JP2006510233A5 - - Google Patents
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- Publication number
- JP2006510233A5 JP2006510233A5 JP2005508337A JP2005508337A JP2006510233A5 JP 2006510233 A5 JP2006510233 A5 JP 2006510233A5 JP 2005508337 A JP2005508337 A JP 2005508337A JP 2005508337 A JP2005508337 A JP 2005508337A JP 2006510233 A5 JP2006510233 A5 JP 2006510233A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- forming
- circuit conductor
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 20
- 239000002648 laminated material Substances 0.000 claims 13
- 239000011229 interlayer Substances 0.000 claims 11
- 239000010410 layer Substances 0.000 claims 7
- 239000003990 capacitor Substances 0.000 claims 6
- 239000011888 foil Substances 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 5
- 238000010030 laminating Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US44310502P | 2002-12-13 | 2002-12-13 | |
US10/663,551 US20040108134A1 (en) | 2002-10-11 | 2003-09-16 | Printed wiring boards having low inductance embedded capacitors and methods of making same |
PCT/US2003/040326 WO2004056160A1 (en) | 2002-12-13 | 2003-12-12 | Printed wiring boards having low inductance embedded capacitors and methods of making same |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006510233A JP2006510233A (ja) | 2006-03-23 |
JP2006510233A5 true JP2006510233A5 (ko) | 2006-05-25 |
Family
ID=32600307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005508337A Pending JP2006510233A (ja) | 2002-12-13 | 2003-12-12 | 低インダクタンス埋め込みキャパシタを有するプリント配線板およびその製造方法 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1570713A1 (ko) |
JP (1) | JP2006510233A (ko) |
KR (1) | KR100713731B1 (ko) |
WO (1) | WO2004056160A1 (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100619367B1 (ko) | 2004-08-26 | 2006-09-08 | 삼성전기주식회사 | 고유전율을 갖는 커패시터를 내장한 인쇄회로기판 및 그제조 방법 |
JP4579673B2 (ja) * | 2004-12-24 | 2010-11-10 | 日本特殊陶業株式会社 | 電子部品及びその製造方法、電子部品付き配線基板 |
US20080289866A1 (en) * | 2004-12-28 | 2008-11-27 | Ngk Spark Plug Co., Ltd. | Wiring Board and Wiring Board Manufacturing Method |
JP4667070B2 (ja) * | 2005-02-23 | 2011-04-06 | 日本特殊陶業株式会社 | 配線基板及び配線基板の製造方法 |
JP4718314B2 (ja) * | 2005-12-07 | 2011-07-06 | 日本特殊陶業株式会社 | 誘電体積層構造体、その製造方法、及び配線基板 |
JP6152254B2 (ja) * | 2012-09-12 | 2017-06-21 | 新光電気工業株式会社 | 半導体パッケージ、半導体装置及び半導体パッケージの製造方法 |
US9337073B2 (en) * | 2013-03-12 | 2016-05-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | 3D shielding case and methods for forming the same |
JP6151616B2 (ja) * | 2013-09-27 | 2017-06-21 | 京セラ株式会社 | 電子部品搭載用基板および電子装置 |
JP2018063989A (ja) | 2016-10-11 | 2018-04-19 | Tdk株式会社 | 薄膜キャパシタ |
JP6805702B2 (ja) | 2016-10-11 | 2020-12-23 | Tdk株式会社 | 薄膜コンデンサ |
JP6737118B2 (ja) | 2016-10-11 | 2020-08-05 | Tdk株式会社 | 薄膜コンデンサ |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2764745B2 (ja) * | 1989-07-21 | 1998-06-11 | オムロン株式会社 | 混成回路基板およびその製造方法 |
US5745333A (en) * | 1994-11-21 | 1998-04-28 | International Business Machines Corporation | Laminar stackable circuit board structure with capacitor |
US6215649B1 (en) * | 1998-11-05 | 2001-04-10 | International Business Machines Corporation | Printed circuit board capacitor structure and method |
US6274224B1 (en) * | 1999-02-01 | 2001-08-14 | 3M Innovative Properties Company | Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article |
US6317023B1 (en) * | 1999-10-15 | 2001-11-13 | E. I. Du Pont De Nemours And Company | Method to embed passive components |
EP1265466A3 (en) * | 2001-06-05 | 2004-07-21 | Dai Nippon Printing Co., Ltd. | Method for fabrication wiring board provided with passive element and wiring board provided with passive element |
-
2003
- 2003-12-12 KR KR1020057010657A patent/KR100713731B1/ko not_active IP Right Cessation
- 2003-12-12 JP JP2005508337A patent/JP2006510233A/ja active Pending
- 2003-12-12 WO PCT/US2003/040326 patent/WO2004056160A1/en active Application Filing
- 2003-12-12 EP EP03813475A patent/EP1570713A1/en not_active Withdrawn
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