JP2006306009A - ２層フィルム、２層フィルムの製造方法およびプリント基板の製造方法 - Google Patents

２層フィルム、２層フィルムの製造方法およびプリント基板の製造方法 Download PDF

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Publication number
JP2006306009A
JP2006306009A JP2005199778A JP2005199778A JP2006306009A JP 2006306009 A JP2006306009 A JP 2006306009A JP 2005199778 A JP2005199778 A JP 2005199778A JP 2005199778 A JP2005199778 A JP 2005199778A JP 2006306009 A JP2006306009 A JP 2006306009A
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JP
Japan
Prior art keywords
film
metal film
layer
metal
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005199778A
Other languages
English (en)
Japanese (ja)
Inventor
Masamichi Akatsu
正道 赤津
Hiroyuki Kawaguchi
浩之 川口
Kazumi Onishi
一美 大西
Tomohiro Baba
智宏 馬場
Kunihiko Saino
邦彦 才野
Norio Tamada
教雄 玉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KAKOGAWA PLASTIC KK
Original Assignee
KAKOGAWA PLASTIC KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KAKOGAWA PLASTIC KK filed Critical KAKOGAWA PLASTIC KK
Priority to JP2005199778A priority Critical patent/JP2006306009A/ja
Priority to TW094125161A priority patent/TWI389618B/zh
Priority to KR1020050067861A priority patent/KR101203308B1/ko
Priority to HK06108805.2A priority patent/HK1088495A1/xx
Publication of JP2006306009A publication Critical patent/JP2006306009A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Physical Vapour Deposition (AREA)
JP2005199778A 2004-07-27 2005-07-08 ２層フィルム、２層フィルムの製造方法およびプリント基板の製造方法 Pending JP2006306009A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005199778A JP2006306009A (ja) 2004-07-27 2005-07-08 ２層フィルム、２層フィルムの製造方法およびプリント基板の製造方法
TW094125161A TWI389618B (zh) 2004-07-27 2005-07-25 ２層薄膜，２層薄膜之製造方法及印刷基板之製造方法
KR1020050067861A KR101203308B1 (ko) 2004-07-27 2005-07-26 2층 필름, 2층 필름의 제조 방법 및 인쇄 기판의 제조 방법
HK06108805.2A HK1088495A1 (en) 2004-07-27 2006-08-08 Double layer film, production method of double layer film, production method of printed circuit board

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004218789 2004-07-27
JP2005091291 2005-03-28
JP2005199778A JP2006306009A (ja) 2004-07-27 2005-07-08 ２層フィルム、２層フィルムの製造方法およびプリント基板の製造方法

Publications (1)

Publication Number Publication Date
JP2006306009A true JP2006306009A (ja) 2006-11-09

Family

ID=37149454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005199778A Pending JP2006306009A (ja) 2004-07-27 2005-07-08 ２層フィルム、２層フィルムの製造方法およびプリント基板の製造方法

Country Status (4)

Country Link
JP (1) JP2006306009A (zh)
KR (1) KR101203308B1 (zh)
HK (1) HK1088495A1 (zh)
TW (1) TWI389618B (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008168585A (ja) * 2007-01-15 2008-07-24 Mitsubishi Shindoh Co Ltd フレキシブル積層板
JP2009202594A (ja) * 2008-02-28 2009-09-10 Ls Mtron Ltd 寸法変化率が安定的な軟性金属積層板及びその製造方法
JP2011061113A (ja) * 2009-09-14 2011-03-24 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
JPWO2010116976A1 (ja) * 2009-04-09 2012-10-18 Jx日鉱日石金属株式会社 ２層銅張積層板及びその製造方法
KR20170066886A (ko) * 2015-12-07 2017-06-15 엘에스엠트론 주식회사 연성 동장 적층판 및 이를 이용한 인쇄회로 기판

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100807796B1 (ko) * 2005-05-19 2008-03-06 한덕수 미세 패턴용 연성다층인쇄회로기판
KR102319385B1 (ko) * 2019-12-20 2021-10-29 도레이첨단소재 주식회사 연성동박 적층필름, 이를 포함하는 전자 소자, 및 상기 연성동박 적층필름의 제작방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05287500A (ja) * 1992-04-07 1993-11-02 Nissin Electric Co Ltd フィルムキャリア形基板の製造方法
JP2002280684A (ja) * 2001-03-16 2002-09-27 Sumitomo Electric Printed Circuit Inc フレキシブル銅張回路基板とその製造方法
JP2005347438A (ja) * 2004-06-02 2005-12-15 Ulvac Japan Ltd プリント配線板、プリント配線板の製造方法およびその製造装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11214838A (ja) 1998-01-27 1999-08-06 Matsushita Electric Works Ltd 回路板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05287500A (ja) * 1992-04-07 1993-11-02 Nissin Electric Co Ltd フィルムキャリア形基板の製造方法
JP2002280684A (ja) * 2001-03-16 2002-09-27 Sumitomo Electric Printed Circuit Inc フレキシブル銅張回路基板とその製造方法
JP2005347438A (ja) * 2004-06-02 2005-12-15 Ulvac Japan Ltd プリント配線板、プリント配線板の製造方法およびその製造装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008168585A (ja) * 2007-01-15 2008-07-24 Mitsubishi Shindoh Co Ltd フレキシブル積層板
JP2009202594A (ja) * 2008-02-28 2009-09-10 Ls Mtron Ltd 寸法変化率が安定的な軟性金属積層板及びその製造方法
JPWO2010116976A1 (ja) * 2009-04-09 2012-10-18 Jx日鉱日石金属株式会社 ２層銅張積層板及びその製造方法
JP2011061113A (ja) * 2009-09-14 2011-03-24 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
KR20170066886A (ko) * 2015-12-07 2017-06-15 엘에스엠트론 주식회사 연성 동장 적층판 및 이를 이용한 인쇄회로 기판
KR102461189B1 (ko) 2015-12-07 2022-10-28 에스케이넥실리스 주식회사 연성 동장 적층판 및 이를 이용한 인쇄회로 기판

Also Published As

Publication number Publication date
HK1088495A1 (en) 2006-11-03
KR20060046786A (ko) 2006-05-17
KR101203308B1 (ko) 2012-11-20
TW200614895A (en) 2006-05-01
TWI389618B (zh) 2013-03-11

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