HK1088495A1 - Double layer film, production method of double layer film, production method of printed circuit board - Google Patents

Double layer film, production method of double layer film, production method of printed circuit board

Info

Publication number
HK1088495A1
HK1088495A1 HK06108805.2A HK06108805A HK1088495A1 HK 1088495 A1 HK1088495 A1 HK 1088495A1 HK 06108805 A HK06108805 A HK 06108805A HK 1088495 A1 HK1088495 A1 HK 1088495A1
Authority
HK
Hong Kong
Prior art keywords
production method
layer film
double layer
circuit board
printed circuit
Prior art date
Application number
HK06108805.2A
Other languages
English (en)
Inventor
Masamichi Akatsu
Hiroyuki Kawaguchi
Kazumi Ohnishi
Tomohiro Baba
Kunihiko Saino
Norio Tamada
Original Assignee
Kakogawa Plastics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kakogawa Plastics Co Ltd filed Critical Kakogawa Plastics Co Ltd
Publication of HK1088495A1 publication Critical patent/HK1088495A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Physical Vapour Deposition (AREA)
HK06108805.2A 2004-07-27 2006-08-08 Double layer film, production method of double layer film, production method of printed circuit board HK1088495A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004218789 2004-07-27
JP2005091291 2005-03-28
JP2005199778A JP2006306009A (ja) 2004-07-27 2005-07-08 ２層フィルム、２層フィルムの製造方法およびプリント基板の製造方法

Publications (1)

Publication Number Publication Date
HK1088495A1 true HK1088495A1 (en) 2006-11-03

Family

ID=37149454

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06108805.2A HK1088495A1 (en) 2004-07-27 2006-08-08 Double layer film, production method of double layer film, production method of printed circuit board

Country Status (4)

Country Link
JP (1) JP2006306009A (xx)
KR (1) KR101203308B1 (xx)
HK (1) HK1088495A1 (xx)
TW (1) TWI389618B (xx)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100807796B1 (ko) * 2005-05-19 2008-03-06 한덕수 미세 패턴용 연성다층인쇄회로기판
JP2008168585A (ja) * 2007-01-15 2008-07-24 Mitsubishi Shindoh Co Ltd フレキシブル積層板
KR20090093133A (ko) * 2008-02-28 2009-09-02 엘에스엠트론 주식회사 치수변화율이 안정적인 연성금속 적층판 및 그 제조방법
KR20110124351A (ko) * 2009-04-09 2011-11-16 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 ２ 층 동장 적층판 및 그 제조 방법
JP5436995B2 (ja) * 2009-09-14 2014-03-05 新光電気工業株式会社 配線基板及びその製造方法
KR102461189B1 (ko) * 2015-12-07 2022-10-28 에스케이넥실리스 주식회사 연성 동장 적층판 및 이를 이용한 인쇄회로 기판
KR102319385B1 (ko) * 2019-12-20 2021-10-29 도레이첨단소재 주식회사 연성동박 적층필름, 이를 포함하는 전자 소자, 및 상기 연성동박 적층필름의 제작방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05287500A (ja) * 1992-04-07 1993-11-02 Nissin Electric Co Ltd フィルムキャリア形基板の製造方法
JPH11214838A (ja) 1998-01-27 1999-08-06 Matsushita Electric Works Ltd 回路板の製造方法
JP2002280684A (ja) * 2001-03-16 2002-09-27 Sumitomo Electric Printed Circuit Inc フレキシブル銅張回路基板とその製造方法
JP4494873B2 (ja) * 2004-06-02 2010-06-30 株式会社アルバック プリント配線板、プリント配線板の製造方法およびその製造装置

Also Published As

Publication number Publication date
KR101203308B1 (ko) 2012-11-20
TWI389618B (zh) 2013-03-11
JP2006306009A (ja) 2006-11-09
TW200614895A (en) 2006-05-01
KR20060046786A (ko) 2006-05-17

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190727