fig. 16', and is explained using Fig. 16 . Further, in the present embodiment, 'the same time as the operation start time point of Fig. 16, the substrate W does not exist in the chamber 202, the lid body 222 rises, and the chamber 2〇2 is opened. First, one of the substrates W to be processed is carried into the chamber 2〇2. That is, as shown in Fig. 25, the hand 292 of the manipulator, which is the external transport mechanism of the chamber 2〇2, enters the chamber 202 which is open from the direction corresponding to the direction perpendicular to the plane of the support substrate w-plane. The robot uses the three hand portions 292 to support the back side of the product region at the center portion of the substrate W in addition to the non-product region of the support substrate. Next, as shown in Fig. 26, the two lift plates 233 are raised by the driving of the elevating mechanism 234, and enter the hands 292. At this time, the support pin 207 protrudes from the upper surface 233a of the lift plate 233. Therefore, the support pin 207 is in contact with the portion of the substrate W which is not supported by the hand 292 and supports the substrate W. Thereby, the substrate|transfer from the hand 292 to the lifting plate 233, and the hand 292 is ejected to a direction corresponding to the direction perpendicular to the drawing (step "I). Next, by the driving of the elevating mechanism 234, The two lift plates 233 are lowered until the upper surface 233a coincides with the height of the upper surface 225a of the fixed plate 225. If the lift plate 233 is lowered as described above, the support pins 2〇7 are buried in the upper surface 233a of the lift plate 233. Further, the upper surface 233a of the lifting plate 233 and the upper surface 225a of the fixing plate 225 form a supporting surface for supporting the substrate w. Thereby, after the lifting plate 233 is lowered, the supporting surface 233a, 112324.doc - 34 - 1312857 225a Contacting the entire lower surface of the substrate w, and substantially horizontally supporting the substrate W. Then, the cover 222 is lowered and adhered to the base body 221, and the chamber 2〇2 is closed. Thereby, the 'decompression drying device 201d becomes as shown in FIG. In the state shown, the processing chamber 220 in an airtight state is formed (step S23). Next, the ambient gas in the processing chamber 220 is depressurized, and the processing liquid on the substrate w is dried. In the drying process, the substrate is dried. W is also in contact with the support surface 23 3a, 225a are supported by the supporting surfaces (step S24). After the drying process is completed, the state of decompression of the ambient gas in the processing chamber 22 is maintained, and as shown in Fig. 27, the lifting plate 233 is slightly raised to the connecting member 27 The position away from the base body 221. Thereby, since the support pin 2〇7 protrudes from the upper surface 233a of the lift plate 233, the substrate is separated from the upper surface 233a (step S25). Thereby, in the sixth embodiment In the form, the charging of the substrate w from the support surface is also prevented. Next, the processing gas is supplied to the processing chamber 220, the ambient gas of the processing chamber 220 is returned to atmospheric pressure (step S26), and the lid 222 is raised, the chamber 202 is opened (step S27). Next, the two lift plates 233 are raised to the position where the substrate transfer is performed. During the rise and after the rise, the substrate w is separated from the upper surface 233a of the lift plate 233. The support pin 2〇7 is supported by the point (step S28). Next, the hand 292 enters the chamber 202 to transfer the substrate|from the lift plate 233 to the hand 292. Further, after the lift plate 233 is lowered, the hand 292 is withdrawn to Outside the chamber 202, the substrate will be moved In the case of the sixth embodiment, the substrate W between the transfer mechanism and the transfer mechanism is realized in the state of the point support. Since it is transmitted, charging is not generated in the transfer of the substrate w. Further, in the sixth embodiment, in order to prevent the element from being broken due to contact charging, the lifting plate 233 and the fixing plate 225 which constitute the supporting surface of the substrate W may be used. The surface coating is insulative, or the conductor material is coated and grounded.

&lt;8. Modifications of the third to sixth embodiments&gt; The third to sixth embodiments described above can be variously modified. An example of the shape of the third to sixth embodiments will be described below. In the third to fifth embodiments, in the drying process of the substrate w, the elevating plate 203 is in surface contact with the back side of the product region where the processing liquid is present, but if it is in surface contact with at least the entire back side of the product region, It can be in contact with a wider area. For example, the surface of the lifting plate 2〇3 may be brought into contact with the entire back surface of the substrate W to support the substrate w.

Further, in the sixth embodiment, when the substrate is processed, the support surface is in contact with the entire back surface of the substrate W by the support substrate w', but it is in surface contact with at least the entire back side of the product region where the processing liquid exists. Further, in the sixth embodiment, two lifting plates are provided, but three or more lifting plates may be provided depending on the size of the substrate W or the like. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic block diagram showing a reduced-thaw drying apparatus according to a third embodiment. Fig. 2 is a flow chart showing the operation of the vacuum drying apparatus. ® 3 is a diagram of one of the actions of the dry and sorrowful action. # # + &amp; ^ (4) II2324.doc -36 - 1312857 Figure 4 is a view showing one aspect of the operation of the reduced-pressure drying device. Fig. 5 is a view showing one aspect of the operation of the reduced-pressure drying device. Fig. 6 is a schematic block diagram showing a vacuum drying apparatus according to a second embodiment. ' _ 7 is a diagram of the state of the action of the vacuum drying device. The figure shows a diagram of one of the actions of the reduced-pressure drying device. Fig. 9 is a view showing one aspect of the operation of the vacuum drying apparatus. Fig. 10 is a view showing a vacuum drying apparatus having a blocking plate. Figure 11 is a diagram showing a vacuum drying apparatus without a occlusion plate. Fig. 12 is a view showing a vacuum drying apparatus having a temperature adjuster. Fig. 3 is a schematic view showing the configuration of the vacuum drying apparatus of the third embodiment. The figure shows an enlarged view of the configuration of the periphery of the connecting member. Fig. 15 is an enlarged view showing the configuration of the periphery of the connecting member. Fig. 16 is a flow chart showing the operation of the vacuum drying apparatus. Figure W is a view showing one aspect of the operation of the reduced-pressure drying device. • Item 18 shows a diagram of the behavior of the vacuum drying unit. Fig. 19 is a view showing an aspect of the operation of the vacuum drying apparatus. The figure shows a view of one of the actions of the vacuum drying apparatus. Fig. 21 is a schematic block diagram showing the vacuum drying apparatus of the fourth embodiment. Fig. 22 is a view showing the decompression &amp; (4) ^ &amp; Fig. 23 is a view showing an aspect of the operation of the vacuum drying apparatus. Figure 24 is a view showing the schematic configuration of the vacuum drying apparatus of the sixth embodiment 112324.doc -37- 1312857

Fig. 25 is a view showing a vacuum drying apparatus. Fig. 26 is a view showing a vacuum drying apparatus. Fig. 27 is a view showing a vacuum drying apparatus. [Main component symbol description] 2 Chamber 3 Lifting plate 20 Processing chamber 21 Base body 22 Cover body 25 Fixing plate 33 Lifting plate 202 chamber 203 lifting plate 207 supporting pin 220 processing chamber 221 base body 222 cover body 270 connecting member W substrate

A diagram of one of the actions. A diagram of one of the actions. A diagram of one of the actions. 112324.doc -38 ·

Claims (1)

L31 measuring Luo 731598 patent application for the year of April Zhuo] repair (more) is replacing the page Chinese application patent scope replacement (April 1998) X. Patent application scope: 1. A decompression dry position, its money It is: the decompression of the ambient gas in the treatment chamber and the treatment on the dry plate (4), and includes: a lifting plate and a fixing plate; the lifting plate-side is supported by the upper surface and the surface is supported by the substrate, Transferring the substrate between the transfer mechanisms outside the processing chamber; When the processing liquid on the substrate is dried, the substrate is supported by the surface of the upper surface of the fixing plate and the upper surface of the lifting plate in contact with at least the entire back surface side of the product region in which the processing liquid is present. 2. The decompression drying apparatus of claim 1, wherein the plurality of lifting plates of the crucible are disposed apart from each other. In the vacuum drying apparatus of the present invention, the distance between the lifting plate and the fixing plate which HP is connected to when the t surface is in contact with the back side of the substrate is not more than mm. 4. The vacuum drying apparatus according to claim 1, 2 or 3, further comprising a closing plate that closes a space between the abutting plate and the fixing plate when the surface is in contact with the back side of the substrate. A vacuum drying apparatus of length 1, 2 or 3, further comprising a temperature adjuster for adjusting a temperature difference between said lifting plate and said fixing plate. The vacuum drying apparatus of claim 1, 2 or 3, wherein the surface of the lifting plate and the surface of the fixing plate are made of a conductor material and grounded. 7. The vacuum drying apparatus according to claim 2, wherein the surface of the lifting plate and the surface of the fixing plate are made of an insulating material. 112324-980430.doc 1312857 _ _ ___________^··ι _ &quot;&quot;** 卜年爷月4日修 (more) replacement page A vacuum drying device, characterized by: The ambient gas is depressurized and dried the processing liquid on the substrate, and includes: a lifting plate that supports the substrate while the surface of the support floor is in contact with the back side of the substrate; The substrate is separated from the support surface in a reduced pressure state of the ambient gas in the processing chamber. 9. The reduced-pressure drying apparatus according to claim 8, wherein a support pin is provided which protrudes from the support surface to support the substrate, and the substrate is separated from the support surface by the support pin. 10. The vacuum drying apparatus of claim 9, further comprising: a linking member that transmits the lifting movement of the supporting surface to the support pin, in conjunction with the lifting of the supporting surface, so that the supporting pin is for the support The floor is infested. The vacuum drying apparatus of claim 9, wherein the support pin is relatively fixed to the processing chamber; Further, a lifting mechanism is provided which causes the support pin to be lifted on the support surface by relatively raising and lowering the support surface in the processing chamber. 12. The reduced-pressure drying apparatus according to any one of the preceding claims, wherein the surface of the above-mentioned riser plate is composed of a conductor material and is grounded. The vacuum drying apparatus according to any one of claims 8 to 11, wherein the surface of the above-mentioned riser plate is composed of an insulating material. 14. - The method of recording money" is characterized by: the liquid on the silky substrate, and includes: 112324-980430.doc 1312857 The April must be repaired (more) is replacing the page '... ..丨丨丨~^ supporting the substrate with a support surface and surface contact, a drying step of decompressing the ambient gas and drying the treatment liquid on the substrate; and maintaining the ambient gas after the drying step In the decompressed state, the step of leaving the substrate away from the support surface is performed. 112324-980430.doc 13 1Ϊ8^?31598 Patent Application Year of the Year: ^日修(more) replacement page Chinese pattern replacement page (April 1998) ____ XI, schema: 112324-980430.doc 1312857 51 52 53 54 55 56 ST 58 59 510 511 512 112324.doc Figure 2 1312857 image 3 112324.doc ,23 1312857 2 / 1 a S/ ,22 / Figure 5 twenty four 112324.doc -4- 13118»Royal 731598 Patent Application Chinese Graphic Replacement Page (April 1998) 112324-980430.doc 1312857 OJ 112324.doc 6- 1312857 112324.doc 7- 1312857 C\J 112324.doc 1312857 112324.doc 1312857 ❿ inch CVJ Inch CVJ OJ 112324.doc 10- 13 1 1598 Patent Application Chinese Graphic Replacement Page (April 1998) Inch C\J C\J 112324-980430.doc -11 - 13 1®8&gt;§ φ ΐ 598 Patent Application Chinese Illustrated Replacement Page (April 1998) Happy New Year's Day Fire (Re) Replacement Page 201a 112324-980430.doc 12- 1312857 ( v!v!v!v!v/!v:!v!vXv!-X One 2 〇 &lt;2033 罱14 112324.doc -13 - 1312857 521 522 523 524 525 526 S2T 528 529 112324.doc 14- '2231312857 202 罱17 /223 112324.doc -15 - &lt;223 1312857 2〇2, / 201a /222 / Figure 19 112324.doc -16- 1312857 Figure 21 - 223 201c '222 202- 224 2〇5一 -203a 1 -2 Up 203 m 2 Up 224 204 221 232 204- Figure 22 205 112324.doc -17 - 1312857 112324.doc Patent Application No. 18- 1311598 Chinese Graphic Replacement Page (April 1998) Inch OSI country 112324-980430.doc -19- 1312857 17C\JC\1 S wake up 112324.doc 20- 1312857 inch CSJCNJ 9OVJ wake up 112324.doc 1312857 卜 s 112324.doc -22 -