JP2006336006A - イメージ・プロジェクション・システムに有用な放射線硬化性組成物 - Google Patents

イメージ・プロジェクション・システムに有用な放射線硬化性組成物 Download PDF

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Publication number
JP2006336006A
JP2006336006A JP2006101807A JP2006101807A JP2006336006A JP 2006336006 A JP2006336006 A JP 2006336006A JP 2006101807 A JP2006101807 A JP 2006101807A JP 2006101807 A JP2006101807 A JP 2006101807A JP 2006336006 A JP2006336006 A JP 2006336006A
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composition
meth
poly
acrylate compound
weight
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Pending
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JP2006101807A
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English (en)
Japanese (ja)
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JP2006336006A5 (enExample
Inventor
Pingyong Xu
シュ ピンヨン
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3D Systems Inc
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3D Systems Inc
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Publication of JP2006336006A publication Critical patent/JP2006336006A/ja
Publication of JP2006336006A5 publication Critical patent/JP2006336006A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037—Production of three-dimensional images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0752—Silicon-containing compounds in non photosensitive layers or as additives, e.g. for dry lithography

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
JP2006101807A 2005-04-01 2006-04-03 イメージ・プロジェクション・システムに有用な放射線硬化性組成物 Pending JP2006336006A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/096,739 US7358283B2 (en) 2005-04-01 2005-04-01 Radiation curable compositions useful in image projection systems

Publications (2)

Publication Number Publication Date
JP2006336006A true JP2006336006A (ja) 2006-12-14
JP2006336006A5 JP2006336006A5 (enExample) 2009-05-21

Family

ID=36975259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006101807A Pending JP2006336006A (ja) 2005-04-01 2006-04-03 イメージ・プロジェクション・システムに有用な放射線硬化性組成物

Country Status (3)

Country Link
US (1) US7358283B2 (enExample)
EP (1) EP1717637A3 (enExample)
JP (1) JP2006336006A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008189783A (ja) * 2007-02-02 2008-08-21 Cmet Inc 面露光による光学的立体造形用樹脂組成物
WO2009038082A1 (ja) * 2007-09-18 2009-03-26 Asahi Kasei E-Materials Corporation 感光性樹脂組成物及びその積層体
WO2009041533A1 (ja) * 2007-09-26 2009-04-02 Sony Chemical & Information Device Corporation ハードコートフィルム
JP2014139131A (ja) * 2009-12-17 2014-07-31 Dsm Ip Assets Bv 放射線硬化性光ファイバーコーティング組成物のｌｅｄ硬化
JP2019183006A (ja) * 2018-04-11 2019-10-24 三菱ケミカル株式会社 光造形用樹脂組成物

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US7467939B2 (en) * 2006-05-03 2008-12-23 3D Systems, Inc. Material delivery tension and tracking system for use in solid imaging
US7614866B2 (en) * 2007-01-17 2009-11-10 3D Systems, Inc. Solid imaging apparatus and method
US20080226346A1 (en) * 2007-01-17 2008-09-18 3D Systems, Inc. Inkjet Solid Imaging System and Method for Solid Imaging
US8105066B2 (en) 2007-01-17 2012-01-31 3D Systems, Inc. Cartridge for solid imaging apparatus and method
US7706910B2 (en) 2007-01-17 2010-04-27 3D Systems, Inc. Imager assembly and method for solid imaging
US7771183B2 (en) * 2007-01-17 2010-08-10 3D Systems, Inc. Solid imaging system with removal of excess uncured build material
US7731887B2 (en) * 2007-01-17 2010-06-08 3D Systems, Inc. Method for removing excess uncured build material in solid imaging
US20080170112A1 (en) * 2007-01-17 2008-07-17 Hull Charles W Build pad, solid image build, and method for building build supports
US8221671B2 (en) * 2007-01-17 2012-07-17 3D Systems, Inc. Imager and method for consistent repeatable alignment in a solid imaging apparatus
US8003039B2 (en) * 2007-01-17 2011-08-23 3D Systems, Inc. Method for tilting solid image build platform for reducing air entrainment and for build release
US20080181977A1 (en) * 2007-01-17 2008-07-31 Sperry Charles R Brush assembly for removal of excess uncured build material
DE102007017195A1 (de) 2007-04-12 2008-10-16 Dreve Otoplastik Gmbh Biokompatible, strahlungshärtende Formulierung zur generativen Herstellung von medizintechnischen Produkten, insbesondere Ohrpassstücken und dentalen Formteilen, mittels Bildprojektionssystemen
US20100056661A1 (en) * 2008-09-03 2010-03-04 Pingyong Xu Radiation Curable Compositions Useful in Image Projection Systems
US8916084B2 (en) * 2008-09-04 2014-12-23 Xerox Corporation Ultra-violet curable gellant inks for three-dimensional printing and digital fabrication applications
US8048359B2 (en) * 2008-10-20 2011-11-01 3D Systems, Inc. Compensation of actinic radiation intensity profiles for three-dimensional modelers
US8777602B2 (en) 2008-12-22 2014-07-15 Nederlandse Organisatie Voor Tobgepast-Natuurwetenschappelijk Onderzoek TNO Method and apparatus for layerwise production of a 3D object
RU2555281C2 (ru) 2008-12-22 2015-07-10 Недерландсе Органисати Вор Тугепаст-Натюрветенсхаппелейк Ондерзук Тно Способ и аппарат для послойного изготовления объемного объекта
US8678805B2 (en) 2008-12-22 2014-03-25 Dsm Ip Assets Bv System and method for layerwise production of a tangible object
KR101995185B1 (ko) 2009-12-17 2019-07-01 디에스엠 아이피 어셋츠 비.브이. 트라이아릴 설포늄 보레이트 양이온 광개시제를 포함하는 적층식 제작을 위한 액체 방사선 경화성 수지
US9862146B2 (en) 2011-06-15 2018-01-09 Dsm Ip Assets B.V. Substrate-based additive fabrication process and apparatus
EP2775350A1 (en) 2011-09-26 2014-09-10 3D Systems, Inc. Components of three-dimensional imaging systems
US8691476B2 (en) 2011-12-16 2014-04-08 Taiwan Semiconductor Manufacturing Company, Ltd. EUV mask and method for forming the same
US9034237B2 (en) 2012-09-25 2015-05-19 3D Systems, Inc. Solid imaging systems, components thereof, and methods of solid imaging
WO2015200201A1 (en) 2014-06-23 2015-12-30 Carbon3D, Inc. Polyurethane resins having multiple mechanisms of hardening for use in producing three-dimensional objects
US10316213B1 (en) 2017-05-01 2019-06-11 Formlabs, Inc. Dual-cure resins and related methods
KR102743665B1 (ko) 2018-04-20 2024-12-16 스트래터시스,인코포레이티드 적층 제조용 복사선 경화성 조성물

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6354412A (ja) * 1986-08-25 1988-03-08 Nitto Electric Ind Co Ltd 光硬化性樹脂組成物
JPH0665338A (ja) * 1992-03-27 1994-03-08 Loctite Corp 低粘度自己硬化性アクリレート組成物
JPH07316262A (ja) * 1994-05-30 1995-12-05 Nippon Kayaku Co Ltd 光造形用樹脂組成物及びその硬化物
JPH0820728A (ja) * 1994-07-05 1996-01-23 Asahi Denka Kogyo Kk 光学的立体造形用樹脂組成物及びこれを用いた光学的立体造形法
JPH08224790A (ja) * 1994-11-29 1996-09-03 Teijin Seiki Co Ltd 光学的立体造形用樹脂組成物
JPH1095807A (ja) * 1996-09-25 1998-04-14 Teijin Seiki Co Ltd 光学的立体造形用樹脂組成物
JP2001525479A (ja) * 1997-12-05 2001-12-11 ザール テクノロジー リミテッド 照射硬化性インクジェットインク組成物
JP2003026715A (ja) * 2001-05-11 2003-01-29 Shin Etsu Polymer Co Ltd 紫外線硬化型成形用材料、耐候性付与紫外線硬化型成形用材料、それらの硬化方法及びそれらから製造される成形品
WO2004049044A2 (en) * 2002-11-25 2004-06-10 Sipix Imagining, Inc. Transmissive or reflective liquid crystal display and process for its manufacture

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US5128391A (en) * 1988-02-24 1992-07-07 Borden, Inc. Extensible and pasteurizable radiation curable coating for metal containing organofunctional silane adhesion promoter
WO1996038486A1 (en) * 1995-05-30 1996-12-05 Sola International Holdings Ltd. High index/high abbe number composition
US6316516B1 (en) * 1999-04-29 2001-11-13 Corning Incorporated Coating composition for optical fibers
US7195857B2 (en) * 2001-07-04 2007-03-27 Showa Denko K.K. Resist curable resin composition and cured article thereof
KR100568581B1 (ko) * 2003-04-14 2006-04-07 주식회사 미뉴타텍 미세패턴 형성 몰드용 조성물 및 이로부터 제작된 몰드

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6354412A (ja) * 1986-08-25 1988-03-08 Nitto Electric Ind Co Ltd 光硬化性樹脂組成物
JPH0665338A (ja) * 1992-03-27 1994-03-08 Loctite Corp 低粘度自己硬化性アクリレート組成物
JPH07316262A (ja) * 1994-05-30 1995-12-05 Nippon Kayaku Co Ltd 光造形用樹脂組成物及びその硬化物
JPH0820728A (ja) * 1994-07-05 1996-01-23 Asahi Denka Kogyo Kk 光学的立体造形用樹脂組成物及びこれを用いた光学的立体造形法
JPH08224790A (ja) * 1994-11-29 1996-09-03 Teijin Seiki Co Ltd 光学的立体造形用樹脂組成物
JPH1095807A (ja) * 1996-09-25 1998-04-14 Teijin Seiki Co Ltd 光学的立体造形用樹脂組成物
JP2001525479A (ja) * 1997-12-05 2001-12-11 ザール テクノロジー リミテッド 照射硬化性インクジェットインク組成物
JP2003026715A (ja) * 2001-05-11 2003-01-29 Shin Etsu Polymer Co Ltd 紫外線硬化型成形用材料、耐候性付与紫外線硬化型成形用材料、それらの硬化方法及びそれらから製造される成形品
WO2004049044A2 (en) * 2002-11-25 2004-06-10 Sipix Imagining, Inc. Transmissive or reflective liquid crystal display and process for its manufacture

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008189783A (ja) * 2007-02-02 2008-08-21 Cmet Inc 面露光による光学的立体造形用樹脂組成物
WO2009038082A1 (ja) * 2007-09-18 2009-03-26 Asahi Kasei E-Materials Corporation 感光性樹脂組成物及びその積層体
KR101167536B1 (ko) 2007-09-18 2012-07-20 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 수지 조성물 및 그 적층체
WO2009041533A1 (ja) * 2007-09-26 2009-04-02 Sony Chemical & Information Device Corporation ハードコートフィルム
JP5201369B2 (ja) * 2007-09-26 2013-06-05 デクセリアルズ株式会社 ハードコートフィルム
JP2014139131A (ja) * 2009-12-17 2014-07-31 Dsm Ip Assets Bv 放射線硬化性光ファイバーコーティング組成物のｌｅｄ硬化
JP2015212222A (ja) * 2009-12-17 2015-11-26 ディーエスエム アイピー アセッツ ビー．ブイ． 放射線硬化性光ファイバーコーティング組成物のｌｅｄ硬化
JP2019183006A (ja) * 2018-04-11 2019-10-24 三菱ケミカル株式会社 光造形用樹脂組成物
JP7077737B2 (ja) 2018-04-11 2022-05-31 三菱ケミカル株式会社 光造形用樹脂組成物

Also Published As

Publication number Publication date
EP1717637A3 (en) 2008-09-17
EP1717637A2 (en) 2006-11-02
US20060223901A1 (en) 2006-10-05
US7358283B2 (en) 2008-04-15

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