DE10327360B4 - Verfahren zum Herstellen eines Keramik-Metall-Substrates - Google Patents

Verfahren zum Herstellen eines Keramik-Metall-Substrates Download PDF

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Publication number
DE10327360B4
DE10327360B4 DE10327360A DE10327360A DE10327360B4 DE 10327360 B4 DE10327360 B4 DE 10327360B4 DE 10327360 A DE10327360 A DE 10327360A DE 10327360 A DE10327360 A DE 10327360A DE 10327360 B4 DE10327360 B4 DE 10327360B4
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DE
Germany
Prior art keywords
ceramic layer
ceramic
metal
separation
predetermined breaking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10327360A
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German (de)
English (en)
Other versions
DE10327360A1 (de
Inventor
Dr. Schulz-Harder Jürgen
Dr. Exel Karl
Ing. Mitteregger Kurt
Jürgen Weisser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rogers Germany GmbH
Original Assignee
Curamik Electronics GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Curamik Electronics GmbH filed Critical Curamik Electronics GmbH
Priority to DE10327360A priority Critical patent/DE10327360B4/de
Priority to PCT/DE2004/001012 priority patent/WO2004113041A2/de
Priority to EP04732932A priority patent/EP1634326A2/de
Priority to US10/560,525 priority patent/US20060183298A1/en
Priority to JP2006515661A priority patent/JP5047615B2/ja
Publication of DE10327360A1 publication Critical patent/DE10327360A1/de
Application granted granted Critical
Publication of DE10327360B4 publication Critical patent/DE10327360B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/4807—Ceramic parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/481—Insulating layers on insulating parts, with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/102—Using microwaves, e.g. for curing ink patterns or adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
DE10327360A 2003-06-16 2003-06-16 Verfahren zum Herstellen eines Keramik-Metall-Substrates Expired - Fee Related DE10327360B4 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE10327360A DE10327360B4 (de) 2003-06-16 2003-06-16 Verfahren zum Herstellen eines Keramik-Metall-Substrates
PCT/DE2004/001012 WO2004113041A2 (de) 2003-06-16 2004-05-14 Verfahren zum herstellen eines keramik-metall-substrates
EP04732932A EP1634326A2 (de) 2003-06-16 2004-05-14 Verfahren zum herstellen eines keramik-metall-substrates
US10/560,525 US20060183298A1 (en) 2003-06-16 2004-05-14 Method for manufacturing a ceramic/metal substrate
JP2006515661A JP5047615B2 (ja) 2003-06-16 2004-05-14 セラミック金属基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10327360A DE10327360B4 (de) 2003-06-16 2003-06-16 Verfahren zum Herstellen eines Keramik-Metall-Substrates

Publications (2)

Publication Number Publication Date
DE10327360A1 DE10327360A1 (de) 2005-01-05
DE10327360B4 true DE10327360B4 (de) 2012-05-24

Family

ID=33495108

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10327360A Expired - Fee Related DE10327360B4 (de) 2003-06-16 2003-06-16 Verfahren zum Herstellen eines Keramik-Metall-Substrates

Country Status (5)

Country Link
US (1) US20060183298A1 (enExample)
EP (1) EP1634326A2 (enExample)
JP (1) JP5047615B2 (enExample)
DE (1) DE10327360B4 (enExample)
WO (1) WO2004113041A2 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005022160A1 (de) * 2005-05-13 2006-11-16 Daimlerchrysler Ag Ölpumpe mit integrierter Stromregeleinrichtung
US20080070378A1 (en) * 2006-09-19 2008-03-20 Jong-Souk Yeo Dual laser separation of bonded wafers
ES2436775T3 (es) * 2007-02-28 2014-01-07 Ceramtec Gmbh Procedimiento para la producción de una pieza constructiva mediando utilización de una introducción asimétrica de energía a lo largo de la línea de separación o de rotura nominal
EP2151149A1 (de) 2007-04-25 2010-02-10 CeramTec AG Chip-resistor-substrat
DE102009015520A1 (de) * 2009-04-02 2010-10-07 Electrovac Ag Metall-Keramik-Substrat
JP5537081B2 (ja) 2009-07-28 2014-07-02 浜松ホトニクス株式会社 加工対象物切断方法
US9035163B1 (en) 2011-05-10 2015-05-19 Soundbound, Inc. System and method for targeting content based on identified audio and multimedia
DE102012102611B4 (de) * 2012-02-15 2017-07-27 Rogers Germany Gmbh Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE102012104903B4 (de) * 2012-05-10 2023-07-13 Rogers Germany Gmbh Verfahren zum Herstellen von Metall-Keramik-Substraten sowie nach diesem Verfahren hergestelltes Metall-Keramik-Substrat
DE102013105528B4 (de) * 2013-05-29 2021-09-02 Rogers Germany Gmbh Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates
KR20180097554A (ko) * 2015-12-22 2018-08-31 헤레우스 도이칠란트 게엠베하 운트 코. 카게 피코 레이저를 사용하여 금속-세라믹 기판을 생성하기 위한 방법
JP6853455B2 (ja) * 2017-02-23 2021-03-31 三菱マテリアル株式会社 パワーモジュール用基板の製造方法
EP3544940B1 (en) * 2017-05-16 2022-12-21 Heraeus Deutschland GmbH & Co. KG Ceramic-metal substrate with low amorphous phase
TWI651193B (zh) * 2017-12-06 2019-02-21 李宜臻 金屬陶瓷積層散熱基板之製造方法、及包含該金屬陶瓷積層散熱基板之電子裝置及發光二極體
CN111684584A (zh) * 2018-02-01 2020-09-18 康宁股份有限公司 用于卷形式的电子封装和其他应用的单一化基材
WO2019222330A2 (en) * 2018-05-17 2019-11-21 Corning Incorporated Singulated electronic substrates on a flexible or rigid carrier and related methods
EP3799541A4 (en) * 2018-05-23 2022-03-16 Sumitomo Bakelite Co.Ltd. Method for manufacturing circuit board
US20200368804A1 (en) * 2019-05-24 2020-11-26 Trusval Technology Co., Ltd. Manufacturing process for heat sink composite having heat dissipation function and manufacturing method for its finished product
KR20220105849A (ko) * 2021-01-21 2022-07-28 주식회사 엘엑스세미콘 인쇄회로용 기판의 제조방법
CN116904913A (zh) * 2023-08-01 2023-10-20 江苏富乐华半导体科技股份有限公司 一种dcb的铜片氧化方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3556366A (en) * 1969-05-01 1971-01-19 Teletype Corp Methods of severing materials employing a thermal shock
US3744120A (en) * 1972-04-20 1973-07-10 Gen Electric Direct bonding of metals with a metal-gas eutectic
DE2213115C3 (de) * 1972-03-17 1975-12-04 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum hochfesten Verbinden von Keramiken aus Karbiden, einschließlich des Diamanten, Boriden, Nitriden oder Suiziden mit Metall nach dem Trocken-Lötverfahren
DE2319854C2 (de) * 1972-04-20 1983-12-29 General Electric Co., Schenectady, N.Y. Verfahren zum direkten Verbinden eines Metallteiles mit einem aus nichtmetallischem Material bestehenden Substraten
EP0872303A2 (de) * 1997-04-14 1998-10-21 Schott Glas Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödem Material, insbesondere aus Glas
US6211488B1 (en) * 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0810710B2 (ja) 1984-02-24 1996-01-31 株式会社東芝 良熱伝導性基板の製造方法
JPH04331781A (ja) * 1990-11-29 1992-11-19 Nippon Carbide Ind Co Inc セラミックス複合体
RU2024441C1 (ru) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
DK0613765T3 (da) * 1993-03-02 2000-04-03 Ceramtec Ag Fremgangsmåde til fremstilling af opdelelige plader af et sprødt materiale med stor nøjagtighed
EP0862209B1 (de) * 1997-03-01 2009-12-16 Electrovac AG Verfahren zum Herstellen eines Metall-Keramik-Substrates
US6207221B1 (en) 1997-03-01 2001-03-27 Jürgen Schulz-Harder Process for producing a metal-ceramic substrate and a metal-ceramic substrate
US6420678B1 (en) 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
DE19927046B4 (de) * 1999-06-14 2007-01-25 Electrovac Ag Keramik-Metall-Substrat als Mehrfachsubstrat
JP2001176820A (ja) * 1999-12-15 2001-06-29 Hitachi Cable Ltd 基板の加工方法及びその加工装置
JP3404352B2 (ja) * 2000-03-29 2003-05-06 京セラ株式会社 多数個取りセラミック配線基板
US6444499B1 (en) * 2000-03-30 2002-09-03 Amkor Technology, Inc. Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components
JP4886937B2 (ja) * 2001-05-17 2012-02-29 リンテック株式会社 ダイシングシート及びダイシング方法
KR100701013B1 (ko) * 2001-05-21 2007-03-29 삼성전자주식회사 레이저 빔을 이용한 비금속 기판의 절단방법 및 장치
JP2003088973A (ja) * 2001-09-12 2003-03-25 Hamamatsu Photonics Kk レーザ加工方法
JP3886756B2 (ja) * 2001-09-13 2007-02-28 独立行政法人科学技術振興機構 レーザ割断方法およびその方法を使用したレンズまたはレンズ型を製造する方法ならびにその製造方法によって成形されたレンズ、レンズ型
TW568809B (en) * 2001-09-21 2004-01-01 Mitsuboshi Diamond Ind Co Ltd Method for scribing substrate of brittle material and scriber

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3556366A (en) * 1969-05-01 1971-01-19 Teletype Corp Methods of severing materials employing a thermal shock
DE2213115C3 (de) * 1972-03-17 1975-12-04 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum hochfesten Verbinden von Keramiken aus Karbiden, einschließlich des Diamanten, Boriden, Nitriden oder Suiziden mit Metall nach dem Trocken-Lötverfahren
US3744120A (en) * 1972-04-20 1973-07-10 Gen Electric Direct bonding of metals with a metal-gas eutectic
DE2319854C2 (de) * 1972-04-20 1983-12-29 General Electric Co., Schenectady, N.Y. Verfahren zum direkten Verbinden eines Metallteiles mit einem aus nichtmetallischem Material bestehenden Substraten
EP0872303A2 (de) * 1997-04-14 1998-10-21 Schott Glas Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödem Material, insbesondere aus Glas
US6211488B1 (en) * 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe

Also Published As

Publication number Publication date
DE10327360A1 (de) 2005-01-05
WO2004113041A2 (de) 2004-12-29
US20060183298A1 (en) 2006-08-17
EP1634326A2 (de) 2006-03-15
JP2006527666A (ja) 2006-12-07
WO2004113041A3 (de) 2005-02-24
JP5047615B2 (ja) 2012-10-10

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