JP2006313882A - プロセスチャンバの等温制御 - Google Patents

プロセスチャンバの等温制御 Download PDF

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Publication number
JP2006313882A
JP2006313882A JP2006088946A JP2006088946A JP2006313882A JP 2006313882 A JP2006313882 A JP 2006313882A JP 2006088946 A JP2006088946 A JP 2006088946A JP 2006088946 A JP2006088946 A JP 2006088946A JP 2006313882 A JP2006313882 A JP 2006313882A
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Japan
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fluid
temperature
controlled
volume
amount
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Japanese (ja)
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JP2006313882A5 (enExample
Inventor
Gentaro Goshi
源太郎 五師
William Jones
ジョーンズ ウィリアム
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Supercritical Systems Inc
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Supercritical Systems Inc
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Publication of JP2006313882A publication Critical patent/JP2006313882A/ja
Publication of JP2006313882A5 publication Critical patent/JP2006313882A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2006088946A 2005-03-30 2006-03-28 プロセスチャンバの等温制御 Pending JP2006313882A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/094,876 US20060225769A1 (en) 2005-03-30 2005-03-30 Isothermal control of a process chamber

Publications (2)

Publication Number Publication Date
JP2006313882A true JP2006313882A (ja) 2006-11-16
JP2006313882A5 JP2006313882A5 (enExample) 2009-05-14

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JP2006088946A Pending JP2006313882A (ja) 2005-03-30 2006-03-28 プロセスチャンバの等温制御

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JP (1) JP2006313882A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170006412A (ko) * 2015-07-08 2017-01-18 주식회사 유진테크 기판 처리 장치 및 기판 처리 방법
JP2018060895A (ja) * 2016-10-04 2018-04-12 東京エレクトロン株式会社 基板処理方法、基板処理装置及び記録媒体

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10286336B2 (en) * 2017-08-24 2019-05-14 Medxtractor Corp. Extraction process using supercritical carbon dioxide
JP7001553B2 (ja) * 2018-06-26 2022-01-19 株式会社Ｓｃｒｅｅｎホールディングス 処理液温度調整装置、基板処理装置、および処理液供給方法
JP7197396B2 (ja) * 2019-02-06 2022-12-27 東京エレクトロン株式会社 基板処理装置及び基板処理方法
KR102605999B1 (ko) * 2021-03-17 2023-11-23 세메스 주식회사 처리액 제공 유닛 및 이를 구비하는 기판 처리 장치
US12176226B2 (en) * 2021-07-30 2024-12-24 Changxin Memory Technologies, Inc. System, method and device for temperature control

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KR20170006412A (ko) * 2015-07-08 2017-01-18 주식회사 유진테크 기판 처리 장치 및 기판 처리 방법
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JP2018060895A (ja) * 2016-10-04 2018-04-12 東京エレクトロン株式会社 基板処理方法、基板処理装置及び記録媒体
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