JP5114406B2 - 高性能の有機デバイス製造用レーザアブレーション法 - Google Patents
高性能の有機デバイス製造用レーザアブレーション法 Download PDFInfo
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- JP5114406B2 JP5114406B2 JP2008527041A JP2008527041A JP5114406B2 JP 5114406 B2 JP5114406 B2 JP 5114406B2 JP 2008527041 A JP2008527041 A JP 2008527041A JP 2008527041 A JP2008527041 A JP 2008527041A JP 5114406 B2 JP5114406 B2 JP 5114406B2
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- 238000000608 laser ablation Methods 0.000 title claims description 27
- 238000004519 manufacturing process Methods 0.000 title description 8
- 239000010410 layer Substances 0.000 claims description 54
- 239000002184 metal Substances 0.000 claims description 52
- 229910052751 metal Inorganic materials 0.000 claims description 52
- 238000000034 method Methods 0.000 claims description 40
- 238000002679 ablation Methods 0.000 claims description 10
- 238000000059 patterning Methods 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 4
- 239000013545 self-assembled monolayer Substances 0.000 claims description 4
- 239000003989 dielectric material Substances 0.000 claims description 2
- 238000012545 processing Methods 0.000 claims description 2
- 239000002094 self assembled monolayer Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 description 31
- 239000000463 material Substances 0.000 description 19
- 239000000758 substrate Substances 0.000 description 19
- 239000004020 conductor Substances 0.000 description 17
- 238000007639 printing Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 239000000969 carrier Substances 0.000 description 4
- 230000005669 field effect Effects 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 239000013256 coordination polymer Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009396 hybridization Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000001883 metal evaporation Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000813 microcontact printing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- SLIUAWYAILUBJU-UHFFFAOYSA-N pentacene Chemical compound C1=CC=CC2=CC3=CC4=CC5=CC=CC=C5C=C4C=C3C=C21 SLIUAWYAILUBJU-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 1
- -1 polyphenylene ethylene Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 125000003396 thiol group Chemical class [H]S* 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/80—Constructional details
- H10K10/82—Electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
- H10K19/10—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00 comprising field-effect transistors
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Composite Materials (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Drying Of Semiconductors (AREA)
Description
Claims (17)
- 有機トランジスタを形成する方法であって、
レーザアブレーションを利用して、各有機トランジスタのソースおよびドレイン、ならびにその間にチャネル長を画定する間隙を形成するために有機トランジスタに金属層を画定することにより、少なくとも一のRFID回路に複数の有機トランジスタと少なくとも一のプリントアンテナとを同時にパターニングすることを含む、方法。 - 前記少なくとも一のRFID回路は複数のRFID回路を含む、請求項1に記載の方法。
- 前記少なくとも一のプリントアンテナは複数のプリントアンテナを含む、請求項1に記載の方法。
- 厚みが20nm〜60nmの前記金属層を形成することをさらに含む、請求項1から3のいずれか1項に記載の方法。
- アブレーション分解能は2μm〜4μmである、請求項1から3のいずれか1項に記載の方法。
- トップゲート型有機トランジスタ構造を形成することをさらに含む、請求項1から3のいずれか1項に記載の方法。
- ボトムゲート/トップコンタクト型有機トランジスタ構造を形成することをさらに含む、請求項1から3のいずれか1項に記載の方法。
- ボトムゲート/ボトムコンタクト型有機トランジスタ構造を形成することをさらに含む、請求項1から3のいずれか1項に記載の方法。
- 前記レーザーアブレーションにおいて露光を複数回行うことをさらに含む、請求項1から3のいずれか1項に記載の方法。
- 前記少なくとも一のRFID回路が形成されるべき場所に単一列の複数の金属矩形を堆積して、各金属矩形を順次アブレーションすることをさらに含む、請求項1に記載の方法。
- 前記複数のRFID回路が形成されるべき場所に複数列の複数の金属矩形を堆積することと、
一行の複数の金属矩形を同時にアブレーションすることと、
複数の連続した行の複数の金属矩形を同時にアブレーションすることと、をさらに含む、請求項2に記載の方法。 - 複数のレーザヘッドを利用して、前記複数のRFID回路を同時に露光することをさらに含む、請求項2に記載の方法。
- 単一のレーザヘッドを利用して、前記少なくとも一のRFID回路を露光することをさらに含む、請求項1に記載の方法。
- 前記金属層の下に、アブレーションを止めるように構成されたストッピング層を形成することをさらに含む、請求項1に記載の方法。
- ストッピング層を形成することは、自己組織化単分子膜(SAM)を形成することを含む、請求項14に記載の方法。
- 前記金属層の下の追加層の上面を処理して、前記追加層をレーザ光に対してより耐性のあるものにすることをさらに含む、請求項1に記載の方法。
- レーザアブレーションを利用して、前記有機トランジスタの誘電体層に複数の切れ込みを入れて複数のコンタクトを形成することをさらに含む、請求項1に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/204,724 US7176053B1 (en) | 2005-08-16 | 2005-08-16 | Laser ablation method for fabricating high performance organic devices |
US11/204,724 | 2005-08-16 | ||
PCT/US2006/031731 WO2007022129A2 (en) | 2005-08-16 | 2006-08-14 | Laser ablation method for fabricating high performance organic devices |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009505427A JP2009505427A (ja) | 2009-02-05 |
JP5114406B2 true JP5114406B2 (ja) | 2013-01-09 |
Family
ID=37719632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008527041A Active JP5114406B2 (ja) | 2005-08-16 | 2006-08-14 | 高性能の有機デバイス製造用レーザアブレーション法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7176053B1 (ja) |
EP (1) | EP1915791A4 (ja) |
JP (1) | JP5114406B2 (ja) |
KR (1) | KR100972920B1 (ja) |
WO (1) | WO2007022129A2 (ja) |
Families Citing this family (24)
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KR100752374B1 (ko) * | 2005-11-11 | 2007-08-27 | 삼성에스디아이 주식회사 | 유기 박막 트랜지스터의 제조방법 |
US20070126556A1 (en) * | 2005-12-07 | 2007-06-07 | Kovio, Inc. | Printed radio frequency identification (RFID) tag using tags-talk-first (TTF) protocol |
US8786510B2 (en) | 2006-01-24 | 2014-07-22 | Avery Dennison Corporation | Radio frequency (RF) antenna containing element and methods of making the same |
US8240022B2 (en) * | 2006-09-26 | 2012-08-14 | Feinics Amatech Teorowita | Methods of connecting an antenna to a transponder chip |
US7979975B2 (en) * | 2007-04-10 | 2011-07-19 | Feinics Amatech Teavanta | Methods of connecting an antenna to a transponder chip |
US8608080B2 (en) * | 2006-09-26 | 2013-12-17 | Feinics Amatech Teoranta | Inlays for security documents |
US7581308B2 (en) | 2007-01-01 | 2009-09-01 | Advanced Microelectronic And Automation Technology Ltd. | Methods of connecting an antenna to a transponder chip |
US20080083706A1 (en) * | 2006-10-05 | 2008-04-10 | Mu-Gahat Enterprises, Llc | Reverse side film laser circuit etching |
US7633035B2 (en) * | 2006-10-05 | 2009-12-15 | Mu-Gahat Holdings Inc. | Reverse side film laser circuit etching |
US7681301B2 (en) * | 2007-03-07 | 2010-03-23 | James Neil Rodgers | RFID silicon antenna |
US7980477B2 (en) * | 2007-05-17 | 2011-07-19 | Féinics Amatech Teoranta | Dual interface inlays |
US20090061112A1 (en) * | 2007-08-27 | 2009-03-05 | Mu-Gahat Enterprises, Llc | Laser circuit etching by subtractive deposition |
US20090061251A1 (en) * | 2007-08-27 | 2009-03-05 | Mu-Gahat Enterprises, Llc | Laser circuit etching by additive deposition |
US7662726B2 (en) * | 2007-09-13 | 2010-02-16 | Infineon Technologies Ag | Integrated circuit device having a gas-phase deposited insulation layer |
US20090155963A1 (en) * | 2007-12-12 | 2009-06-18 | Hawkins Gilbert A | Forming thin film transistors using ablative films |
US20090155994A1 (en) * | 2007-12-12 | 2009-06-18 | Hawkins Gilbert A | Forming thin film transistors using ablative films with pre-patterned conductors |
DE102009056122A1 (de) * | 2009-11-30 | 2011-06-01 | Smartrac Ip B.V. | Verfahren zur Kontaktierung eines Chips |
FR2959865B1 (fr) * | 2010-05-07 | 2013-04-05 | Commissariat Energie Atomique | Diminution des effets de casquettes dues a l'ablation laser d'un niveau metallique par utilisation d'une couche de polymere photo- ou thermo-reticulable non reticule |
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US8593727B2 (en) | 2011-04-25 | 2013-11-26 | Vladimir G. Kozlov | Single-shot laser ablation of a metal film on a polymer membrane |
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US9425571B2 (en) * | 2012-01-06 | 2016-08-23 | Johnson & Johnson Vision Care, Inc. | Methods and apparatus to form electrical interconnects on ophthalmic devices |
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US11289378B2 (en) | 2019-06-13 | 2022-03-29 | Wolfspeed, Inc. | Methods for dicing semiconductor wafers and semiconductor devices made by the methods |
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US6203952B1 (en) * | 1999-01-14 | 2001-03-20 | 3M Innovative Properties Company | Imaged article on polymeric substrate |
EP1309994A2 (de) * | 2000-08-18 | 2003-05-14 | Siemens Aktiengesellschaft | Verkapseltes organisch-elektronisches bauteil, verfahren zu seiner herstellung und seine verwendung |
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JP2002212236A (ja) * | 2001-01-16 | 2002-07-31 | Fuji Photo Film Co Ltd | 熱硬化性樹脂組成物、転写材料および層間絶縁膜の形成方法 |
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JP2005183889A (ja) * | 2003-12-24 | 2005-07-07 | Konica Minolta Holdings Inc | 薄膜トランジスタシート及びその作製方法、それにより形成された薄膜トランジスタ素子 |
US20050156656A1 (en) * | 2004-01-15 | 2005-07-21 | Rotzoll Robert R. | Non-quasistatic rectifier circuit |
-
2005
- 2005-08-16 US US11/204,724 patent/US7176053B1/en active Active
-
2006
- 2006-08-14 EP EP06801473A patent/EP1915791A4/en not_active Withdrawn
- 2006-08-14 JP JP2008527041A patent/JP5114406B2/ja active Active
- 2006-08-14 WO PCT/US2006/031731 patent/WO2007022129A2/en active Application Filing
- 2006-08-14 KR KR1020087001106A patent/KR100972920B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US7176053B1 (en) | 2007-02-13 |
JP2009505427A (ja) | 2009-02-05 |
EP1915791A4 (en) | 2010-05-05 |
KR100972920B1 (ko) | 2010-07-28 |
WO2007022129A2 (en) | 2007-02-22 |
WO2007022129A3 (en) | 2008-11-13 |
KR20080045112A (ko) | 2008-05-22 |
EP1915791A2 (en) | 2008-04-30 |
US20070042525A1 (en) | 2007-02-22 |
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