JP2007031829A - 蒸発装置 - Google Patents
蒸発装置 Download PDFInfo
- Publication number
- JP2007031829A JP2007031829A JP2006134634A JP2006134634A JP2007031829A JP 2007031829 A JP2007031829 A JP 2007031829A JP 2006134634 A JP2006134634 A JP 2006134634A JP 2006134634 A JP2006134634 A JP 2006134634A JP 2007031829 A JP2007031829 A JP 2007031829A
- Authority
- JP
- Japan
- Prior art keywords
- evaporator
- heating
- heating system
- tube
- evaporator tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 63
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 7
- 238000001704 evaporation Methods 0.000 claims description 8
- 230000008020 evaporation Effects 0.000 claims description 8
- 230000005855 radiation Effects 0.000 abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 238000009835 boiling Methods 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract description 2
- 230000008016 vaporization Effects 0.000 abstract description 2
- 238000009834 vaporization Methods 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 125000006850 spacer group Chemical group 0.000 description 7
- 238000009413 insulation Methods 0.000 description 6
- 239000000969 carrier Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 150000003481 tantalum Chemical class 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000011364 vaporized material Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/484—Insulated gate field-effect transistors [IGFETs] characterised by the channel regions
- H10K10/486—Insulated gate field-effect transistors [IGFETs] characterised by the channel regions the channel region comprising two or more active layers, e.g. forming pn heterojunctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
【解決手段】本発明は、基板をコーティングするための、特にOLEDのアルミニウム層を形成するための蒸発装置に関する。例えば、低い蒸気圧を有する材料を気化するために必要な温度のような高温に蒸発器チューブを加熱するために、加熱システムが蒸発器チューブ内に設置されている。それにより、熱損失が最小限度まで低減され、ほぼ同じ結合加熱電力で、チューブ温度がさらに高くなる。
【選択図】図1
Description
2 下部ハウジング部
3 上部ハウジング部
4,5 接続クランプ
6 接続ピン
7 基板
8 るつぼ
11 るつぼの内部
12 熱センサ
13 電気端子
15 断熱層
16 開口部
17 プランジャ
18 ロッド
19 蒸発器チューブ
21 蒸発器チューブの内部
22 電気ヒータ
23,24,37〜44 電気絶縁スペーサ・ブロック
26 カバー
28 遮蔽チューブ
30,31,32,33 ノズル
35,36 加熱素子
45 遮蔽チューブ
46 冷却チューブ
47 くさび状の窓
48 テーパ状部分
54,55,94,95 同心壁部
56,57 円筒状の壁部
58 冷却空間
60〜62 加熱素子
65,66 Y字形のキャリア
70,71 電気絶縁スペーサ
72〜77 ウェブ
78〜80 加熱ロッド
83,84 スペーサ・ブロック
90 蒸発器チューブ
91 断熱層
92 金属遮蔽シート
93 冷却チューブ
96〜98 分離ウェブ
99 ノズル棒
100,101 端部
102 内部ヒータ
103〜105 加熱ロッド
106,107 保持リング
Claims (11)
- 直線状分配装置(30〜33)および加熱システムを有する蒸発器(19,90)を備える基板をコーティングするための蒸発装置であって、気化される材料の表面が、第1の面内を延び、前記直線状分配装置(30〜33)が、前記第1の面に垂直な第2の面内に位置し、前記加熱システム(22;60〜62;78〜80;102)が、前記蒸発器(19,90)の内部に位置することを特徴とする蒸発装置。
- 前記加熱システムが、電気抵抗加熱システムであることを特徴とする請求項1に記載の蒸発装置。
- 前記加熱システム(60〜62)が、前記蒸発器(19,90)の中心に位置することを特徴とする請求項1に記載の蒸発装置。
- 前記加熱システム(22)が、前記蒸発器(19,90)の内壁部上に位置することを特徴とする請求項1に記載の蒸発装置。
- 前記加熱システム(60〜62;102)が、前記直線状分配装置の開口部(30〜33)のところに直接位置することを特徴とする請求項1に記載の蒸発装置。
- 前記直線状分配装置の開口部が、ノズル棒(99)により形成されていることと、前記蒸発器の棒に直接対向して、加熱システム(102)が設置されていることとを特徴とする請求項1に記載の蒸発装置。
- 前記加熱システムが、数本の加熱ロッド(103〜105)を備えることを特徴とする請求項1に記載の蒸発装置。
- 前記蒸発器(19,90)が管状であることを特徴とする請求項1に記載の蒸発装置。
- 前記加熱システムが、蛇行形の加熱素子(35,36)を備えることを特徴とする請求項1に記載の蒸発装置。
- 前記加熱システムが、ロッド状の加熱素子(103〜105)を備えることを特徴とする請求項1に記載の蒸発装置。
- 前記加熱ロッドが円筒状であることを特徴とする請求項7に記載の蒸発装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05016364A EP1752555A1 (de) | 2005-07-28 | 2005-07-28 | Verdampfervorrichtung |
EP05016364.1 | 2005-07-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007031829A true JP2007031829A (ja) | 2007-02-08 |
JP4711882B2 JP4711882B2 (ja) | 2011-06-29 |
Family
ID=35427460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006134634A Active JP4711882B2 (ja) | 2005-07-28 | 2006-05-15 | 蒸発装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070022956A1 (ja) |
EP (1) | EP1752555A1 (ja) |
JP (1) | JP4711882B2 (ja) |
KR (1) | KR100778945B1 (ja) |
CN (1) | CN1904129A (ja) |
TW (1) | TWI295694B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013519787A (ja) * | 2010-02-16 | 2013-05-30 | アストロン フィアム セーフティー | 気相蒸着供給源のための加熱システム |
EP3119920A1 (en) * | 2014-03-21 | 2017-01-25 | Applied Materials, Inc. | Evaporation source for organic material |
JP6205028B1 (ja) * | 2016-07-22 | 2017-09-27 | マシン・テクノロジー株式会社 | 蒸発装置およびそれに用いる固定具 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009049285A1 (en) * | 2007-10-12 | 2009-04-16 | University Of Delaware | Thermal evaporation sources for wide-area deposition |
KR101682348B1 (ko) * | 2008-05-30 | 2016-12-12 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 코팅용 장치 |
US20100154710A1 (en) * | 2008-12-18 | 2010-06-24 | Scott Wayne Priddy | In-vacuum deposition of organic materials |
KR101172275B1 (ko) * | 2009-12-31 | 2012-08-08 | 에스엔유 프리시젼 주식회사 | 기화 장치 및 이의 제어 방법 |
KR101265067B1 (ko) * | 2010-06-10 | 2013-05-16 | 한국과학기술연구원 | 측면 방출형 선형증발원, 그 제작 방법 및 선형증발기 |
FR2981667B1 (fr) * | 2011-10-21 | 2014-07-04 | Riber | Systeme d'injection pour dispositif de depot de couches minces par evaporation sous vide |
US20130105483A1 (en) * | 2011-10-28 | 2013-05-02 | Applied Materials, Inc. | Apparatus for sublimating solid state precursors |
KR20140025795A (ko) * | 2012-08-22 | 2014-03-05 | 에스엔유 프리시젼 주식회사 | 선택적 선형 증발 장치 |
US20150024538A1 (en) * | 2013-07-19 | 2015-01-22 | Tsmc Solar Ltd. | Vapor dispensing apparatus and method for solar panel |
CN106637091B (zh) * | 2017-02-24 | 2019-08-30 | 旭科新能源股份有限公司 | 用于薄膜太阳能电池制造的高温蒸发炉 |
CN107299322A (zh) * | 2017-08-07 | 2017-10-27 | 旭科新能源股份有限公司 | 一种立式低温蒸发束源炉 |
CN117660927A (zh) * | 2022-08-29 | 2024-03-08 | 中微半导体设备(上海)股份有限公司 | 一种温度控制部件及cvd反应装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0610118A (ja) * | 1992-06-29 | 1994-01-18 | Nec Kansai Ltd | 蒸着方法及び蒸発装置 |
JP2003253430A (ja) * | 2002-03-01 | 2003-09-10 | Ulvac Japan Ltd | 蒸発容器とその蒸発容器を有する成膜装置 |
JP2003277913A (ja) * | 2002-03-26 | 2003-10-02 | Eiko Engineering Co Ltd | 薄膜堆積用分子線源セル |
JP2004119380A (ja) * | 2002-09-23 | 2004-04-15 | Eastman Kodak Co | 粘性流れによる有機発光ダイオードデバイスの層の付着方法 |
JP2004183100A (ja) * | 2002-11-30 | 2004-07-02 | Applied Films Gmbh & Co Kg | 蒸着装置 |
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-
2005
- 2005-07-28 EP EP05016364A patent/EP1752555A1/de not_active Ceased
-
2006
- 2006-03-17 US US11/384,174 patent/US20070022956A1/en not_active Abandoned
- 2006-03-30 TW TW095111161A patent/TWI295694B/zh not_active IP Right Cessation
- 2006-04-19 CN CNA2006100666855A patent/CN1904129A/zh active Pending
- 2006-05-15 JP JP2006134634A patent/JP4711882B2/ja active Active
- 2006-06-12 KR KR1020060052770A patent/KR100778945B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0610118A (ja) * | 1992-06-29 | 1994-01-18 | Nec Kansai Ltd | 蒸着方法及び蒸発装置 |
JP2003253430A (ja) * | 2002-03-01 | 2003-09-10 | Ulvac Japan Ltd | 蒸発容器とその蒸発容器を有する成膜装置 |
JP2003277913A (ja) * | 2002-03-26 | 2003-10-02 | Eiko Engineering Co Ltd | 薄膜堆積用分子線源セル |
JP2004119380A (ja) * | 2002-09-23 | 2004-04-15 | Eastman Kodak Co | 粘性流れによる有機発光ダイオードデバイスの層の付着方法 |
JP2004183100A (ja) * | 2002-11-30 | 2004-07-02 | Applied Films Gmbh & Co Kg | 蒸着装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013519787A (ja) * | 2010-02-16 | 2013-05-30 | アストロン フィアム セーフティー | 気相蒸着供給源のための加熱システム |
EP3119920A1 (en) * | 2014-03-21 | 2017-01-25 | Applied Materials, Inc. | Evaporation source for organic material |
JP2017509794A (ja) * | 2014-03-21 | 2017-04-06 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 有機材料用の蒸発源 |
JP6205028B1 (ja) * | 2016-07-22 | 2017-09-27 | マシン・テクノロジー株式会社 | 蒸発装置およびそれに用いる固定具 |
JP2018012872A (ja) * | 2016-07-22 | 2018-01-25 | マシン・テクノロジー株式会社 | 蒸発装置およびそれに用いる固定具 |
Also Published As
Publication number | Publication date |
---|---|
US20070022956A1 (en) | 2007-02-01 |
CN1904129A (zh) | 2007-01-31 |
EP1752555A1 (de) | 2007-02-14 |
TW200704796A (en) | 2007-02-01 |
TWI295694B (en) | 2008-04-11 |
KR20070014960A (ko) | 2007-02-01 |
KR100778945B1 (ko) | 2007-11-22 |
JP4711882B2 (ja) | 2011-06-29 |
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