JP2006505139A5 - - Google Patents
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- Publication number
- JP2006505139A5 JP2006505139A5 JP2004550192A JP2004550192A JP2006505139A5 JP 2006505139 A5 JP2006505139 A5 JP 2006505139A5 JP 2004550192 A JP2004550192 A JP 2004550192A JP 2004550192 A JP2004550192 A JP 2004550192A JP 2006505139 A5 JP2006505139 A5 JP 2006505139A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- cleaning composition
- cleaning
- concentration
- alcohol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 claims 19
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims 18
- 238000000034 method Methods 0.000 claims 16
- 239000000356 contaminant Substances 0.000 claims 14
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 9
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 9
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims 9
- 239000004327 boric acid Substances 0.000 claims 9
- 229910052731 fluorine Inorganic materials 0.000 claims 9
- 239000011737 fluorine Substances 0.000 claims 9
- 239000000654 additive Substances 0.000 claims 8
- HFHFGHLXUCOHLN-UHFFFAOYSA-N 2-fluorophenol Chemical compound OC1=CC=CC=C1F HFHFGHLXUCOHLN-UHFFFAOYSA-N 0.000 claims 6
- 208000036822 Small cell carcinoma of the ovary Diseases 0.000 claims 6
- 230000000996 additive effect Effects 0.000 claims 6
- 229910052739 hydrogen Inorganic materials 0.000 claims 6
- 239000001257 hydrogen Substances 0.000 claims 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 6
- 201000005292 ovarian small cell carcinoma Diseases 0.000 claims 6
- 239000000126 substance Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 5
- ALKYHXVLJMQRLQ-UHFFFAOYSA-N 3-Hydroxy-2-naphthoate Chemical compound C1=CC=C2C=C(O)C(C(=O)O)=CC2=C1 ALKYHXVLJMQRLQ-UHFFFAOYSA-N 0.000 claims 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims 4
- 125000000217 alkyl group Chemical group 0.000 claims 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 4
- 230000003068 static effect Effects 0.000 claims 3
- 239000004094 surface-active agent Substances 0.000 claims 3
- 229910017855 NH 4 F Inorganic materials 0.000 claims 2
- -1 amine hydrogen trifluoride compound Chemical class 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 229910000040 hydrogen fluoride Inorganic materials 0.000 claims 2
- GRJJQCWNZGRKAU-UHFFFAOYSA-N pyridin-1-ium;fluoride Chemical compound F.C1=CC=NC=C1 GRJJQCWNZGRKAU-UHFFFAOYSA-N 0.000 claims 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims 1
- 238000001556 precipitation Methods 0.000 claims 1
- 238000005406 washing Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/284,861 US6943139B2 (en) | 2002-10-31 | 2002-10-31 | Removal of particle contamination on patterned silicon/silicon dioxide using supercritical carbon dioxide/chemical formulations |
| PCT/US2003/034332 WO2004042794A2 (en) | 2002-10-31 | 2003-10-29 | Removal of particle contamination on patterned slilicon/silicon dioxide using supercritical carbon dioxide/chemical formulations |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006505139A JP2006505139A (ja) | 2006-02-09 |
| JP2006505139A5 true JP2006505139A5 (https=) | 2006-12-28 |
Family
ID=32174999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004550192A Pending JP2006505139A (ja) | 2002-10-31 | 2003-10-29 | 超臨界二酸化炭素／化学調合物を用いたパターン化されたシリコン／二酸化ケイ素上における粒子状汚染物質の除去 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6943139B2 (https=) |
| EP (1) | EP1559132A4 (https=) |
| JP (1) | JP2006505139A (https=) |
| KR (1) | KR20050075758A (https=) |
| CN (2) | CN100346887C (https=) |
| AU (1) | AU2003288966A1 (https=) |
| TW (1) | TW200408699A (https=) |
| WO (1) | WO2004042794A2 (https=) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3978023B2 (ja) * | 2001-12-03 | 2007-09-19 | 株式会社神戸製鋼所 | 高圧処理方法 |
| US20060019850A1 (en) * | 2002-10-31 | 2006-01-26 | Korzenski Michael B | Removal of particle contamination on a patterned silicon/silicon dioxide using dense fluid/chemical formulations |
| CA2589168A1 (en) * | 2003-12-01 | 2005-06-16 | Advanced Technology Materials, Inc. | Removal of mems sacrificial layers using supercritical fluid/chemical formulations |
| US7553803B2 (en) * | 2004-03-01 | 2009-06-30 | Advanced Technology Materials, Inc. | Enhancement of silicon-containing particulate material removal using supercritical fluid-based compositions |
| US7195676B2 (en) * | 2004-07-13 | 2007-03-27 | Air Products And Chemicals, Inc. | Method for removal of flux and other residue in dense fluid systems |
| US20060081273A1 (en) * | 2004-10-20 | 2006-04-20 | Mcdermott Wayne T | Dense fluid compositions and processes using same for article treatment and residue removal |
| EP1879704A2 (en) * | 2005-04-15 | 2008-01-23 | Advanced Technology Materials, Inc. | Formulations for cleaning ion-implanted photoresist layers from microelectronic devices |
| WO2007120259A2 (en) * | 2005-11-08 | 2007-10-25 | Advanced Technology Materials, Inc. | Formulations for removing copper-containing post-etch residue from microelectronic devices |
| US8084367B2 (en) * | 2006-05-24 | 2011-12-27 | Samsung Electronics Co., Ltd | Etching, cleaning and drying methods using supercritical fluid and chamber systems using these methods |
| US20080125342A1 (en) * | 2006-11-07 | 2008-05-29 | Advanced Technology Materials, Inc. | Formulations for cleaning memory device structures |
| KR101506654B1 (ko) | 2007-12-20 | 2015-03-27 | 레이브 엔.피., 인크. | 노즐용 유체 분사 조립체 |
| CN101740341B (zh) * | 2008-11-26 | 2011-12-07 | 中国科学院微电子研究所 | 二氧化碳低温气溶胶半导体清洗设备 |
| KR101891363B1 (ko) | 2010-10-13 | 2018-08-24 | 엔테그리스, 아이엔씨. | 티타늄 니트라이드 부식을 억제하기 위한 조성물 및 방법 |
| US8883565B2 (en) * | 2011-10-04 | 2014-11-11 | Infineon Technologies Ag | Separation of semiconductor devices from a wafer carrier |
| US9352355B1 (en) * | 2012-04-15 | 2016-05-31 | David P. Jackson | Particle-plasma ablation process |
| KR102118964B1 (ko) | 2012-12-05 | 2020-06-08 | 엔테그리스, 아이엔씨. | Iii-v 반도체 물질을 세척하기 위한 조성물 및 이를 사용하는 방법 |
| JP6363116B2 (ja) | 2013-03-04 | 2018-07-25 | インテグリス・インコーポレーテッド | 窒化チタンを選択的にエッチングするための組成物および方法 |
| KR102338550B1 (ko) | 2013-06-06 | 2021-12-14 | 엔테그리스, 아이엔씨. | 질화 티타늄의 선택적인 에칭을 위한 조성물 및 방법 |
| KR102338526B1 (ko) | 2013-07-31 | 2021-12-14 | 엔테그리스, 아이엔씨. | Cu/W 호환성을 갖는, 금속 하드 마스크 및 에칭-후 잔여물을 제거하기 위한 수성 제형 |
| KR102340516B1 (ko) | 2013-08-30 | 2021-12-21 | 엔테그리스, 아이엔씨. | 티타늄 니트라이드를 선택적으로 에칭하기 위한 조성물 및 방법 |
| TWI654340B (zh) | 2013-12-16 | 2019-03-21 | 美商恩特葛瑞斯股份有限公司 | Ｎｉ：ＮｉＧｅ：Ｇｅ選擇性蝕刻配方及其使用方法 |
| KR102352475B1 (ko) | 2013-12-20 | 2022-01-18 | 엔테그리스, 아이엔씨. | 이온-주입된 레지스트의 제거를 위한 비-산화성 강산의 용도 |
| US10475658B2 (en) | 2013-12-31 | 2019-11-12 | Entegris, Inc. | Formulations to selectively etch silicon and germanium |
| TWI659098B (zh) | 2014-01-29 | 2019-05-11 | Entegris, Inc. | 化學機械研磨後配方及其使用方法 |
| US11127587B2 (en) | 2014-02-05 | 2021-09-21 | Entegris, Inc. | Non-amine post-CMP compositions and method of use |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5306350A (en) * | 1990-12-21 | 1994-04-26 | Union Carbide Chemicals & Plastics Technology Corporation | Methods for cleaning apparatus using compressed fluids |
| KR0137841B1 (ko) * | 1994-06-07 | 1998-04-27 | 문정환 | 식각잔류물 제거방법 |
| US5783082A (en) * | 1995-11-03 | 1998-07-21 | University Of North Carolina | Cleaning process using carbon dioxide as a solvent and employing molecularly engineered surfactants |
| US5868862A (en) * | 1996-08-01 | 1999-02-09 | Texas Instruments Incorporated | Method of removing inorganic contamination by chemical alteration and extraction in a supercritical fluid media |
| US5908510A (en) * | 1996-10-16 | 1999-06-01 | International Business Machines Corporation | Residue removal by supercritical fluids |
| US6149828A (en) | 1997-05-05 | 2000-11-21 | Micron Technology, Inc. | Supercritical etching compositions and method of using same |
| US6500605B1 (en) * | 1997-05-27 | 2002-12-31 | Tokyo Electron Limited | Removal of photoresist and residue from substrate using supercritical carbon dioxide process |
| US6306564B1 (en) * | 1997-05-27 | 2001-10-23 | Tokyo Electron Limited | Removal of resist or residue from semiconductors using supercritical carbon dioxide |
| US6277753B1 (en) * | 1998-09-28 | 2001-08-21 | Supercritical Systems Inc. | Removal of CMP residue from semiconductors using supercritical carbon dioxide process |
| US6148645A (en) * | 1999-05-14 | 2000-11-21 | Micell Technologies, Inc. | Detergent injection systems for carbon dioxide cleaning apparatus |
| TW544797B (en) * | 2001-04-17 | 2003-08-01 | Kobe Steel Ltd | High-pressure processing apparatus |
| US6764552B1 (en) * | 2002-04-18 | 2004-07-20 | Novellus Systems, Inc. | Supercritical solutions for cleaning photoresist and post-etch residue from low-k materials |
| US6669785B2 (en) * | 2002-05-15 | 2003-12-30 | Micell Technologies, Inc. | Methods and compositions for etch cleaning microelectronic substrates in carbon dioxide |
-
2002
- 2002-10-31 US US10/284,861 patent/US6943139B2/en not_active Expired - Fee Related
-
2003
- 2003-10-13 TW TW092128267A patent/TW200408699A/zh unknown
- 2003-10-29 JP JP2004550192A patent/JP2006505139A/ja active Pending
- 2003-10-29 WO PCT/US2003/034332 patent/WO2004042794A2/en not_active Ceased
- 2003-10-29 AU AU2003288966A patent/AU2003288966A1/en not_active Abandoned
- 2003-10-29 CN CNB2003801021202A patent/CN100346887C/zh not_active Expired - Fee Related
- 2003-10-29 EP EP03781458A patent/EP1559132A4/en not_active Withdrawn
- 2003-10-29 KR KR1020057007090A patent/KR20050075758A/ko not_active Ceased
- 2003-10-29 CN CNA2007101547063A patent/CN101215493A/zh active Pending
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