JP2006513559A - サセプタ・システム - Google Patents
サセプタ・システム Download PDFInfo
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- JP2006513559A JP2006513559A JP2004558343A JP2004558343A JP2006513559A JP 2006513559 A JP2006513559 A JP 2006513559A JP 2004558343 A JP2004558343 A JP 2004558343A JP 2004558343 A JP2004558343 A JP 2004558343A JP 2006513559 A JP2006513559 A JP 2006513559A
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- susceptor system
- wall
- susceptor
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- slide
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- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 26
- 235000012431 wafers Nutrition 0.000 claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 239000004020 conductor Substances 0.000 claims abstract description 15
- 230000005674 electromagnetic induction Effects 0.000 claims abstract description 15
- 239000012777 electrically insulating material Substances 0.000 claims abstract description 10
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 25
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 24
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 23
- 229910002804 graphite Inorganic materials 0.000 claims description 21
- 239000010439 graphite Substances 0.000 claims description 21
- 229910052582 BN Inorganic materials 0.000 claims description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910052580 B4C Inorganic materials 0.000 claims description 2
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 239000003779 heat-resistant material Substances 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- 229910052758 niobium Inorganic materials 0.000 claims 1
- 239000010955 niobium Substances 0.000 claims 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 description 15
- 239000007789 gas Substances 0.000 description 12
- 239000010410 layer Substances 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- 229910003468 tantalcarbide Inorganic materials 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 4
- 230000006698 induction Effects 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000001419 dependent effect Effects 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010892 electric spark Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- UNASZPQZIFZUSI-UHFFFAOYSA-N methylidyneniobium Chemical compound [Nb]#C UNASZPQZIFZUSI-UHFFFAOYSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910021426 porous silicon Inorganic materials 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/10—Heating of the reaction chamber or the substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/12—Substrate holders or susceptors
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
- C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
- C30B31/14—Substrate holders or susceptors
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B35/00—Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B14/00—Crucible or pot furnaces
- F27B14/06—Crucible or pot furnaces heated electrically, e.g. induction crucible furnaces with or without any other source of heat
- F27B14/061—Induction furnaces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- Chemical & Material Sciences (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical Vapour Deposition (AREA)
- Gripping On Spindles (AREA)
- Processing Of Meat And Fish (AREA)
- Paper (AREA)
- Control And Other Processes For Unpacking Of Materials (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Resistance Welding (AREA)
- General Induction Heating (AREA)
Abstract
Description
採用した方法を以下の項でまとめている。
Claims (22)
- 基板及び/又はウエーハを処理するのに適したタイプの装置のためのサセプタ・システムで、そのサセプタ・システムには、基板及び/又はウエーハの処理チャンバーとして機能し、かつ、長手方向に伸びていて、かつ、上側の壁(2)により、下側の壁(3)により、右側の壁(4)により、左側の壁(5)により範囲を定められた空間(1)が設けられていて、その上側の壁(2)が電磁誘導により加熱されるのに適した導電性材料の少なくとも1個の部品により構成され、その下側の壁(3)が電磁誘導により加熱されるのに適した導電性材料の少なくとも1個の部品により構成され、その右側の壁(4)が不活性で、耐熱性で、電気的絶縁性の材料の少なくとも1個の部品により構成され、その左側の壁(5)が不活性で、耐熱性で、電気的絶縁性の材料の少なくとも1個の部品により構成されており、上側の壁(2)の部品又は各部品がその下側の壁(3)の部品又は各部品から電気的に絶縁されていて、その部品(2、3、4、5)がサセプタ・システムに含まれていることを特徴とするサセプタ・システム。
- 壁(2、3、4、5)のそれぞれが単一の部品により構成されることを特徴とする請求項1に基づくサセプタ・システム。
- 上側の壁(2)及び下側の壁(3)の部品又は各部品がグラファイト又は同様の導電性材料から作られていて、かつ、少なくとも空間(1)に隣接した領域を、一層のシリコン、タンタル、ニオビウム又はホウ素の炭化物、又は、シリコン、ホウ素又はアルミニウムの窒化物、又は、同様の不活性で、耐熱性の材料で被覆されていることを特徴とする請求項1又は請求項2に基づくサセプタ・システム。
- 両側の壁(4、5)の部品又は各部品が炭化シリコン又は窒化ホウ素から作られていることを特徴とする請求項1、2及び3のどれかに基づくサセプタ・システム
- サセプタ・システムの断面の外形が実質的に長手方向に一定で、かつ、実質的に円形又は楕円形であることを特徴とする前記請求項のいずれかに基づくサセプタ・システム。
- 空間(1)の断面の形が長手方向に実質的に一定であることを特徴とする前記請求項のいずれかに基づくサセプタ・システム。
- 空間(1)の平均幅が空間(1)の平均高さの少なくとも3倍、より好ましくは少なくとも5倍であることを特徴とする前記請求項のいずれかに基づくサセプタ・システム。
- 両側の壁(4、5)の部品は実質的に長方形又は台形の断面を有していることを特徴とする前記請求項のいずれかに基づくサセプタ・システム。
- 上側の壁(2)の部品及び/又は下側の壁(3)の部品が実質的に円形の一部分又は楕円形の一部分となる外形を有する断面を有していることを特徴とする前記の請求項のいずれかに基づくサセプタ・システム。
- 上側の壁(2)の部品及び/又は下側の壁(3)の部品が、両側の壁(4、5)の部品と結合するために、長手方向の溝(22、32)及び/又はリブを有していることを特徴とする前記請求項のいずれかに基づくサセプタ・システム。
- 上側の壁(2)の部品及び/又は下側の壁(3)の部品が、長手方向に伸びた少なくとも1個の穴(21、31)、好ましくは貫通穴を有するように中空であることを特徴とする前記の請求項のいずれかに基づくサセプタ・システム。
- 空間(1)内に取付けられ、かつ、少なくとも1個の基板又は少なくとも1個のウエーハを保持するのに適当なスライド(6)を含み、そのスライド(6)が長手方向に案内されて滑ることができることを特徴とする前記請求項のいずれかに基づくサセプタ・システム。
- 下側の壁(3)がスライド(6)を受けるのに適当で、かつ、長手方向に伸びていて、スライド(6)がガイド(33)に沿って滑ることができるようにしたことを特徴とする請求項12に基づくサセプタ・システム。
- スライド(6)が少なくとも1枚の基板又は少なくとも1枚のウエーハを保持するのに適当な少なくとも1個のディスク(61)を含み、かつ、そのディスク(61)を回転可能に収容するのに適当な凹部(62)を設けていることを特徴とする請求項12又は請求項13に基づくサセプタ・システム。
- 請求項1から14のいずれかに基づく少なくとも1個のサセプタ・システム(2、3、4、5)を含むことを特徴とする基板及び/又はウエーハを処理するのに適したタイプの装置。
- サセプタ・システム(2、3、4、5)を囲み、かつ、多孔質のグラファイト又は同様の材料の管によって実質的に構成され、長手方向に伸びている第一の耐熱性で、断熱性の構造体(7)から成ることを特徴とする請求項15に基づく装置。
- 管が長手方向に2個の半割り管(71、72)に分割され、さらに、第一の構造体(7)が長手方向に伸びて、2個の半割り管(71、72)の間に配置された耐熱性で、断熱性で、好ましくは電気的絶縁性の材料の2個の要素(73)を含んでいることを特徴とする請求項16に基づく装置。
- 第一の構造体(7)を囲むのに適した第二の密封性構造体(8)を含むことを特徴とする請求項15から17のいずれかに基づく装置。
- 電磁誘導によりサセプタ・システムを加熱するのに適していて、かつ、第一の構造体(7)の回り、又は、第二の構造体(8)の回りに巻かれている導電手段(9)を含むことを特徴とする請求項15から18のいずれかに基づく装置。
- サセプタ・システムの少なくとも1個の貫通穴(21、31)に少なくとも1系統のガス流を流すための手段を含むことを特徴とする請求項15から19のいずれかに基づく装置。
- 基板上に炭化シリコン又は同様の材料のエピタキシャル成長を行なうための反応装置であることを特徴とする請求項15から20のいずれかに基づく装置。
- ウエーハの高温熱処理用の装置であることを特徴とする請求項15から20のいずれかに基づく装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/IT2002/000774 WO2004053188A1 (en) | 2002-12-10 | 2002-12-10 | Susceptor system |
Publications (1)
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JP2006513559A true JP2006513559A (ja) | 2006-04-20 |
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JP2004558343A Pending JP2006513559A (ja) | 2002-12-10 | 2002-12-10 | サセプタ・システム |
JP2004558349A Pending JP2006509363A (ja) | 2002-12-10 | 2003-06-11 | 処理装置用支持システム |
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JP2004558349A Pending JP2006509363A (ja) | 2002-12-10 | 2003-06-11 | 処理装置用支持システム |
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US (2) | US7615121B2 (ja) |
EP (2) | EP1570108B1 (ja) |
JP (2) | JP2006513559A (ja) |
KR (1) | KR20050085503A (ja) |
CN (2) | CN1708602A (ja) |
AT (2) | ATE423226T1 (ja) |
AU (2) | AU2002368439A1 (ja) |
DE (2) | DE60231256D1 (ja) |
WO (2) | WO2004053188A1 (ja) |
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JP2008159947A (ja) * | 2006-12-25 | 2008-07-10 | Tokyo Electron Ltd | 成膜装置および成膜方法 |
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WO2004053188A1 (en) * | 2002-12-10 | 2004-06-24 | E.T.C. Epitaxial Technology Center Srl | Susceptor system |
CN100507073C (zh) * | 2002-12-10 | 2009-07-01 | Etc外延技术中心有限公司 | 感受器系统 |
US8028531B2 (en) * | 2004-03-01 | 2011-10-04 | GlobalFoundries, Inc. | Mitigating heat in an integrated circuit |
JP4923189B2 (ja) * | 2004-06-09 | 2012-04-25 | イー・テイ・シー・エピタキシヤル・テクノロジー・センター・エス・アール・エル | 支持システム |
EP1790757B1 (en) * | 2004-07-22 | 2013-08-14 | Toyo Tanso Co., Ltd. | Susceptor |
ITMI20041677A1 (it) * | 2004-08-30 | 2004-11-30 | E T C Epitaxial Technology Ct | Processo di pulitura e processo operativo per un reattore cvd. |
KR100618868B1 (ko) * | 2004-10-19 | 2006-08-31 | 삼성전자주식회사 | 스핀 장치 |
DE102004062553A1 (de) * | 2004-12-24 | 2006-07-06 | Aixtron Ag | CVD-Reaktor mit RF-geheizter Prozesskammer |
ITMI20052498A1 (it) * | 2005-12-28 | 2007-06-29 | Lpe Spa | Camera di reazione a temperatura differenziata |
KR100885180B1 (ko) * | 2006-12-27 | 2009-02-23 | 세메스 주식회사 | 기판 지지유닛, 그리고 상기 기판 지지유닛을 구비하는기판처리장치 및 방법 |
IL198123A0 (en) * | 2008-04-18 | 2009-12-24 | Snecma Propulsion Solide | A heat treatment oven with inductive heating |
KR20130107001A (ko) * | 2012-03-21 | 2013-10-01 | 엘지이노텍 주식회사 | 증착 장치 |
ITCO20130073A1 (it) | 2013-12-19 | 2015-06-20 | Lpe Spa | Camera di reazione di un reattore per crescite epitassiali adatta per l'uso con un dispositivo di carico/scarico e reattore |
EP3164884B1 (en) | 2014-07-03 | 2022-02-23 | LPE S.p.A. | Tool for manipulating substrates, manipulation method and epitaxial reactor |
KR102343103B1 (ko) * | 2015-07-10 | 2021-12-28 | 주식회사 테스 | 유기금속화학기상증착장치 |
JP6648627B2 (ja) | 2016-04-27 | 2020-02-14 | 三菱電機株式会社 | 炭化珪素エピタキシャルウエハの製造方法、炭化珪素半導体装置の製造方法及び炭化珪素エピタキシャルウエハの製造装置 |
CN107435165A (zh) * | 2016-05-26 | 2017-12-05 | 北京北方华创微电子装备有限公司 | 一种外延反应腔和化学气相外延设备 |
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KR101885026B1 (ko) * | 2017-03-22 | 2018-08-02 | 오충석 | 웨이퍼 회전장치 |
DE102018131751A1 (de) | 2018-12-11 | 2020-06-18 | Aixtron Se | Suszeptor eines CVD-Reaktors |
IT201800011158A1 (it) | 2018-12-17 | 2020-06-17 | Lpe Spa | Camera di reazione per un reattore epitassiale di materiale semiconduttore con sezione longitudinale non-uniforme e reattore |
CN112648937B (zh) * | 2019-10-13 | 2023-01-06 | 中北大学 | 带有防转机构的孔检测装置与检测方法 |
IT201900022047A1 (it) * | 2019-11-25 | 2021-05-25 | Lpe Spa | Dispositivo di supporto substrati per una camera di reazione di un reattore epitassiale con rotazione a flusso di gas, camera di reazione e reattore epitassiale |
CN110760820A (zh) * | 2019-12-05 | 2020-02-07 | 深圳市志橙半导体材料有限公司 | 一种气相沉积炉内气体悬浮装置 |
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-
2002
- 2002-12-10 WO PCT/IT2002/000774 patent/WO2004053188A1/en active Application Filing
- 2002-12-10 AT AT02808223T patent/ATE423226T1/de not_active IP Right Cessation
- 2002-12-10 DE DE60231256T patent/DE60231256D1/de not_active Expired - Lifetime
- 2002-12-10 AU AU2002368439A patent/AU2002368439A1/en not_active Abandoned
- 2002-12-10 EP EP02808223A patent/EP1570108B1/en not_active Expired - Lifetime
- 2002-12-10 US US10/538,529 patent/US7615121B2/en not_active Expired - Lifetime
- 2002-12-10 JP JP2004558343A patent/JP2006513559A/ja active Pending
- 2002-12-10 CN CNA028300181A patent/CN1708602A/zh active Pending
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2003
- 2003-06-11 EP EP03812670A patent/EP1581667B1/en not_active Expired - Lifetime
- 2003-06-11 CN CNA038255871A patent/CN1714169A/zh active Pending
- 2003-06-11 US US10/538,547 patent/US7387687B2/en not_active Expired - Lifetime
- 2003-06-11 AU AU2003242999A patent/AU2003242999A1/en not_active Abandoned
- 2003-06-11 AT AT03812670T patent/ATE380263T1/de not_active IP Right Cessation
- 2003-06-11 JP JP2004558349A patent/JP2006509363A/ja active Pending
- 2003-06-11 DE DE60317932T patent/DE60317932T2/de not_active Expired - Lifetime
- 2003-06-11 KR KR1020057010513A patent/KR20050085503A/ko not_active Application Discontinuation
- 2003-06-11 WO PCT/IT2003/000363 patent/WO2004053189A1/en active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008159947A (ja) * | 2006-12-25 | 2008-07-10 | Tokyo Electron Ltd | 成膜装置および成膜方法 |
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DE60231256D1 (de) | 2009-04-02 |
ATE380263T1 (de) | 2007-12-15 |
DE60317932D1 (de) | 2008-01-17 |
DE60317932T2 (de) | 2008-11-27 |
EP1570108B1 (en) | 2009-02-18 |
KR20050085503A (ko) | 2005-08-29 |
EP1570108A1 (en) | 2005-09-07 |
ATE423226T1 (de) | 2009-03-15 |
US20060054091A1 (en) | 2006-03-16 |
WO2004053189A1 (en) | 2004-06-24 |
EP1581667B1 (en) | 2007-12-05 |
CN1714169A (zh) | 2005-12-28 |
WO2004053188A1 (en) | 2004-06-24 |
AU2003242999A1 (en) | 2004-06-30 |
US20060118048A1 (en) | 2006-06-08 |
AU2002368439A1 (en) | 2004-06-30 |
US7615121B2 (en) | 2009-11-10 |
EP1581667A1 (en) | 2005-10-05 |
CN1708602A (zh) | 2005-12-14 |
US7387687B2 (en) | 2008-06-17 |
JP2006509363A (ja) | 2006-03-16 |
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