JP2006278903A - 二連チップ抵抗器 - Google Patents

二連チップ抵抗器 Download PDF

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Publication number
JP2006278903A
JP2006278903A JP2005098576A JP2005098576A JP2006278903A JP 2006278903 A JP2006278903 A JP 2006278903A JP 2005098576 A JP2005098576 A JP 2005098576A JP 2005098576 A JP2005098576 A JP 2005098576A JP 2006278903 A JP2006278903 A JP 2006278903A
Authority
JP
Japan
Prior art keywords
chip resistors
chip
chip resistor
resistors
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005098576A
Other languages
English (en)
Japanese (ja)
Inventor
Hisahiro Kuriyama
尚大 栗山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2005098576A priority Critical patent/JP2006278903A/ja
Priority to KR1020060015549A priority patent/KR20060106647A/ko
Priority to CNA2006100659599A priority patent/CN1841576A/zh
Priority to US11/392,364 priority patent/US20060220783A1/en
Publication of JP2006278903A publication Critical patent/JP2006278903A/ja
Pending legal-status Critical Current

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Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/01Mounting; Supporting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/01Mounting; Supporting
    • H01C1/012Mounting; Supporting the base extending along and imparting rigidity or reinforcement to the resistive element
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10636Leadless chip, e.g. chip capacitor or resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
JP2005098576A 2005-03-30 2005-03-30 二連チップ抵抗器 Pending JP2006278903A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005098576A JP2006278903A (ja) 2005-03-30 2005-03-30 二連チップ抵抗器
KR1020060015549A KR20060106647A (ko) 2005-03-30 2006-02-17 2련 칩 저항기의 실장구조
CNA2006100659599A CN1841576A (zh) 2005-03-30 2006-03-29 二级芯片电阻器的安装构造
US11/392,364 US20060220783A1 (en) 2005-03-30 2006-03-29 Mounting structure of double-path chip resistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005098576A JP2006278903A (ja) 2005-03-30 2005-03-30 二連チップ抵抗器

Publications (1)

Publication Number Publication Date
JP2006278903A true JP2006278903A (ja) 2006-10-12

Family

ID=37030544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005098576A Pending JP2006278903A (ja) 2005-03-30 2005-03-30 二連チップ抵抗器

Country Status (4)

Country Link
US (1) US20060220783A1 (ko)
JP (1) JP2006278903A (ko)
KR (1) KR20060106647A (ko)
CN (1) CN1841576A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015130492A (ja) * 2013-12-05 2015-07-16 ローム株式会社 半導体モジュール

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003275693A1 (en) * 2002-10-31 2004-05-25 Rohm Co., Ltd. Fixed network resistor
KR101499716B1 (ko) * 2013-06-05 2015-03-09 삼성전기주식회사 어레이 타입 칩 저항기 및 그 제조 방법
CN105513728B (zh) * 2016-01-27 2018-09-21 广东欧珀移动通信有限公司 电阻器件
KR102527724B1 (ko) 2016-11-15 2023-05-02 삼성전기주식회사 칩 저항 소자 및 칩 저항 소자 어셈블리
JP7059091B2 (ja) 2018-04-24 2022-04-25 モレックス エルエルシー 電子部品
CN109859917A (zh) * 2019-01-26 2019-06-07 上海乐野网络科技有限公司 一种不同型号器件可选择使用的共垒结构

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3358070B2 (ja) * 1993-11-17 2002-12-16 ローム株式会社 チップ抵抗器およびその抵抗値調整方法
JP3119124B2 (ja) * 1995-06-29 2000-12-18 株式会社村田製作所 通信回線保護用電子部品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015130492A (ja) * 2013-12-05 2015-07-16 ローム株式会社 半導体モジュール

Also Published As

Publication number Publication date
KR20060106647A (ko) 2006-10-12
US20060220783A1 (en) 2006-10-05
CN1841576A (zh) 2006-10-04

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