JP2006510233A - 低インダクタンス埋め込みキャパシタを有するプリント配線板およびその製造方法 - Google Patents
低インダクタンス埋め込みキャパシタを有するプリント配線板およびその製造方法 Download PDFInfo
- Publication number
- JP2006510233A JP2006510233A JP2005508337A JP2005508337A JP2006510233A JP 2006510233 A JP2006510233 A JP 2006510233A JP 2005508337 A JP2005508337 A JP 2005508337A JP 2005508337 A JP2005508337 A JP 2005508337A JP 2006510233 A JP2006510233 A JP 2006510233A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- forming
- dielectric
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09718—Clearance holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US44310502P | 2002-12-13 | 2002-12-13 | |
US10/663,551 US20040108134A1 (en) | 2002-10-11 | 2003-09-16 | Printed wiring boards having low inductance embedded capacitors and methods of making same |
PCT/US2003/040326 WO2004056160A1 (en) | 2002-12-13 | 2003-12-12 | Printed wiring boards having low inductance embedded capacitors and methods of making same |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006510233A true JP2006510233A (ja) | 2006-03-23 |
JP2006510233A5 JP2006510233A5 (ko) | 2006-05-25 |
Family
ID=32600307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005508337A Pending JP2006510233A (ja) | 2002-12-13 | 2003-12-12 | 低インダクタンス埋め込みキャパシタを有するプリント配線板およびその製造方法 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1570713A1 (ko) |
JP (1) | JP2006510233A (ko) |
KR (1) | KR100713731B1 (ko) |
WO (1) | WO2004056160A1 (ko) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014056925A (ja) * | 2012-09-12 | 2014-03-27 | Shinko Electric Ind Co Ltd | 半導体パッケージ、半導体装置及び半導体パッケージの製造方法 |
JP2015070047A (ja) * | 2013-09-27 | 2015-04-13 | 京セラ株式会社 | 電子部品搭載用基板および電子装置 |
US10153092B2 (en) | 2016-10-11 | 2018-12-11 | Tdk Corporation | Thin-film capacitor |
US10319524B2 (en) | 2016-10-11 | 2019-06-11 | Tdk Corporation | Thin-film capacitor |
US10529495B2 (en) | 2016-10-11 | 2020-01-07 | Tdk Corporation | Thin-film capacitor |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100619367B1 (ko) | 2004-08-26 | 2006-09-08 | 삼성전기주식회사 | 고유전율을 갖는 커패시터를 내장한 인쇄회로기판 및 그제조 방법 |
JP4579673B2 (ja) * | 2004-12-24 | 2010-11-10 | 日本特殊陶業株式会社 | 電子部品及びその製造方法、電子部品付き配線基板 |
US20080289866A1 (en) * | 2004-12-28 | 2008-11-27 | Ngk Spark Plug Co., Ltd. | Wiring Board and Wiring Board Manufacturing Method |
JP4667070B2 (ja) * | 2005-02-23 | 2011-04-06 | 日本特殊陶業株式会社 | 配線基板及び配線基板の製造方法 |
JP4718314B2 (ja) * | 2005-12-07 | 2011-07-06 | 日本特殊陶業株式会社 | 誘電体積層構造体、その製造方法、及び配線基板 |
US9337073B2 (en) * | 2013-03-12 | 2016-05-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | 3D shielding case and methods for forming the same |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2764745B2 (ja) * | 1989-07-21 | 1998-06-11 | オムロン株式会社 | 混成回路基板およびその製造方法 |
US5745333A (en) * | 1994-11-21 | 1998-04-28 | International Business Machines Corporation | Laminar stackable circuit board structure with capacitor |
US6215649B1 (en) * | 1998-11-05 | 2001-04-10 | International Business Machines Corporation | Printed circuit board capacitor structure and method |
US6274224B1 (en) * | 1999-02-01 | 2001-08-14 | 3M Innovative Properties Company | Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article |
US6317023B1 (en) * | 1999-10-15 | 2001-11-13 | E. I. Du Pont De Nemours And Company | Method to embed passive components |
EP2315510A3 (en) * | 2001-06-05 | 2012-05-02 | Dai Nippon Printing Co., Ltd. | Wiring board provided with passive element |
-
2003
- 2003-12-12 KR KR1020057010657A patent/KR100713731B1/ko not_active IP Right Cessation
- 2003-12-12 EP EP03813475A patent/EP1570713A1/en not_active Withdrawn
- 2003-12-12 WO PCT/US2003/040326 patent/WO2004056160A1/en active Application Filing
- 2003-12-12 JP JP2005508337A patent/JP2006510233A/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014056925A (ja) * | 2012-09-12 | 2014-03-27 | Shinko Electric Ind Co Ltd | 半導体パッケージ、半導体装置及び半導体パッケージの製造方法 |
JP2015070047A (ja) * | 2013-09-27 | 2015-04-13 | 京セラ株式会社 | 電子部品搭載用基板および電子装置 |
US10153092B2 (en) | 2016-10-11 | 2018-12-11 | Tdk Corporation | Thin-film capacitor |
US10319524B2 (en) | 2016-10-11 | 2019-06-11 | Tdk Corporation | Thin-film capacitor |
US10529495B2 (en) | 2016-10-11 | 2020-01-07 | Tdk Corporation | Thin-film capacitor |
Also Published As
Publication number | Publication date |
---|---|
WO2004056160A1 (en) | 2004-07-01 |
KR100713731B1 (ko) | 2007-05-04 |
KR20050084258A (ko) | 2005-08-26 |
EP1570713A1 (en) | 2005-09-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060403 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060403 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080222 |
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A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20080711 |