JP2006527666A5 - - Google Patents

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Publication number
JP2006527666A5
JP2006527666A5 JP2006515661A JP2006515661A JP2006527666A5 JP 2006527666 A5 JP2006527666 A5 JP 2006527666A5 JP 2006515661 A JP2006515661 A JP 2006515661A JP 2006515661 A JP2006515661 A JP 2006515661A JP 2006527666 A5 JP2006527666 A5 JP 2006527666A5
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JP
Japan
Prior art keywords
metal
ceramic
ceramic substrate
ceramic layer
production process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2006515661A
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English (en)
Japanese (ja)
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JP2006527666A (ja
JP5047615B2 (ja
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Publication date
Priority claimed from DE10327360A external-priority patent/DE10327360B4/de
Application filed filed Critical
Publication of JP2006527666A publication Critical patent/JP2006527666A/ja
Publication of JP2006527666A5 publication Critical patent/JP2006527666A5/ja
Application granted granted Critical
Publication of JP5047615B2 publication Critical patent/JP5047615B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2006515661A 2003-06-16 2004-05-14 セラミック金属基板の製造方法 Expired - Fee Related JP5047615B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10327360.3 2003-06-16
DE10327360A DE10327360B4 (de) 2003-06-16 2003-06-16 Verfahren zum Herstellen eines Keramik-Metall-Substrates
PCT/DE2004/001012 WO2004113041A2 (de) 2003-06-16 2004-05-14 Verfahren zum herstellen eines keramik-metall-substrates

Publications (3)

Publication Number Publication Date
JP2006527666A JP2006527666A (ja) 2006-12-07
JP2006527666A5 true JP2006527666A5 (enExample) 2007-03-29
JP5047615B2 JP5047615B2 (ja) 2012-10-10

Family

ID=33495108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006515661A Expired - Fee Related JP5047615B2 (ja) 2003-06-16 2004-05-14 セラミック金属基板の製造方法

Country Status (5)

Country Link
US (1) US20060183298A1 (enExample)
EP (1) EP1634326A2 (enExample)
JP (1) JP5047615B2 (enExample)
DE (1) DE10327360B4 (enExample)
WO (1) WO2004113041A2 (enExample)

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DE102005022160A1 (de) * 2005-05-13 2006-11-16 Daimlerchrysler Ag Ölpumpe mit integrierter Stromregeleinrichtung
US20080070378A1 (en) * 2006-09-19 2008-03-20 Jong-Souk Yeo Dual laser separation of bonded wafers
US20100320249A1 (en) * 2007-02-28 2010-12-23 Claus Peter Kluge Method for producing a component using asymmetrical energy input along the parting or predetermined breaking line
US8496866B2 (en) 2007-04-25 2013-07-30 Ceramtec Gmbh Chip resistor substrate
DE102009015520A1 (de) * 2009-04-02 2010-10-07 Electrovac Ag Metall-Keramik-Substrat
JP5537081B2 (ja) 2009-07-28 2014-07-02 浜松ホトニクス株式会社 加工対象物切断方法
US9035163B1 (en) 2011-05-10 2015-05-19 Soundbound, Inc. System and method for targeting content based on identified audio and multimedia
DE102012102611B4 (de) * 2012-02-15 2017-07-27 Rogers Germany Gmbh Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE102012104903B4 (de) * 2012-05-10 2023-07-13 Rogers Germany Gmbh Verfahren zum Herstellen von Metall-Keramik-Substraten sowie nach diesem Verfahren hergestelltes Metall-Keramik-Substrat
DE102013105528B4 (de) * 2013-05-29 2021-09-02 Rogers Germany Gmbh Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates
US20190009362A1 (en) * 2015-12-22 2019-01-10 Heraeus Deutschland GmbH & Co. KG Method for producing a metal-ceramic substrate with picolaser
JP6853455B2 (ja) * 2017-02-23 2021-03-31 三菱マテリアル株式会社 パワーモジュール用基板の製造方法
TWI769254B (zh) * 2017-05-16 2022-07-01 德商賀利氏德國有限責任兩合公司 具有低非晶形相之陶瓷金屬基板
TWI651193B (zh) * 2017-12-06 2019-02-21 李宜臻 金屬陶瓷積層散熱基板之製造方法、及包含該金屬陶瓷積層散熱基板之電子裝置及發光二極體
CN111684584A (zh) * 2018-02-01 2020-09-18 康宁股份有限公司 用于卷形式的电子封装和其他应用的单一化基材
WO2019222330A2 (en) * 2018-05-17 2019-11-21 Corning Incorporated Singulated electronic substrates on a flexible or rigid carrier and related methods
EP3799541A4 (en) * 2018-05-23 2022-03-16 Sumitomo Bakelite Co.Ltd. Method for manufacturing circuit board
US20200368804A1 (en) * 2019-05-24 2020-11-26 Trusval Technology Co., Ltd. Manufacturing process for heat sink composite having heat dissipation function and manufacturing method for its finished product
KR20220105849A (ko) * 2021-01-21 2022-07-28 주식회사 엘엑스세미콘 인쇄회로용 기판의 제조방법
CN116904913A (zh) * 2023-08-01 2023-10-20 江苏富乐华半导体科技股份有限公司 一种dcb的铜片氧化方法

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JPH0810710B2 (ja) 1984-02-24 1996-01-31 株式会社東芝 良熱伝導性基板の製造方法
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JP3404352B2 (ja) * 2000-03-29 2003-05-06 京セラ株式会社 多数個取りセラミック配線基板
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JP4886937B2 (ja) * 2001-05-17 2012-02-29 リンテック株式会社 ダイシングシート及びダイシング方法
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