JP2006510566A - 蒸着法を用いた強誘電性単結晶膜構造物の製造方法 - Google Patents
蒸着法を用いた強誘電性単結晶膜構造物の製造方法 Download PDFInfo
- Publication number
- JP2006510566A JP2006510566A JP2005502499A JP2005502499A JP2006510566A JP 2006510566 A JP2006510566 A JP 2006510566A JP 2005502499 A JP2005502499 A JP 2005502499A JP 2005502499 A JP2005502499 A JP 2005502499A JP 2006510566 A JP2006510566 A JP 2006510566A
- Authority
- JP
- Japan
- Prior art keywords
- single crystal
- layer
- ferroelectric single
- substrate
- ferroelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 94
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims description 39
- 238000007740 vapor deposition Methods 0.000 title description 2
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000004549 pulsed laser deposition Methods 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 5
- 239000010703 silicon Substances 0.000 claims abstract description 5
- 238000005229 chemical vapour deposition Methods 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 15
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000007772 electrode material Substances 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 229910052793 cadmium Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052703 rhodium Inorganic materials 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 241000877463 Lanio Species 0.000 claims description 2
- 229910013641 LiNbO 3 Inorganic materials 0.000 claims description 2
- 229910004121 SrRuO Inorganic materials 0.000 claims description 2
- 238000005566 electron beam evaporation Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 229910052746 lanthanum Inorganic materials 0.000 claims description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 2
- 238000005498 polishing Methods 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 229910052712 strontium Inorganic materials 0.000 claims description 2
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims description 2
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims description 2
- 230000005621 ferroelectricity Effects 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 239000010408 film Substances 0.000 description 24
- 238000007796 conventional method Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 1
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- JQJCSZOEVBFDKO-UHFFFAOYSA-N lead zinc Chemical compound [Zn].[Pb] JQJCSZOEVBFDKO-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 238000003746 solid phase reaction Methods 0.000 description 1
- 238000010671 solid-state reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02197—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides the material having a perovskite structure, e.g. BaTiO3
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/16—Oxides
- C30B29/22—Complex oxides
- C30B29/24—Complex oxides with formula AMeO3, wherein A is a rare earth metal and Me is Fe, Ga, Sc, Cr, Co or Al, e.g. ortho ferrites
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02266—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by physical ablation of a target, e.g. sputtering, reactive sputtering, physical vapour deposition or pulsed laser deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31604—Deposition from a gas or vapour
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31691—Inorganic layers composed of oxides or glassy oxides or oxide based glass with perovskite structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
- H01L21/02233—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
- H01L21/02236—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor
- H01L21/02238—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor silicon in uncombined form, i.e. pure silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/02255—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by thermal treatment
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Optics & Photonics (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
- Semiconductor Memories (AREA)
- Formation Of Insulating Films (AREA)
Abstract
【解決手段】 軸がずれた(off-axis)結晶構造を有するなどのように研磨されたシリコン又は強誘電性単結晶からなる基板上に、ペロブスカイト(perovskite)結晶構造を有する電極層を形成し、その上にパルスレーザ蒸着法(PLD)又は有機金属化学気相蒸着法(MOCVD)によって強誘電性単結晶層をエピタキシャル成長させることによって、高性能電気電子部品及び素子の製作に有用に使用し得る強誘電性単結晶膜構造物を製造できる。
Description
N. Setter, Piezoelectric Materials in Devices, Ceramics Laboratory, EPEL 2002
〔式中、
(A)は、Pb(Mg1/3Nb2/3)O3又はPb(Zn1/3Nb2/3)O3、
(B)は、PbTiO3、
(C)は、LiTaO3、
(P)は、Pt、Au、Ag、Pd及びRhからなる群から選ばれる金属、
(N)は、Ni、Co、Fe、Sr、Sc、Ru、Cu及びCdからなる群から選ばれる金属の酸化物、
xは、0.65〜0.98範囲の数、
yは、0.01〜0.34範囲の数、
zは、0.01〜0.1範囲の数であり、そして
p及びnは、各々独立して0.01〜5範囲の数である。〕
前記式(I)の物質は均質な単結晶であり、韓国特許公開第2001−96505号に開示されているように固相反応させた後、溶融結晶化させることによって製造できる。具体的には、前記式(I)の物質は(a)Pb(Mg1/3Nb2/3)O3及びPb(Zn1/3Nb2/3)O3のいずれか一成分をPbTiO3及びLiTaO3と各々0.65〜0.98、0.01〜0.34及び0.01〜0.1範囲の相対モル量で混合し、(b)前記段階(a)で得られた混合物に、Pt、Au、Ag、Pd及びRhからなる群から選ばれる金属及びNi、Co、Fe、Sr、Sc、Ru、Cu及びCdからなる群から選ばれる金属の酸化物を該混合物の総量を基準として各々0.01〜5重量%の量で加え、(c)前記段階(b)で得られた混合物を焼成した後、焼成体を粉砕し、(d)前記段階(c)で得られた粉末を溶融した後、(e)溶融物を冷却して結晶化することによって製造できる。前記工程によって製造された単結晶は、好ましくは5cm以上の直径を有する。
Claims (16)
- 基板上にペロブスカイト(perovskite)結晶構造を有する物質層を電極層として形成する段階、及び前記電極物質層上にパルスレーザ蒸着法(PLD)又は有機金属化学気相蒸着法(MOCVD)によって強誘電性単結晶層を成長させる段階を含む、強誘電性単結晶膜構造物の製造方法。
- 前記成長した強誘電性単結晶層が0.1〜20μm範囲の厚さを有することを特徴とする請求項1記載の方法。
- 前記基板がシリコン単結晶又は強誘電性単結晶からなることを特徴とする請求項1記載の方法。
- 前記単結晶基板を研磨して軸がずれた(off-axis)結晶構造を有する単結晶基板を形成することをさらに含むことを特徴とする請求項1記載の方法。
- 前記単結晶基板がC軸に対して0.1〜10°の角度で軸がずれていることを特徴とする請求項4記載の方法。
- 前記ペロブスカイト結晶構造を有する電極層がストロンチウムルテネート(SrRuO3)又はランタニウムニッケレート(LaNiO3)からなることを特徴とする請求項1記載の方法
- 前記電極層が9×10-4Ω・cm以下の比抵抗値を有することを特徴とする請求項1記載の方法。
- 前記電極層を形成する前に前記基板上にペロブスカイト結晶構造を有する金属酸化物層を形成する段階をさらに含むことを特徴とする請求項1記載の方法。
- 前記ペロブスカイト結晶構造を有する金属酸化物層がチタン酸ストロンチウム(SrTiO3)からなることを特徴とする請求項8記載の方法。
- 前記電極又は金属酸化物層がPLD法又はMOCVD法で形成されることを特徴とする請求項1又は8記載の方法。
- 前記強誘電性単結晶が、膜の形態で測定された誘電常数が1,000以上であることを特徴とする請求項1記載の方法。
- 前記強誘電性単結晶がLiNbO3、NiTaO3、La3Ga5SiO14又は下記式(I)の組成を有する物質であることを特徴とする請求項1記載の方法:
x(A)y(B)z(C)−p(P)n(N) (I)
〔式中、
(A)は、Pb(Mg1/3Nb2/3)O3又はPb(Zn1/3Nb2/3)O3、
(B)は、PbTiO3、
(C)は、LiTaO3、
(P)は、Pt、Au、Ag、Pd及びRhからなる群から選ばれる金属、
(N)は、Ni、Co、Fe、Sr、Sc、Ru、Cu及びCdからなる群から選ばれる金属の酸化物、
xは、0.65〜0.98範囲の数、
yは、0.01〜0.34範囲の数、
zは、0.01〜0.1範囲の数であり、そして
p及びnは、各々独立して0.01〜5範囲の数である。〕 - 前記ペロブスカイト結晶構造を有する電極層反対側の強誘電性単結晶層面にスパッタリング又は電子ビーム蒸発法によって導電性金属層を形成する段階をさらに含むことを特徴とする請求項1記載の方法。
- 前記基板を熱処理によって酸化させることによって基板上に1μm以下の薄い酸化物膜を形成する段階をさらに含むことを特徴とする請求項1記載の方法。
- 請求項1〜14のいずれか一項に記載の方法によって製造された強誘電性単結晶膜構造物。
- 請求項15に記載の強誘電性単結晶膜構造物を含む電気又は電子素子。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20020080745 | 2002-12-17 | ||
KR1020030012846A KR100552382B1 (ko) | 2003-02-28 | 2003-02-28 | 강유전체 단결정을 이용한 단결정성 막 제조 |
PCT/KR2003/001391 WO2004055876A1 (en) | 2002-12-17 | 2003-07-14 | Method for preparation of ferroelectric single crystal film structure using deposition method |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006510566A true JP2006510566A (ja) | 2006-03-30 |
JP4422678B2 JP4422678B2 (ja) | 2010-02-24 |
Family
ID=36165450
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005502499A Expired - Fee Related JP4422678B2 (ja) | 2002-12-17 | 2003-07-14 | 蒸着法を用いた強誘電性単結晶膜構造物の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7399356B2 (ja) |
JP (1) | JP4422678B2 (ja) |
AU (1) | AU2003302958A1 (ja) |
HK (1) | HK1085306A1 (ja) |
WO (1) | WO2004055876A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100570586B1 (ko) * | 2002-12-17 | 2006-04-13 | (주)아이블포토닉스 | 강유전성 단결정 막 구조물 제조 방법 |
FR2884969B1 (fr) * | 2005-04-20 | 2008-04-11 | St Microelectronics Sa | Integration d'elements capacitifs sous forme de ceramique perovskite |
CN104480427B (zh) * | 2014-12-02 | 2017-01-25 | 中国科学院上海硅酸盐研究所 | 氧化锌基稀磁半导体薄膜的制备方法及其电荷浓度的原位调控方法 |
JP6674478B2 (ja) * | 2016-04-12 | 2020-04-01 | ▲復▼旦大学Fundan University | 大電流読出強誘電体単結晶薄膜メモリ及びその製造方法と操作方法 |
CN108321672B (zh) * | 2018-03-12 | 2020-06-23 | 中国科学院苏州生物医学工程技术研究所 | 一种高峰值功率的钬激光系统 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02258700A (ja) * | 1989-03-30 | 1990-10-19 | Res Inst For Prod Dev | 強誘電体薄膜及びその製造法 |
EP0568064B1 (en) * | 1992-05-01 | 1999-07-14 | Texas Instruments Incorporated | Pb/Bi-containing high-dielectric constant oxides using a non-Pb/Bi-containing perovskite as a buffer layer |
US5650362A (en) * | 1993-11-04 | 1997-07-22 | Fuji Xerox Co. | Oriented conductive film and process for preparing the same |
JPH08186182A (ja) * | 1994-12-28 | 1996-07-16 | Matsushita Electric Ind Co Ltd | 強誘電体薄膜素子 |
JPH08253324A (ja) * | 1995-03-10 | 1996-10-01 | Sumitomo Metal Mining Co Ltd | 強誘電体薄膜構成体 |
JP3891603B2 (ja) * | 1995-12-27 | 2007-03-14 | シャープ株式会社 | 強誘電体薄膜被覆基板、キャパシタ構造素子、及び強誘電体薄膜被覆基板の製造方法 |
US5777356A (en) * | 1996-01-03 | 1998-07-07 | Bell Communications Research, Inc. | Platinum-free ferroelectric memory cell with intermetallic barrier layer and method of making same |
US6054331A (en) * | 1997-01-15 | 2000-04-25 | Tong Yang Cement Corporation | Apparatus and methods of depositing a platinum film with anti-oxidizing function over a substrate |
US6143628A (en) * | 1997-03-27 | 2000-11-07 | Canon Kabushiki Kaisha | Semiconductor substrate and method of manufacturing the same |
US6498097B1 (en) * | 1997-05-06 | 2002-12-24 | Tong Yang Cement Corporation | Apparatus and method of forming preferred orientation-controlled platinum film using oxygen |
JP3239852B2 (ja) | 1998-08-19 | 2001-12-17 | 日本電気株式会社 | 高誘電率キャパシタ及びその製造方法 |
JP2000107238A (ja) * | 1998-10-05 | 2000-04-18 | Atsugi Co Ltd | 脱臭機能付き差込便器 |
US6194754B1 (en) * | 1999-03-05 | 2001-02-27 | Telcordia Technologies, Inc. | Amorphous barrier layer in a ferroelectric memory cell |
CN1379460A (zh) | 2001-06-27 | 2002-11-13 | 南京大学 | 高Tc铁电薄膜取向控制生长方法及铁电存储器原型器件 |
CN1152439C (zh) | 2001-12-07 | 2004-06-02 | 中国科学院上海技术物理研究所 | 镍酸镧导电金属氧化物薄膜材料的制备方法 |
US7095067B2 (en) * | 2003-05-27 | 2006-08-22 | Lucent Technologies Inc. | Oxidation-resistant conducting perovskites |
-
2003
- 2003-07-14 US US10/539,883 patent/US7399356B2/en not_active Expired - Fee Related
- 2003-07-14 JP JP2005502499A patent/JP4422678B2/ja not_active Expired - Fee Related
- 2003-07-14 WO PCT/KR2003/001391 patent/WO2004055876A1/en active Application Filing
- 2003-07-14 AU AU2003302958A patent/AU2003302958A1/en not_active Abandoned
-
2006
- 2006-05-03 HK HK06105247A patent/HK1085306A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
AU2003302958A8 (en) | 2004-07-09 |
HK1085306A1 (en) | 2006-08-18 |
AU2003302958A1 (en) | 2004-07-09 |
US20060042541A1 (en) | 2006-03-02 |
JP4422678B2 (ja) | 2010-02-24 |
WO2004055876A1 (en) | 2004-07-01 |
US7399356B2 (en) | 2008-07-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100978145B1 (ko) | 에피택셜 산화물막, 압전막, 압전막 소자, 압전막 소자를이용한 액체 토출 헤드 및 액체 토출 장치 | |
EP2019322B1 (en) | Piezoelectric element, ink jet head, angular velocity sensor, method for manufacturing the same, and ink jet recording apparatus | |
KR100671375B1 (ko) | 박막 적층체, 그 박막 적층체를 이용한 전자 장치, 및액추에이터와, 액추에이터의 제조 방법 | |
JP3482883B2 (ja) | 強誘電体薄膜素子およびその製造方法 | |
JP5019247B2 (ja) | 電子デバイス用基板 | |
KR20110036889A (ko) | 압전체 소자와 그 제조 방법 | |
US20020006733A1 (en) | Multilayer thin film and its fabrication process as well as electron device | |
US11527706B2 (en) | Film structure body and method for manufacturing the same | |
JP2003081694A (ja) | 強誘電体薄膜及びその製造方法 | |
CN100350562C (zh) | 利用沉积法制备铁电单晶膜结构的方法 | |
US6528863B1 (en) | Perovskite-containing composite material, method of manufacturing said material, electronic component and module | |
JP4422678B2 (ja) | 蒸着法を用いた強誘電性単結晶膜構造物の製造方法 | |
US20150147587A1 (en) | Ferroelectric ceramics and method for manufacturing the same | |
US7527690B2 (en) | Ferroelectric ceramic compound, a ferroelectric ceramic single crystal, and preparation processes thereof | |
JP2018081974A (ja) | 膜構造体及びその製造方法 | |
JP6850870B2 (ja) | 圧電体膜、圧電素子、及び、圧電素子の製造方法 | |
US11758817B2 (en) | Film structure and method for manufacturing the same | |
KR100552382B1 (ko) | 강유전체 단결정을 이용한 단결정성 막 제조 | |
JPH0451407A (ja) | 強誘電体薄膜の製造方法 | |
JP2012018944A (ja) | 強誘電体膜の製造方法とそれを用いた強誘電体素子 | |
CN104817320A (zh) | 压电组合物和压电元件 | |
JP2009054934A (ja) | 圧電体素子 | |
JP2718414B2 (ja) | チタン酸鉛薄膜の製造方法 | |
JPH0878748A (ja) | 薄膜圧電体素子およびそれを用いたインクジェット記録ヘッド | |
JP4300765B2 (ja) | 配向性強誘電体薄膜素子 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080617 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20080903 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20080910 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20081205 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20091104 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20091204 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121211 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131211 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |