JP2006165555A - 自己整合パターニング方法 - Google Patents
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- 238000000034 method Methods 0.000 title claims abstract description 70
- 238000000059 patterning Methods 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 239000000463 material Substances 0.000 claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 claims abstract description 31
- 239000004020 conductor Substances 0.000 claims abstract description 27
- 239000010409 thin film Substances 0.000 claims abstract description 25
- 238000005530 etching Methods 0.000 claims description 34
- 239000004065 semiconductor Substances 0.000 claims description 29
- OFIYHXOOOISSDN-UHFFFAOYSA-N tellanylidenegallium Chemical compound [Te]=[Ga] OFIYHXOOOISSDN-UHFFFAOYSA-N 0.000 claims description 13
- 238000007641 inkjet printing Methods 0.000 claims description 12
- 239000011800 void material Substances 0.000 claims description 7
- 238000004528 spin coating Methods 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 5
- 238000001704 evaporation Methods 0.000 claims description 4
- 230000008020 evaporation Effects 0.000 claims description 4
- 230000008569 process Effects 0.000 description 15
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 11
- 239000004926 polymethyl methacrylate Substances 0.000 description 11
- 229920001721 polyimide Polymers 0.000 description 9
- 239000004642 Polyimide Substances 0.000 description 8
- 229910052732 germanium Inorganic materials 0.000 description 7
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 229920000144 PEDOT:PSS Polymers 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000002508 contact lithography Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 229920000301 poly(3-hexylthiophene-2,5-diyl) polymer Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- JEDHEMYZURJGRQ-UHFFFAOYSA-N 3-hexylthiophene Chemical compound CCCCCCC=1C=CSC=1 JEDHEMYZURJGRQ-UHFFFAOYSA-N 0.000 description 1
- ZZLCFHIKESPLTH-UHFFFAOYSA-N 4-Methylbiphenyl Chemical compound C1=CC(C)=CC=C1C1=CC=CC=C1 ZZLCFHIKESPLTH-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 description 1
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000007649 pad printing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003631 wet chemical etching Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- H01L21/823456—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes gate conductors with different shapes, lengths or dimensions
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Abstract
【解決手段】基板12、導電層14、絶縁層16及び犠牲層18から成る多層構造10の一部である犠牲層18の表面上にパターニングされたマスク20を形成する。次に、非パターン領域をエッチングし、空所を残す犠牲層、絶縁層16及び導電層14の対応する領域を除去する。次に、誘電体22の層を、エッチングされた多層構造全体に形成し、少なくとも実質的に空所を満たす。次に、形成された誘電体をエッチングし、犠牲層の残留領域28の側面を露出させる。次に、導電材料30を、エッチングされた誘電体の表面上に形成する。最後に、犠牲層の残留領域28を覆っていた材料と一緒に除去する。
【選択図】図1
Description
(i)基板、導電層、絶縁層、犠牲層の順に構成されてなる多層構造の一部である犠牲層の表面に、パターニングされたマスクを形成する工程と、ここで、マスクのパターンは、多数の薄膜トランジスタの少なくともゲート電極の配置を決定し、
(ii)多層構造の非パターニング部をエッチングし、空所を残す犠牲層、絶縁層及び導電層の対応領域を除去する工程と、
(iii)エッチングされた多層構造の全体を覆って誘電体の層を形成し、少なくとも空所を実質的に満たす工程と、
(iv)形成された誘電体をエッチングし、犠牲層の残留領域の側面を少なくとも部分的に露出する工程と、
(v)エッチングされた誘電体の表面に導電性材料を形成する工程と、
(vi)犠牲層の残留領域を、任意の覆っている材料と一緒に除去する工程と、から構成される。
Claims (13)
- 基板上に複数の薄膜トランジスタを製造するために使用する自己整合パターニング方法であって、
(i)前記基板、導電層、絶縁層及び犠牲層の順に構成されて成る多層構造の一部である該犠牲層の表面上にパターニングされたマスクを形成する工程と、ここで、該マスクのパターンは、前記複数の薄膜トランジスタの少なくともゲート電極の配置を決定し、
(ii)前記多層構造の非パターン領域をエッチングし、空所を残す前記犠牲層、前記絶縁層及び前記導電層の対応する領域を除去する工程と、
(iii)エッチングされた前記多層構造を覆う誘電体層を形成し、少なくとも実質的に前記空所を満たす工程と、
(iv)形成された前記誘電体層をエッチングし、前記犠牲層の残留領域の側面を少なくとも部分的に露出する工程と、
(v)エッチングされた前記誘電体層の表面上に導電材料を形成する工程と、
(vi)前記犠牲層の前記残留領域を、任意の覆っている材料と共に除去する工程と、
から成る事を特徴とする自己整合パターニング方法。 - 前記基板は、柔軟性を有する事を特徴とする請求項1に記載の自己整合パターニング方法。
- 工程(iii)で形成された前記誘電体層の厚みは、前記空所を全面的に満たし、且つ前記マスクを覆うのに十分である事を特徴とする請求項1又は請求項2に記載の自己整合パターニング方法。
- 請求項1乃至3のいずれかに記載の自己整合パターニング方法であって、工程(iii)において、前記誘電体層をスピンコーティング又はインクジェット印刷で形成する事を特徴とする自己整合パターニング方法。
- 請求項1乃至4のいずれかに記載の自己整合パターニング方法であって、工程(iv)において、前記誘電体層を前記犠牲層の前記残留領域の前記側面の全てが露出する深さまでエッチングする事を特徴とする自己整合パターニング方法。
- 請求項1乃至5のいずれかに記載の自己整合パターニング方法であって、工程(v)において、前記導電材料を加熱蒸着又はインクジェット印刷で形成する事を特徴とする自己整合パターニング方法。
- 請求項1乃至6のいずれかに記載の自己整合パターニング方法であって、前記犠牲層を溶剤で除去する事を特徴とする自己整合パターニング方法。
- 請求項1乃至7のいずれかに記載の自己整合パターニング方法であって、工程(vi)の後に半導体材料の層を形成し、複数のボトムゲート薄膜トランジスタを形成する工程を更に備える事を特徴とする自己整合パターニング方法。
- 請求項8に記載の自己整合パターニング方法において、
前記半導体材料をスピンコーティングで形成する事を特徴とする自己整合パターニング方法。 - 前記多層構造は、前記パターニング方法が複数のトップゲート薄膜トランジスタを形成するように、前記基板と前記導電層との間に半導体層を更に備え、該導電層は、隣接するトランジスタのソース電極及びドレイン電極が直接電気的に接触しないように、形成されている事を特徴とする請求項1乃至7のいずれかに記載の自己整合パターニング方法。
- 前記半導体材料が有機半導体材料である事を特徴とする請求項8乃至10のいずれかに記載の自己整合パターニング方法。
- 前記複数のトランジスタを少なくとも0.001m2の面積の二次元配列に形成する事を特徴とする請求項1乃至11のいずれかに記載の自己整合パターニング方法。
- 前記請求項12に記載のトランジスタの配列を製造する工程と、該配列の各トランジスタを発光セルに接続して表示デバイスを形成する工程と、から成る事を特徴とする表示デバイスの形成方法。
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GB0427035A GB2421115A (en) | 2004-12-09 | 2004-12-09 | A self-aligning patterning method for use in the manufacture of a plurality of thin film transistors |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2010092891A1 (ja) * | 2009-02-10 | 2010-08-19 | ブラザー工業株式会社 | 有機半導体素子、及びその製造方法 |
JP2014241438A (ja) * | 2008-12-26 | 2014-12-25 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
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US8318540B2 (en) * | 2008-05-19 | 2012-11-27 | Infineon Technologies Ag | Method of manufacturing a semiconductor structure |
US8187795B2 (en) * | 2008-12-09 | 2012-05-29 | The Board Of Trustees Of The University Of Illinois | Patterning methods for stretchable structures |
US8211782B2 (en) | 2009-10-23 | 2012-07-03 | Palo Alto Research Center Incorporated | Printed material constrained by well structures |
GB2522565B (en) * | 2011-06-27 | 2016-02-03 | Pragmatic Printing Ltd | Transistor and its method of manufacture |
GB2492532B (en) * | 2011-06-27 | 2015-06-03 | Pragmatic Printing Ltd | Transistor and its method of manufacture |
CN104752217B (zh) * | 2013-12-30 | 2017-12-01 | 中芯国际集成电路制造(上海)有限公司 | FinFET器件的制造方法 |
CN109950157A (zh) * | 2017-12-21 | 2019-06-28 | 北京有色金属研究总院 | 基于纳米片堆叠结构的生化传感器及其制作方法 |
CN111145962B (zh) * | 2020-01-14 | 2024-04-26 | 浙江清华柔性电子技术研究院 | 柔性电极及其制备方法 |
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FR2566583B1 (fr) * | 1984-06-22 | 1986-09-19 | Thomson Csf | Procede de fabrication d'au moins un transistor a effet de champ en couche mince, et transistor obtenu par ce procede |
JP2938121B2 (ja) * | 1990-03-30 | 1999-08-23 | 株式会社東芝 | 薄膜半導体装置の製造方法 |
US5235189A (en) * | 1991-11-19 | 1993-08-10 | Motorola, Inc. | Thin film transistor having a self-aligned gate underlying a channel region |
US5411909A (en) * | 1993-02-22 | 1995-05-02 | Micron Technology, Inc. | Method of forming a planar thin film transistor |
KR0145899B1 (ko) * | 1995-02-11 | 1998-09-15 | 김광호 | 완전 자기 정렬형 액정 표시 장치용 박막 트랜지스터 기판의 제조방법 |
US5739067A (en) * | 1995-12-07 | 1998-04-14 | Advanced Micro Devices, Inc. | Method for forming active devices on and in exposed surfaces of both sides of a silicon wafer |
US6791144B1 (en) * | 2000-06-27 | 2004-09-14 | International Business Machines Corporation | Thin film transistor and multilayer film structure and manufacturing method of same |
US6433359B1 (en) * | 2001-09-06 | 2002-08-13 | 3M Innovative Properties Company | Surface modifying layers for organic thin film transistors |
US6620657B2 (en) * | 2002-01-15 | 2003-09-16 | International Business Machines Corporation | Method of forming a planar polymer transistor using substrate bonding techniques |
US6803263B1 (en) * | 2003-04-22 | 2004-10-12 | Toppoly Optoelectronics Corp. | Method of fabricating TFT with self-aligned structure |
US7410882B2 (en) * | 2004-09-28 | 2008-08-12 | Palo Alto Research Center Incorporated | Method of manufacturing and structure of polycrystalline semiconductor thin-film heterostructures on dissimilar substrates |
-
2004
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2005
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JP2014241438A (ja) * | 2008-12-26 | 2014-12-25 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP2017194694A (ja) * | 2008-12-26 | 2017-10-26 | 株式会社半導体エネルギー研究所 | 半導体装置 |
WO2010092891A1 (ja) * | 2009-02-10 | 2010-08-19 | ブラザー工業株式会社 | 有機半導体素子、及びその製造方法 |
Also Published As
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US7390752B2 (en) | 2008-06-24 |
US20060128076A1 (en) | 2006-06-15 |
GB2421115A (en) | 2006-06-14 |
GB0427035D0 (en) | 2005-01-12 |
JP4466547B2 (ja) | 2010-05-26 |
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