JP2006294350A - ケーブルハーネス体 - Google Patents
ケーブルハーネス体 Download PDFInfo
- Publication number
- JP2006294350A JP2006294350A JP2005111259A JP2005111259A JP2006294350A JP 2006294350 A JP2006294350 A JP 2006294350A JP 2005111259 A JP2005111259 A JP 2005111259A JP 2005111259 A JP2005111259 A JP 2005111259A JP 2006294350 A JP2006294350 A JP 2006294350A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- cable harness
- harness body
- electrical connection
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims abstract description 41
- 239000000853 adhesive Substances 0.000 claims description 60
- 230000001070 adhesive effect Effects 0.000 claims description 58
- 229920001187 thermosetting polymer Polymers 0.000 claims description 51
- 239000003822 epoxy resin Substances 0.000 claims description 40
- 229920000647 polyepoxide Polymers 0.000 claims description 40
- 239000000203 mixture Substances 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 8
- 239000011146 organic particle Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 25
- 239000011162 core material Substances 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 8
- 239000013034 phenoxy resin Substances 0.000 description 8
- 229920006287 phenoxy resin Polymers 0.000 description 8
- 239000002313 adhesive film Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 229920005992 thermoplastic resin Polymers 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 229920000877 Melamine resin Polymers 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- -1 polytetrafluoroethylene Polymers 0.000 description 5
- 239000004643 cyanate ester Substances 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000000088 plastic resin Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- SNIZBGQMWRHNDY-UHFFFAOYSA-N 2,4,6-trimethylbenzonitrile Chemical compound CC1=CC(C)=C(C#N)C(C)=C1 SNIZBGQMWRHNDY-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- XWULMVRLWXONCN-UHFFFAOYSA-N 4-[2-(4-cyanophenyl)propan-2-yl]benzonitrile Chemical compound C=1C=C(C#N)C=CC=1C(C)(C)C1=CC=C(C#N)C=C1 XWULMVRLWXONCN-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- OAKJQQAXSVQMHS-UHFFFAOYSA-N hydrazine Substances NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
- H01R12/613—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures by means of interconnecting elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/594—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures for shielded flat cable
- H01R12/598—Each conductor being individually surrounded by shield, e.g. multiple coaxial cables in flat structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/16—Connectors or connections adapted for particular applications for telephony
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Insulated Conductors (AREA)
- Combinations Of Printed Boards (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Epoxy Resins (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005111259A JP2006294350A (ja) | 2005-04-07 | 2005-04-07 | ケーブルハーネス体 |
| JP2008505411A JP2008537288A (ja) | 2005-04-07 | 2006-04-04 | ケーブルハーネス体 |
| EP06749129A EP1875555A1 (en) | 2005-04-07 | 2006-04-04 | Cable harness body |
| CNA2006800114627A CN101156283A (zh) | 2005-04-07 | 2006-04-04 | 线束体 |
| US11/909,622 US20100197368A1 (en) | 2005-04-07 | 2006-04-04 | Cable harness body |
| KR1020077025722A KR20070120179A (ko) | 2005-04-07 | 2006-04-04 | 케이블 하네스 본체 |
| PCT/US2006/012216 WO2006110363A1 (en) | 2005-04-07 | 2006-04-04 | Cable harness body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005111259A JP2006294350A (ja) | 2005-04-07 | 2005-04-07 | ケーブルハーネス体 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2006294350A true JP2006294350A (ja) | 2006-10-26 |
Family
ID=36699163
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005111259A Pending JP2006294350A (ja) | 2005-04-07 | 2005-04-07 | ケーブルハーネス体 |
| JP2008505411A Pending JP2008537288A (ja) | 2005-04-07 | 2006-04-04 | ケーブルハーネス体 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008505411A Pending JP2008537288A (ja) | 2005-04-07 | 2006-04-04 | ケーブルハーネス体 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20100197368A1 (enExample) |
| EP (1) | EP1875555A1 (enExample) |
| JP (2) | JP2006294350A (enExample) |
| KR (1) | KR20070120179A (enExample) |
| CN (1) | CN101156283A (enExample) |
| WO (1) | WO2006110363A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2008262774A (ja) * | 2007-04-11 | 2008-10-30 | Junkosha Co Ltd | ケーブルコネクタ及びフラットケーブル |
| JP2010244800A (ja) * | 2009-04-03 | 2010-10-28 | Sumitomo Electric Ind Ltd | 複合ハーネス及びその製造方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2461017B (en) * | 2008-03-28 | 2010-04-28 | Beru F1 Systems Ltd | A connector and electrical tracks assembly |
| KR101670258B1 (ko) * | 2009-07-06 | 2016-10-31 | 삼성전자 주식회사 | 연성 인쇄 회로 기판을 구비하는 휴대 단말기 |
| JP4865020B2 (ja) * | 2009-09-11 | 2012-02-01 | 株式会社東芝 | 電子機器 |
| JP2011113483A (ja) * | 2009-11-30 | 2011-06-09 | Fujitsu Ten Ltd | 情報処理装置、オーディオ装置及び情報処理方法 |
| EP2387111A1 (de) * | 2010-05-12 | 2011-11-16 | Nexans | Verfahren zum elektrischen Verbinden von Flachleitern mit Rundleitern |
| WO2014092153A1 (ja) * | 2012-12-12 | 2014-06-19 | 株式会社村田製作所 | フレキシブル基板及び電子機器 |
| CN104507251B (zh) * | 2014-11-25 | 2017-10-31 | 中国航空工业集团公司洛阳电光设备研究所 | 一种线束模板及其制作方法 |
| JP6452565B2 (ja) * | 2015-07-15 | 2019-01-16 | 日本航空電子工業株式会社 | ケーブル接続構造、ケーブル整線部品 |
| TWI659580B (zh) * | 2018-07-04 | 2019-05-11 | Apacer Technology Inc. | 具可撓性電路板之Oculink電子裝置 |
| CN110289509B (zh) * | 2019-06-19 | 2021-12-28 | 江苏铁锚玻璃股份有限公司 | 圆形线缆、转接盒、扁平线缆与圆形线缆的互转方法 |
| CN113593758B (zh) * | 2021-07-30 | 2022-09-27 | 惠科股份有限公司 | 柔性扁平电缆和显示装置 |
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| US3803088A (en) * | 1972-04-12 | 1974-04-09 | Minnesota Mining & Mfg | Thermosetting polycyanate resin |
| AU572615B2 (en) * | 1983-12-27 | 1988-05-12 | Sony Corporation | Electrically conductive adhesive sheet circuit board and electrical connection structure |
| JP2624063B2 (ja) * | 1991-10-29 | 1997-06-25 | 住友電装株式会社 | ワイヤハーネス |
| DE69230660T2 (de) * | 1991-10-29 | 2000-12-07 | Sumitomo Wiring Systems, Ltd. | Kabelbaum |
| JP3747484B2 (ja) * | 1994-12-29 | 2006-02-22 | カシオ計算機株式会社 | フィルム配線基板およびその接続構造 |
| US6048222A (en) * | 1997-12-10 | 2000-04-11 | Micron Electronics, Inc. | Retentive ribbon cable connector |
| JP4213793B2 (ja) * | 1998-09-24 | 2009-01-21 | 日東電工株式会社 | 熱硬化型接着剤とその接着シ―ト類 |
| US6392148B1 (en) * | 1999-05-10 | 2002-05-21 | Furukawa Electric Co., Ltd. | Wire harness joint |
| JP2000252598A (ja) * | 1999-03-02 | 2000-09-14 | Fuji Photo Film Co Ltd | フレキシブルプリント配線板 |
| US6475027B1 (en) * | 2000-07-18 | 2002-11-05 | Visteon Global Technologies, Inc. | Edge card connector adaptor for flexible circuitry |
| JP2002216873A (ja) * | 2001-01-23 | 2002-08-02 | Pfu Ltd | ケーブルのシールド接続構造 |
| JP2002324959A (ja) * | 2001-04-24 | 2002-11-08 | Furukawa Electric Co Ltd:The | 基板の端子接続構造 |
| JP4281271B2 (ja) * | 2001-09-13 | 2009-06-17 | 日立電線株式会社 | 電線の端末接続部構造および接続方法 |
| JP2003217786A (ja) * | 2002-01-18 | 2003-07-31 | Hitachi Ltd | 圧着装置及びそれを用いた半導体モジュールの製造方法 |
| JP2003249287A (ja) * | 2002-02-25 | 2003-09-05 | Shin Etsu Polymer Co Ltd | 異方導電性接着剤、ヒートシールコネクター及び接続構造 |
| JP2003347005A (ja) * | 2002-05-22 | 2003-12-05 | Sony Corp | 回転接続装置および回転接続装置を有する電子機器 |
| JP2004099833A (ja) * | 2002-09-12 | 2004-04-02 | Three M Innovative Properties Co | 熱硬化性接着剤組成物、フィルム接着剤及び半導体装置 |
| JP4026439B2 (ja) * | 2002-07-31 | 2007-12-26 | 日立電線株式会社 | 極細同軸ケーブルアセンブリの端末接続方法 |
| US6880241B2 (en) * | 2002-09-30 | 2005-04-19 | General Electric Company A New York Corporation | Method for connecting coaxial cables to a printed circuit board |
| US6840796B2 (en) * | 2003-06-06 | 2005-01-11 | Sony Ericsson Mobile Communications Ab | Portable electronic devices with a flexible connection between internal electronics and an auxiliary connection |
-
2005
- 2005-04-07 JP JP2005111259A patent/JP2006294350A/ja active Pending
-
2006
- 2006-04-04 EP EP06749129A patent/EP1875555A1/en not_active Withdrawn
- 2006-04-04 CN CNA2006800114627A patent/CN101156283A/zh active Pending
- 2006-04-04 WO PCT/US2006/012216 patent/WO2006110363A1/en not_active Ceased
- 2006-04-04 JP JP2008505411A patent/JP2008537288A/ja active Pending
- 2006-04-04 KR KR1020077025722A patent/KR20070120179A/ko not_active Withdrawn
- 2006-04-04 US US11/909,622 patent/US20100197368A1/en not_active Abandoned
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008262774A (ja) * | 2007-04-11 | 2008-10-30 | Junkosha Co Ltd | ケーブルコネクタ及びフラットケーブル |
| JP2010244800A (ja) * | 2009-04-03 | 2010-10-28 | Sumitomo Electric Ind Ltd | 複合ハーネス及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008537288A (ja) | 2008-09-11 |
| KR20070120179A (ko) | 2007-12-21 |
| WO2006110363A1 (en) | 2006-10-19 |
| CN101156283A (zh) | 2008-04-02 |
| EP1875555A1 (en) | 2008-01-09 |
| US20100197368A1 (en) | 2010-08-05 |
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