JP2006523763A5 - - Google Patents
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- Publication number
- JP2006523763A5 JP2006523763A5 JP2006509939A JP2006509939A JP2006523763A5 JP 2006523763 A5 JP2006523763 A5 JP 2006523763A5 JP 2006509939 A JP2006509939 A JP 2006509939A JP 2006509939 A JP2006509939 A JP 2006509939A JP 2006523763 A5 JP2006523763 A5 JP 2006523763A5
- Authority
- JP
- Japan
- Prior art keywords
- stabilizers
- aliphatic diamine
- composition
- weight percent
- diamine component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims description 44
- -1 aliphatic diamine Chemical class 0.000 claims description 24
- 239000003381 stabilizer Substances 0.000 claims description 20
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 15
- NAQMVNRVTILPCV-UHFFFAOYSA-N Hexamethylenediamine Chemical group NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims description 14
- KKEYFWRCBNTPAC-UHFFFAOYSA-N terephthalic acid group Chemical group C(C1=CC=C(C(=O)O)C=C1)(=O)O KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 13
- 150000001735 carboxylic acids Chemical class 0.000 claims description 10
- 229920001577 copolymer Polymers 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 10
- 239000004952 Polyamide Substances 0.000 claims description 8
- 229920002647 polyamide Polymers 0.000 claims description 8
- 150000008064 anhydrides Chemical class 0.000 claims description 6
- 239000004760 aramid Substances 0.000 claims description 6
- 229920003235 aromatic polyamide Polymers 0.000 claims description 6
- 239000000155 melt Substances 0.000 claims description 6
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 claims description 5
- 239000004609 Impact Modifier Substances 0.000 claims description 5
- 229920001038 ethylene copolymer Polymers 0.000 claims description 5
- 239000011528 polyamide (building material) Substances 0.000 claims description 5
- 229920000573 polyethylene Polymers 0.000 claims description 5
- 150000003923 2,5-pyrrolediones Chemical class 0.000 claims description 4
- XGJHPGPVESLKKD-UHFFFAOYSA-N 2-ethylbutane-1,4-diamine Chemical compound CCC(CN)CCN XGJHPGPVESLKKD-UHFFFAOYSA-N 0.000 claims description 4
- AQSJGOWTSHOLKH-UHFFFAOYSA-N Phosphite Chemical compound [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 claims description 4
- 229920002725 Thermoplastic elastomer Polymers 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 150000001336 alkenes Chemical class 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 claims description 4
- 150000004982 aromatic amines Chemical class 0.000 claims description 4
- LROMFDHROPKFSO-UHFFFAOYSA-N dioxidophosphane Chemical compound [O-]P[O-] LROMFDHROPKFSO-UHFFFAOYSA-N 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 229920000554 ionomer Polymers 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000011342 resin composition Substances 0.000 claims description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- 229920001897 terpolymer Polymers 0.000 claims description 4
- FPYJFEHAWHCUMM-UHFFFAOYSA-N Maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US46271603P | 2003-04-14 | 2003-04-14 | |
US60/462,716 | 2003-04-14 | ||
PCT/US2004/011250 WO2004092274A1 (en) | 2003-04-14 | 2004-04-08 | Polyamide composition for blow molded articles |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006523763A JP2006523763A (ja) | 2006-10-19 |
JP2006523763A5 true JP2006523763A5 (pt) | 2007-05-31 |
JP5226211B2 JP5226211B2 (ja) | 2013-07-03 |
Family
ID=33299982
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006509939A Expired - Fee Related JP5226211B2 (ja) | 2003-04-14 | 2004-04-08 | ブロー成形物品用のポリアミド組成物 |
Country Status (7)
Country | Link |
---|---|
US (2) | US20040242737A1 (pt) |
EP (1) | EP1613697A1 (pt) |
JP (1) | JP5226211B2 (pt) |
KR (1) | KR101070502B1 (pt) |
CN (1) | CN100480328C (pt) |
BR (1) | BRPI0409758A (pt) |
WO (1) | WO2004092274A1 (pt) |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2277675B1 (en) | 2003-08-19 | 2012-04-04 | Solvay Specialty Polymers USA, LLC. | Impact-modified polyamide hollow body |
EP1683830A1 (en) | 2005-01-12 | 2006-07-26 | DSM IP Assets B.V. | Heat stabilized moulding composition |
EP1681313A1 (en) * | 2005-01-17 | 2006-07-19 | DSM IP Assets B.V. | Heat stabilized moulding composition |
KR100756349B1 (ko) * | 2006-12-18 | 2007-09-10 | 제일모직주식회사 | 나일론계 수지 복합재 |
US8227817B2 (en) * | 2006-12-22 | 2012-07-24 | Qunano Ab | Elevated LED |
WO2009045416A1 (en) * | 2007-10-04 | 2009-04-09 | E.I. Du Pont De Nemours And Company | Vehicular electrical and electronic housings |
KR20100085084A (ko) * | 2007-10-04 | 2010-07-28 | 인테그란 테크놀로지즈 인코포레이티드 | 휴대용 전자 디바이스를 위한 금속 코팅된 구조부 |
WO2009045415A1 (en) * | 2007-10-04 | 2009-04-09 | E. I. Du Pont De Nemours And Company | Internal combustion engine covers |
EP2193294B1 (en) * | 2007-10-04 | 2013-01-02 | Integran Technologies | Vehicular transmission parts |
WO2009045437A1 (en) * | 2007-10-04 | 2009-04-09 | E. I. Du Pont De Nemours And Company | Vehicular suspension components |
US20100290899A1 (en) * | 2007-10-04 | 2010-11-18 | Morph Technologies, Inc. | Vehicular turbocharger components |
WO2009067413A1 (en) * | 2007-11-19 | 2009-05-28 | E. I. Du Pont De Nemours And Company | Use of polyamide compositions for making molded articles having improved adhesion, molded articles thereof and methods for adhering such materials |
KR100878574B1 (ko) * | 2007-12-28 | 2009-01-15 | 제일모직주식회사 | 나일론/보강 섬유 조성물 |
ITTO20080404A1 (it) * | 2008-05-27 | 2009-11-28 | Dayco Fluid Technologies Spa | Elemento cavo per il trasporto di un fluido refrigerante in un autoveicolo |
JP5667054B2 (ja) * | 2008-07-30 | 2015-02-12 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company | ポリヒドロキシポリマーを含む耐熱性熱可塑性物品 |
IT1391195B1 (it) * | 2008-08-06 | 2011-11-18 | Dayco Fluid Technologies Spa | Gruppo di adduzione per un circuito di aria condizionata e relativo metodo di realizzazione |
US8293831B2 (en) * | 2008-10-30 | 2012-10-23 | E I Du Pont De Nemours And Company | Thermoplastic composition including thermally conductive filler and hyperbranched polyesteramide |
US20100168270A1 (en) | 2008-12-31 | 2010-07-01 | Xiaoping Guo | Biocompatible polycarbonate and radiopaque polymer compositions and methods of manufacturing medical devices with same |
US20110028621A1 (en) * | 2009-07-30 | 2011-02-03 | E. I. Du Pont De Nemours And Company | Heat aging resistant polyamide compositions including polyhydroxy polymers |
WO2011015790A2 (fr) * | 2009-08-06 | 2011-02-10 | Arkema France | Composition comprenant un copolyamide et une polyolefine reticulee |
KR101203339B1 (ko) | 2009-09-30 | 2012-11-20 | 코오롱인더스트리 주식회사 | 아라미드 섬유 및 그 제조방법 |
CN102858877B (zh) | 2010-03-08 | 2015-04-29 | 宇部兴产株式会社 | 聚酰胺树脂组合物 |
EP2410020B1 (de) | 2010-07-23 | 2013-01-30 | Ems-Patent Ag | Teilaromatische Polyamid-Formmassen und deren Verwendungen |
TWI529212B (zh) * | 2010-08-18 | 2016-04-11 | Vertellus Specialties Inc | 由混練聚醯胺與烯烴-順丁烯二酐聚合物所形成之組合物、方法及製品 |
WO2012023671A1 (ko) * | 2010-08-20 | 2012-02-23 | 제일모직 주식회사 | 휴대용 디스플레이 제품의 lcd 보호용 브라켓 |
KR101374361B1 (ko) * | 2010-08-20 | 2014-03-18 | 제일모직주식회사 | 휴대용 디스플레이 제품의 lcd 보호용 브라켓 |
EP2608960B1 (en) | 2010-08-23 | 2020-05-20 | Cryovac, LLC | Ovenable heat-sealed package |
US20120108136A1 (en) * | 2010-10-29 | 2012-05-03 | E.I. Du Pont De Nemours And Company | Overmolded polyamide composite structures and processes for their preparation |
US20120177858A1 (en) * | 2011-01-10 | 2012-07-12 | E.I. Du Pont De Nemours And Company | Polyamide compositions for flow molding |
US8691911B2 (en) * | 2011-01-31 | 2014-04-08 | E I Du Pont De Nemours And Company | Melt-blended thermoplastic composition |
US20120196961A1 (en) * | 2011-01-31 | 2012-08-02 | E. I. Du Pont De Nemours And Company | Thermoplastic composition with hydroxy amino acid heat stabilizer |
US20120196962A1 (en) * | 2011-01-31 | 2012-08-02 | E. I. Du Pont De Nemours And Company | Thermoplastic melt-mixed composition with heat stabilizer |
US9624372B2 (en) * | 2011-03-31 | 2017-04-18 | Nitta Corporation | Belt |
US8921460B2 (en) * | 2011-06-21 | 2014-12-30 | E. I. Du Pont De Nemours And Company | Heat-stabilized acrylate elastomer composition and process for its production |
US8791180B2 (en) | 2011-06-21 | 2014-07-29 | E I Du Pont De Nemours And Company | Process for production of a heat-stabilized acrylate polymer |
JP6000084B2 (ja) * | 2011-11-17 | 2016-09-28 | ユニチカ株式会社 | 半芳香族ポリアミド樹脂組成物 |
CN102702733B (zh) * | 2012-06-15 | 2014-11-26 | 东莞市意普万尼龙科技股份有限公司 | 一种增强型尼龙进气管吹塑专用复合材料及其制备方法 |
CN103073880A (zh) * | 2012-12-25 | 2013-05-01 | 广州鹿山新材料股份有限公司 | 一种增韧尼龙复合物及其制备方法 |
US20140187691A1 (en) * | 2012-12-28 | 2014-07-03 | Cheil Industries Inc. | Flame Retardant Polyamide Resin Composition and Molded Article Comprising the Same |
KR101690832B1 (ko) * | 2014-02-27 | 2016-12-28 | 롯데첨단소재(주) | 도장 성형품 |
EP2927272B1 (de) | 2014-03-31 | 2017-08-16 | Ems-Patent Ag | Polyamid-Formmassen, Verfahren zu deren Herstellung und Verwendungen dieser Polyamid-Formmassen |
WO2016012563A1 (en) * | 2014-07-25 | 2016-01-28 | Dsm Ip Assets B.V. | Heat stabilized polyamide composition |
WO2016012558A1 (en) * | 2014-07-25 | 2016-01-28 | Dsm Ip Assets B.V. | Blow molded container |
EP3262122B1 (en) * | 2015-02-27 | 2020-07-29 | 3M Innovative Properties Company | Polyamide composition including hollow glass microspheres and articles and methods relating to the same |
CN105733254B (zh) * | 2016-05-16 | 2018-02-13 | 上海日之升科技有限公司 | 一种熔体稳定且具有耐氯化物溶液特性的聚酰胺材料及其制备方法 |
JP2019529608A (ja) * | 2016-09-28 | 2019-10-17 | ディーエスエム アイピー アセッツ ビー.ブイ.Dsm Ip Assets B.V. | ポリマー組成物、成形部品およびそれを製造するための方法 |
EP3519502A1 (en) * | 2016-09-28 | 2019-08-07 | DSM IP Assets B.V. | Polymer composition, molded part and processes for production thereof |
CN106543717B (zh) * | 2016-11-05 | 2018-02-09 | 上海耐特复合材料制品有限公司 | 一种高强度透纤尼龙复合材料 |
EP3652253A1 (de) * | 2017-07-13 | 2020-05-20 | LANXESS Deutschland GmbH | Thermostabilisierte zusammensetzungen |
JP2020527183A (ja) * | 2017-07-13 | 2020-09-03 | ランクセス・ドイチュランド・ゲーエムベーハー | 熱安定化組成物 |
EP3476898B1 (en) * | 2017-10-27 | 2021-05-05 | Henkel AG & Co. KGaA | Thermoplastic composition for 3d printing |
CN111433026B (zh) * | 2017-12-05 | 2021-09-17 | 利安德巴塞尔先进聚合物公司 | 高性能聚酰胺化合物及其用途 |
CN107868257B (zh) * | 2017-12-06 | 2020-11-17 | 广州辰东新材料有限公司 | 半芳香族尼龙-长链脂肪族尼龙复合物及其制备方法、尼龙复合材料及其制备方法与应用 |
CN111448257B (zh) * | 2017-12-11 | 2023-08-01 | Ube株式会社 | 聚酰胺树脂组合物 |
JP7074531B2 (ja) * | 2018-03-28 | 2022-05-24 | 旭化成株式会社 | ポリアミド樹脂組成物及び成形品 |
JP7379003B2 (ja) * | 2018-09-07 | 2023-11-14 | Ube株式会社 | ポリアミド樹脂組成物 |
US20220098379A1 (en) | 2019-01-30 | 2022-03-31 | Basf Se | A method for producing an intrinsically foamed polyamide and a shaped article therefrom |
WO2020225176A1 (en) | 2019-05-08 | 2020-11-12 | Basf Se | A polyamide composition and a tubular or pipe multilayer structure comprising the same |
EP4077542A1 (en) | 2019-12-16 | 2022-10-26 | Basf Se | Industrial fan or blower comprising a flame-retardant polyamide composition |
JP7468189B2 (ja) | 2020-06-26 | 2024-04-16 | Ube株式会社 | ポリアミド樹脂組成物 |
TW202334302A (zh) * | 2021-11-09 | 2023-09-01 | 美商阿散德性能材料營運公司 | 用於長期高溫應用的聚醯胺配製劑 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5251464A (en) * | 1975-10-23 | 1977-04-25 | Toppan Printing Co Ltd | Method and device for producing plastic tube |
FR2656823B1 (fr) * | 1990-01-09 | 1992-06-12 | Kerplas Snc | Poincon pour injection-soufflage d'un corps creux et machine utilisant un tel poincon. |
JPH04159362A (ja) * | 1990-10-22 | 1992-06-02 | Mitsui Petrochem Ind Ltd | ポリアミド中空成形品 |
JPH051223A (ja) * | 1991-06-27 | 1993-01-08 | Showa Denko Kk | 耐光性に優れたポリアミド樹脂組成物 |
SE9202892D0 (sv) * | 1992-10-02 | 1992-10-02 | Kabi Pharmacia Ab | Dna encoding a prostaglandin receptor, a host cell transformed therewith and an expression product thereof |
US5500473A (en) * | 1993-04-30 | 1996-03-19 | E. I. Du Pont De Nemours And Company | Mineral filled copolyamide compositions |
US5750639A (en) * | 1994-01-26 | 1998-05-12 | E. I. Du Pont De Nemours And Company | Polyamide resin composition and molding thereof |
JPH09316325A (ja) * | 1996-05-24 | 1997-12-09 | Du Pont Kk | 剛性および靭性のバランスに優れた芳香族ポリアミド樹脂組成物 |
US5969014A (en) * | 1997-09-23 | 1999-10-19 | Clariant Finance (Bvi) Limited | Synergistic polyamide stabilization method |
US6319986B1 (en) * | 1998-07-02 | 2001-11-20 | Mitsui Chemicals | Semiaromatic polyamide resin composition |
JP2000080270A (ja) * | 1998-07-02 | 2000-03-21 | Mitsui Chemicals Inc | 半芳香族ポリアミド樹脂組成物 |
KR100620250B1 (ko) * | 1998-07-30 | 2006-09-13 | 도레이 가부시끼가이샤 | 폴리아미드 수지조성물 및 그 제조방법 |
ATE296855T1 (de) * | 1998-12-17 | 2005-06-15 | Basell Poliolefine Spa | Polyolefinpfropfcopolymere/polyamid mischung |
JP2001002917A (ja) * | 1999-06-18 | 2001-01-09 | Toyobo Co Ltd | ポリアミド組成物 |
US6423768B1 (en) * | 1999-09-07 | 2002-07-23 | General Electric Company | Polymer-organoclay composite compositions, method for making and articles therefrom |
JP2001164109A (ja) * | 1999-12-03 | 2001-06-19 | Mitsubishi Gas Chem Co Inc | ポリアミド樹脂組成物 |
EP1275670B1 (en) * | 2000-01-21 | 2005-08-10 | Mitsui Chemicals, Inc. | Olefin block copolymers, production processes of the same and use thereof |
KR100448115B1 (ko) * | 2000-11-30 | 2004-09-10 | 현대자동차주식회사 | 폴리아미드 수지 조성물 |
US20020187291A1 (en) * | 2001-04-12 | 2002-12-12 | Jean-Michel Philippoz | Long solidified hollow thermoplastic articles |
CN1206278C (zh) * | 2001-07-23 | 2005-06-15 | 帝人化成株式会社 | 热塑性树脂组合物、成形品及其制造方法 |
-
2004
- 2004-04-07 US US10/819,766 patent/US20040242737A1/en not_active Abandoned
- 2004-04-08 JP JP2006509939A patent/JP5226211B2/ja not_active Expired - Fee Related
- 2004-04-08 CN CNB2004800161135A patent/CN100480328C/zh not_active Expired - Fee Related
- 2004-04-08 EP EP04750025A patent/EP1613697A1/en not_active Withdrawn
- 2004-04-08 WO PCT/US2004/011250 patent/WO2004092274A1/en active Application Filing
- 2004-04-08 BR BRPI0409758-0A patent/BRPI0409758A/pt not_active IP Right Cessation
-
2005
- 2005-10-13 KR KR1020057019443A patent/KR101070502B1/ko active IP Right Grant
-
2007
- 2007-11-16 US US11/985,677 patent/US20080070023A1/en not_active Abandoned
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