JP2006191137A5 - - Google Patents

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Publication number
JP2006191137A5
JP2006191137A5 JP2006046189A JP2006046189A JP2006191137A5 JP 2006191137 A5 JP2006191137 A5 JP 2006191137A5 JP 2006046189 A JP2006046189 A JP 2006046189A JP 2006046189 A JP2006046189 A JP 2006046189A JP 2006191137 A5 JP2006191137 A5 JP 2006191137A5
Authority
JP
Japan
Prior art keywords
film
conductive film
groove
insulating film
memory cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006046189A
Other languages
English (en)
Japanese (ja)
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JP2006191137A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006046189A priority Critical patent/JP2006191137A/ja
Priority claimed from JP2006046189A external-priority patent/JP2006191137A/ja
Publication of JP2006191137A publication Critical patent/JP2006191137A/ja
Publication of JP2006191137A5 publication Critical patent/JP2006191137A5/ja
Pending legal-status Critical Current

Links

JP2006046189A 2006-02-23 2006-02-23 半導体集積回路装置の製造方法 Pending JP2006191137A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006046189A JP2006191137A (ja) 2006-02-23 2006-02-23 半導体集積回路装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006046189A JP2006191137A (ja) 2006-02-23 2006-02-23 半導体集積回路装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP18745099A Division JP3998373B2 (ja) 1999-07-01 1999-07-01 半導体集積回路装置の製造方法

Publications (2)

Publication Number Publication Date
JP2006191137A JP2006191137A (ja) 2006-07-20
JP2006191137A5 true JP2006191137A5 (ko) 2007-08-09

Family

ID=36797885

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006046189A Pending JP2006191137A (ja) 2006-02-23 2006-02-23 半導体集積回路装置の製造方法

Country Status (1)

Country Link
JP (1) JP2006191137A (ko)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2848260B2 (ja) * 1995-01-30 1999-01-20 日本電気株式会社 半導体装置およびその製造方法
JP3623834B2 (ja) * 1995-01-31 2005-02-23 富士通株式会社 半導体記憶装置及びその製造方法
JP4167727B2 (ja) * 1995-11-20 2008-10-22 株式会社日立製作所 半導体記憶装置
JPH09283719A (ja) * 1996-04-09 1997-10-31 Hitachi Ltd 半導体集積回路装置及び当該装置の製造方法
JP3466851B2 (ja) * 1997-01-20 2003-11-17 株式会社東芝 半導体装置及びその製造方法
US6255159B1 (en) * 1997-07-14 2001-07-03 Micron Technology, Inc. Method to form hemispherical grained polysilicon
JP3407022B2 (ja) * 1999-03-17 2003-05-19 Ｎｅｃエレクトロニクス株式会社 半導体装置及びその製造方法、並びに半導体記憶装置
JP3408450B2 (ja) * 1999-04-20 2003-05-19 日本電気株式会社 半導体装置およびその製造方法
JP2000323677A (ja) * 1999-05-12 2000-11-24 Mitsubishi Electric Corp 半導体記憶装置およびその製造方法

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