JP2006339524A - 電子装置及びその製造方法 - Google Patents
電子装置及びその製造方法 Download PDFInfo
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- H—ELECTRICITY
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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Abstract
【解決手段】 フットパターン24A,24B及びソルダーレジスト25が設けられると共にソルダーレジスト25の開口部からフットパターン24A,24Bが露出する構成とされた基板23と、はんだ26により基板23に実装される実装部品20A,20Bと、基板23上に形成されて実装部品20A,20Bを封止する封止樹脂29とを有し、かつ、はんだ26の一部(乗り上げ部26A,26B)が実装部品20A,20Bの下部においてソルダーレジスト25の上部に乗り上げた構成とする。
【選択図】 図9
Description
表面に電極パターン及びソルダーレジストが設けられると共に、該ソルダーレジストに形成された開口から前記電極パターンが露出する構成とされた基板と、
はんだを用いて実装部品電極を前記電極パターンに接合することにより前記基板に実装される実装部品と、
前記基板上に形成され、前記実装部品を封止する封止樹脂とを有し、
前記はんだの一部が前記ソルダーレジストの上部に乗り上げた構成としたことを特徴とするものである。
請求項1記載の電子装置において、
前記ソルダーレジストは、前記基板を平面視した場合に、前記実装部品電極と前記電極パターンとが対向する領域に重畳するオーバーラップ部を有することを特徴とするものである。
請求項1または2記載の電子装置において、
前記実装部品と前記基板とが対向する部位における前記ソルダーレジストを除去したことを特徴とするものである。
表面に電極パターン及びソルダーレジストが設けられると共に、該ソルダーレジストに形成された開口から前記電極パターンが露出する構成とされた基板と、
実装部品電極が、前記電極パターンの開口から露出した部分にはんだにより接合されることにより、前記基板に実装される実装部品と、
前記基板上に形成され、前記実装部品を封止する封止樹脂とを有し、
前記電極パターンに、前記はんだに埋設される被埋設部材を設けたことを特徴とするものである。
請求項4記載の電子装置において、
前記被埋設部材を前記ソルダーレジストにより形成したことを特徴とするものである。
請求項4または5記載の電子装置において、
前記被埋設部材は、前記基板を平面視した場合に、前記実装部品電極と前記電極パターンとが対向する領域に設けられていることを特徴とするものである。
表面に電極パターン及びソルダーレジストが設けられると共に、該ソルダーレジストに形成された開口から前記電極パターンが露出する構成とされた基板の前記電極パターンに対し、はんだを配設するはんだ配設工程と、
実装部品電極が設けられた実装部品を、該実装部品電極を前記電極パターンに前記はんだを用いて実装する実装工程と、
前記実装部品を封止する封止樹脂を前記基板上に形成する封止工程と有する電子装置の製造方法であって、
前記実装工程を実施する前に、前記基板上の前記実装部品が実装される実装位置に対応する位置にはんだ付けに必要な活性力を有する熱硬化可能な接着剤を配設することを特徴とするものである。
22A,22B 実装部品電極
23 基板
24A,24B フットパターン
25 ソルダーレジスト
26 はんだ
26A,26B 乗り上げ部
27A,27B,28A,28B 開口部
29 封止樹脂
30A〜30D 電子装置
32A,32B オーバーラップ部
35 被埋設部材
36 アンダーフィル樹脂
37 はんだペースト
38 フラックスフィル樹脂
Claims (7)
- 表面に電極パターン及びソルダーレジストが設けられると共に、該ソルダーレジストに形成された開口から前記電極パターンが露出する構成とされた基板と、
はんだを用いて実装部品電極を前記電極パターンに接合することにより前記基板に実装される実装部品と、
前記基板上に形成され、前記実装部品を封止する封止樹脂とを有し、
前記はんだの一部が前記ソルダーレジストの上部に乗り上げた構成としたことを特徴とする電子装置。 - 請求項1記載の電子装置において、
前記ソルダーレジストは、前記基板を平面視した場合に、前記実装部品電極と前記電極パターンとが対向する領域に重畳するオーバーラップ部を有することを特徴とする電子装置。 - 請求項1または2記載の電子装置において、
前記実装部品と前記基板とが対向する部位における前記ソルダーレジストを除去したことを特徴とする電子装置。 - 表面に電極パターン及びソルダーレジストが設けられると共に、該ソルダーレジストに形成された開口から前記電極パターンが露出する構成とされた基板と、
実装部品電極が、前記電極パターンの開口から露出した部分にはんだにより接合されることにより、前記基板に実装される実装部品と、
前記基板上に形成され、前記実装部品を封止する封止樹脂とを有し、
前記電極パターンに、前記はんだに埋設される被埋設部材を設けたことを特徴とする電子装置。 - 請求項4記載の電子装置において、
前記被埋設部材を前記ソルダーレジストにより形成したことを特徴とする電子装置。 - 請求項4または5記載の電子装置において、
前記被埋設部材は、前記基板を平面視した場合に、前記実装部品電極と前記電極パターンとが対向する領域に設けられていることを特徴とする電子装置。 - 表面に電極パターン及びソルダーレジストが設けられると共に、該ソルダーレジストに形成された開口から前記電極パターンが露出する構成とされた基板の前記電極パターンに対し、はんだを配設するはんだ配設工程と、
実装部品電極が設けられた実装部品を、該実装部品電極を前記電極パターンに前記はんだを用いて実装する実装工程と、
前記実装部品を封止する封止樹脂を前記基板上に形成する封止工程と有する電子装置の製造方法であって、
前記実装工程を実施する前に、前記基板上の前記実装部品が実装される実装位置に対応する位置にはんだ付けに必要な活性力を有する熱硬化可能な接着剤を配設することを特徴とする電子装置の製造方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005164387A JP4533248B2 (ja) | 2005-06-03 | 2005-06-03 | 電子装置 |
KR1020060048964A KR20060126368A (ko) | 2005-06-03 | 2006-05-30 | 전자 장치 및 그 제조 방법 |
EP06252847A EP1729337A3 (en) | 2005-06-03 | 2006-06-01 | Electronic device and method of manufacturing the same |
TW095119564A TW200707671A (en) | 2005-06-03 | 2006-06-02 | Electronic device and method of manufacturing the same |
CNA2006100833491A CN1873970A (zh) | 2005-06-03 | 2006-06-02 | 电子器件及其制造方法 |
US11/421,942 US20060273461A1 (en) | 2005-06-03 | 2006-06-02 | Electronic device and method of manufacturing the same |
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JP2005164387A JP4533248B2 (ja) | 2005-06-03 | 2005-06-03 | 電子装置 |
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JP2006339524A true JP2006339524A (ja) | 2006-12-14 |
JP4533248B2 JP4533248B2 (ja) | 2010-09-01 |
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JP2005164387A Expired - Fee Related JP4533248B2 (ja) | 2005-06-03 | 2005-06-03 | 電子装置 |
Country Status (6)
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---|---|
US (1) | US20060273461A1 (ja) |
EP (1) | EP1729337A3 (ja) |
JP (1) | JP4533248B2 (ja) |
KR (1) | KR20060126368A (ja) |
CN (1) | CN1873970A (ja) |
TW (1) | TW200707671A (ja) |
Cited By (8)
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JP2008218528A (ja) * | 2007-02-28 | 2008-09-18 | Fujitsu Ltd | 電子部品の実装方法および製造装置 |
WO2012060034A1 (ja) * | 2010-11-04 | 2012-05-10 | アルプス電気株式会社 | 電子部品モジュール |
JP2012227180A (ja) * | 2011-04-14 | 2012-11-15 | Panasonic Corp | 実装構造体、および実装構造体の製造方法 |
US8338715B2 (en) | 2007-08-28 | 2012-12-25 | Fujitsu Limited | PCB with soldering pad projections forming fillet solder joints and method of production thereof |
JP2014110303A (ja) * | 2012-11-30 | 2014-06-12 | Tdk Corp | チップ部品の実装構造及びこれを用いたモジュール製品 |
US9723731B2 (en) | 2013-04-19 | 2017-08-01 | Denso Corporation | Electronic device for vehicle |
JP2020167394A (ja) * | 2019-03-26 | 2020-10-08 | キヤノン株式会社 | プリント回路板、及び電子機器 |
WO2023140075A1 (ja) * | 2022-01-24 | 2023-07-27 | 株式会社村田製作所 | 伸縮配線基板および伸縮配線基板の製造方法 |
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JP2007142355A (ja) * | 2005-10-18 | 2007-06-07 | Matsushita Electric Ind Co Ltd | 電子部品内蔵モジュール |
JP4788754B2 (ja) * | 2008-10-15 | 2011-10-05 | パナソニック株式会社 | 部品内蔵配線基板および部品内蔵配線基板の製造方法 |
JP5117371B2 (ja) * | 2008-12-24 | 2013-01-16 | 新光電気工業株式会社 | 半導体装置およびその製造方法 |
CN102907187A (zh) * | 2010-05-26 | 2013-01-30 | 株式会社村田制作所 | 元器件内置基板 |
JP6024200B2 (ja) * | 2012-05-18 | 2016-11-09 | 富士電機機器制御株式会社 | 表面実装基板への電子部品実装方法 |
WO2014103541A1 (ja) * | 2012-12-27 | 2014-07-03 | 日本碍子株式会社 | 電子部品及びその製造方法 |
CN107222981B (zh) * | 2013-05-20 | 2019-07-02 | 日月光半导体制造股份有限公司 | 电子模块的制造方法 |
JP6694311B2 (ja) * | 2016-03-31 | 2020-05-13 | Fdk株式会社 | プリント配線基板 |
TWI626723B (zh) * | 2017-03-06 | 2018-06-11 | 力成科技股份有限公司 | 封裝結構 |
DE102017212796A1 (de) * | 2017-07-26 | 2019-01-31 | Robert Bosch Gmbh | Elektrische Baugruppe |
US11335614B2 (en) | 2017-10-26 | 2022-05-17 | Tdk Corporation | Electric component embedded structure |
US11282717B2 (en) * | 2018-03-30 | 2022-03-22 | Intel Corporation | Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap |
CN113473770B (zh) * | 2021-06-11 | 2022-08-05 | 无锡润越机电科技有限公司 | 一种具有隔离结构的控制柜 |
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TWI227099B (en) * | 2003-03-31 | 2005-01-21 | Siliconware Precision Industries Co Ltd | Chip carrier for testing electric performance of passive components and method for testing same |
JP2005109187A (ja) | 2003-09-30 | 2005-04-21 | Tdk Corp | フリップチップ実装回路基板およびその製造方法ならびに集積回路装置 |
JP4559163B2 (ja) * | 2004-08-31 | 2010-10-06 | ルネサスエレクトロニクス株式会社 | 半導体装置用パッケージ基板およびその製造方法と半導体装置 |
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- 2005-06-03 JP JP2005164387A patent/JP4533248B2/ja not_active Expired - Fee Related
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- 2006-06-01 EP EP06252847A patent/EP1729337A3/en not_active Withdrawn
- 2006-06-02 US US11/421,942 patent/US20060273461A1/en not_active Abandoned
- 2006-06-02 CN CNA2006100833491A patent/CN1873970A/zh active Pending
- 2006-06-02 TW TW095119564A patent/TW200707671A/zh unknown
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JPH1098045A (ja) * | 1996-09-20 | 1998-04-14 | Nec Corp | 突起電極の形成方法 |
JPH1098075A (ja) * | 1996-09-20 | 1998-04-14 | Toshiba Corp | 半導体実装方法、半導体実装装置および半導体実装構造 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008218528A (ja) * | 2007-02-28 | 2008-09-18 | Fujitsu Ltd | 電子部品の実装方法および製造装置 |
US8338715B2 (en) | 2007-08-28 | 2012-12-25 | Fujitsu Limited | PCB with soldering pad projections forming fillet solder joints and method of production thereof |
WO2012060034A1 (ja) * | 2010-11-04 | 2012-05-10 | アルプス電気株式会社 | 電子部品モジュール |
JP5814928B2 (ja) * | 2010-11-04 | 2015-11-17 | アルプス電気株式会社 | 電子部品モジュール |
JP2012227180A (ja) * | 2011-04-14 | 2012-11-15 | Panasonic Corp | 実装構造体、および実装構造体の製造方法 |
JP2014110303A (ja) * | 2012-11-30 | 2014-06-12 | Tdk Corp | チップ部品の実装構造及びこれを用いたモジュール製品 |
US9439288B2 (en) | 2012-11-30 | 2016-09-06 | Tdk Corporation | Mounting structure of chip component and electronic module using the same |
US9723731B2 (en) | 2013-04-19 | 2017-08-01 | Denso Corporation | Electronic device for vehicle |
JP2020167394A (ja) * | 2019-03-26 | 2020-10-08 | キヤノン株式会社 | プリント回路板、及び電子機器 |
JP7098670B2 (ja) | 2019-03-26 | 2022-07-11 | キヤノン株式会社 | 電子モジュール、及び電子機器 |
WO2023140075A1 (ja) * | 2022-01-24 | 2023-07-27 | 株式会社村田製作所 | 伸縮配線基板および伸縮配線基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20060273461A1 (en) | 2006-12-07 |
TW200707671A (en) | 2007-02-16 |
CN1873970A (zh) | 2006-12-06 |
JP4533248B2 (ja) | 2010-09-01 |
EP1729337A3 (en) | 2008-09-10 |
EP1729337A2 (en) | 2006-12-06 |
KR20060126368A (ko) | 2006-12-07 |
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