JP2006521434A5 - - Google Patents

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Publication number
JP2006521434A5
JP2006521434A5 JP2006504797A JP2006504797A JP2006521434A5 JP 2006521434 A5 JP2006521434 A5 JP 2006521434A5 JP 2006504797 A JP2006504797 A JP 2006504797A JP 2006504797 A JP2006504797 A JP 2006504797A JP 2006521434 A5 JP2006521434 A5 JP 2006521434A5
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JP
Japan
Prior art keywords
dispersion
optionally
support
metallizing
drilling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006504797A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006521434A (ja
JP5602334B2 (ja
Filing date
Publication date
Priority claimed from DE2003113555 external-priority patent/DE10313555A1/de
Priority claimed from DE2003113556 external-priority patent/DE10313556A1/de
Application filed filed Critical
Priority claimed from PCT/EP2004/003001 external-priority patent/WO2004085550A2/en
Publication of JP2006521434A publication Critical patent/JP2006521434A/ja
Publication of JP2006521434A5 publication Critical patent/JP2006521434A5/ja
Application granted granted Critical
Publication of JP5602334B2 publication Critical patent/JP5602334B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2006504797A 2003-03-26 2004-03-22 粉体塗料およびプリント基板の製造において薄い層を形成するための方法 Expired - Fee Related JP5602334B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE2003113555 DE10313555A1 (de) 2003-03-26 2003-03-26 Pulverlack und Verfahren für die Erzeugung dünner Schichten im Leiterplattenbau
DE10313556.1 2003-03-26
DE2003113556 DE10313556A1 (de) 2003-03-26 2003-03-26 Pulverlack und Verfahren für die Erzeugung dünner Schichten im Leiterplattenbau
DE10313555.3 2003-03-26
PCT/EP2004/003001 WO2004085550A2 (en) 2003-03-26 2004-03-22 Powder coating and process for the preparation of thin layers in the manufacture of printed circuit boards

Publications (3)

Publication Number Publication Date
JP2006521434A JP2006521434A (ja) 2006-09-21
JP2006521434A5 true JP2006521434A5 (https=) 2007-03-15
JP5602334B2 JP5602334B2 (ja) 2014-10-08

Family

ID=33099289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006504797A Expired - Fee Related JP5602334B2 (ja) 2003-03-26 2004-03-22 粉体塗料およびプリント基板の製造において薄い層を形成するための方法

Country Status (8)

Country Link
US (1) US20070093620A1 (https=)
EP (1) EP1606358A2 (https=)
JP (1) JP5602334B2 (https=)
KR (1) KR101159287B1 (https=)
BR (1) BRPI0408747A (https=)
CA (1) CA2520132A1 (https=)
TW (1) TWI392713B (https=)
WO (1) WO2004085550A2 (https=)

Families Citing this family (14)

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ES2542716T3 (es) * 2006-05-11 2015-08-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Resinas a base de cianato, de curado a baja temperatura, resistentes a las llamas con propiedades mejoradas
DE602007008593D1 (de) 2007-12-12 2010-09-30 Atotech Deutschland Gmbh Festpulverformulierungen für die Zubereitung von harzbeschichteten Folien und ihre Verwendung bei der Herstellung von Leiterplatten
ES2572829T3 (es) * 2009-01-06 2016-06-02 Ewald Dörken Ag Procedimiento para la preparación de un barniz en polvo
DE102009009650B4 (de) 2009-02-19 2013-10-10 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum Herstellen einer Kunststoffschicht sowie deren Verwendung
EP2448380A1 (en) * 2010-10-26 2012-05-02 ATOTECH Deutschland GmbH Composite build-up material for embedding of circuitry
JP6680523B2 (ja) * 2015-12-07 2020-04-15 ソマール株式会社 粉体塗料
JP6761573B2 (ja) * 2015-12-21 2020-09-30 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
WO2020130097A1 (ja) * 2018-12-21 2020-06-25 日立化成株式会社 封止組成物及び半導体装置
US11134575B2 (en) * 2019-09-30 2021-09-28 Gentherm Gmbh Dual conductor laminated substrate
WO2021108775A1 (en) * 2019-11-27 2021-06-03 Hsio Technologies, Llc Pcb fabrication with dielectric powder or suspension
US12559620B2 (en) 2020-07-07 2026-02-24 Ppg Industries Ohio, Inc. Curable coating compositions
TWI833095B (zh) * 2020-07-28 2024-02-21 美商聖高拜塑膠製品公司 敷銅層板、含其之印刷電路基板及其形成方法
CN111909594A (zh) * 2020-08-11 2020-11-10 江苏万源新材料股份有限公司 一种有防腐功能的分子筛涂层铝箔及其制备工艺
CA3209305A1 (en) * 2022-08-17 2024-02-17 Ppg Industries Ohio, Inc. Dielectric coatings

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US3860557A (en) * 1971-01-18 1975-01-14 Beatrice Foods Co Electrostatic method of applying multilayer coating and product produced thereby
JPS5853673B2 (ja) * 1979-03-22 1983-11-30 日立化成工業株式会社 化学メッキ用粉末塗料の製造法
JPS57162764A (en) * 1981-03-31 1982-10-06 Hitachi Chem Co Ltd Preparation of chemically platable powder coating
JPS617331A (ja) * 1984-06-21 1986-01-14 Mitsubishi Gas Chem Co Inc 難燃性の硬化性樹脂組成物
JPH0660294B2 (ja) * 1986-06-05 1994-08-10 ソマ−ル株式会社 エポキシ樹脂系粉体塗料組成物
DE3737495A1 (de) * 1987-11-05 1989-05-18 Hoechst Ag Verfahren zur erhoehung der elektrostatischen aufladbarkeit von pulverlacken oder pulvern und deren verwendung zur oberflaechenbeschichtung von festen gegenstaenden
JPH0370729A (ja) * 1989-08-11 1991-03-26 Mitsubishi Petrochem Co Ltd エポキシ樹脂・ビスマレイミド系熱硬化性樹脂組成物
JPH0420518A (ja) * 1990-05-15 1992-01-24 Nitto Denko Corp 耐熱性粉体樹脂組成物
JPH0493343A (ja) * 1990-08-08 1992-03-26 Nitto Denko Corp 粉体樹脂組成物
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EP0859021A3 (en) * 1991-10-31 1998-11-11 Daicel Chemical Industries, Ltd. Epoxidised compositions
US5340912A (en) * 1993-02-23 1994-08-23 Shell Oil Company Cyanate resins
ATE185833T1 (de) * 1994-04-13 1999-11-15 Ppg Ind Ohio Inc Wärmehärtende pulverlackzusammensetzungen
BR9608453A (pt) * 1995-05-19 1999-01-05 Basf Coatings Ag Dispersão aquosa de pó para revestimento
US20010002274A1 (en) * 1996-06-14 2001-05-31 Peter Lessmeister Metal strip coating process
US20010020071A1 (en) * 1997-10-10 2001-09-06 Capote Miguel Albert High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants
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DE19933095A1 (de) * 1999-07-15 2001-01-18 Herberts Gmbh & Co Kg Pulverlackzusammensetzung und Verfahren zur Substratbeschichtung
US6576718B1 (en) * 1999-10-05 2003-06-10 General Electric Company Powder coating of thermosetting resin(s) and poly(phenylene ethers(s))
US6437045B1 (en) * 1999-11-10 2002-08-20 Vantico Inc. Powder coating of carboxyl polyester or (poly)methacrylate and cycloaliphatic polyepoxide
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