JP2006165454A - 半導体装置の製造方法および半導体装置 - Google Patents

半導体装置の製造方法および半導体装置 Download PDF

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Publication number
JP2006165454A
JP2006165454A JP2004358140A JP2004358140A JP2006165454A JP 2006165454 A JP2006165454 A JP 2006165454A JP 2004358140 A JP2004358140 A JP 2004358140A JP 2004358140 A JP2004358140 A JP 2004358140A JP 2006165454 A JP2006165454 A JP 2006165454A
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JP
Japan
Prior art keywords
wiring
connection hole
semiconductor device
alloy layer
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004358140A
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English (en)
Japanese (ja)
Inventor
Shinichi Arakawa
伸一 荒川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2004358140A priority Critical patent/JP2006165454A/ja
Priority to US11/287,532 priority patent/US7416974B2/en
Priority to TW094141805A priority patent/TW200631132A/zh
Priority to KR1020050119236A priority patent/KR20060065512A/ko
Publication of JP2006165454A publication Critical patent/JP2006165454A/ja
Priority to US12/147,572 priority patent/US7851924B2/en
Pending legal-status Critical Current

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    • H10W20/064—
    • H10W20/01—
    • H10D64/011—
    • H10W20/034—
    • H10W20/036—
    • H10W20/037—
    • H10W20/041—
    • H10W20/0526—
    • H10W20/054—
    • H10W20/077—
    • H10W20/081—
    • H10W20/083—
    • H10W20/084—
    • H10W20/42—
    • H10W20/425—

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2004358140A 2004-12-10 2004-12-10 半導体装置の製造方法および半導体装置 Pending JP2006165454A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004358140A JP2006165454A (ja) 2004-12-10 2004-12-10 半導体装置の製造方法および半導体装置
US11/287,532 US7416974B2 (en) 2004-12-10 2005-11-22 Method of manufacturing semiconductor device, and semiconductor device
TW094141805A TW200631132A (en) 2004-12-10 2005-11-29 Semiconductor device and method for manufacturing the same
KR1020050119236A KR20060065512A (ko) 2004-12-10 2005-12-08 반도체 장치의 제조 방법 및 반도체 장치
US12/147,572 US7851924B2 (en) 2004-12-10 2008-06-27 Method of manufacturing semiconductor device, and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004358140A JP2006165454A (ja) 2004-12-10 2004-12-10 半導体装置の製造方法および半導体装置

Publications (1)

Publication Number Publication Date
JP2006165454A true JP2006165454A (ja) 2006-06-22

Family

ID=36582864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004358140A Pending JP2006165454A (ja) 2004-12-10 2004-12-10 半導体装置の製造方法および半導体装置

Country Status (4)

Country Link
US (2) US7416974B2 (enExample)
JP (1) JP2006165454A (enExample)
KR (1) KR20060065512A (enExample)
TW (1) TW200631132A (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8043484B1 (en) 2001-03-13 2011-10-25 Novellus Systems, Inc. Methods and apparatus for resputtering process that improves barrier coverage
US6764940B1 (en) 2001-03-13 2004-07-20 Novellus Systems, Inc. Method for depositing a diffusion barrier for copper interconnect applications
US7842605B1 (en) 2003-04-11 2010-11-30 Novellus Systems, Inc. Atomic layer profiling of diffusion barrier and metal seed layers
US8298933B2 (en) 2003-04-11 2012-10-30 Novellus Systems, Inc. Conformal films on semiconductor substrates
US7432195B2 (en) * 2006-03-29 2008-10-07 Tokyo Electron Limited Method for integrating a conformal ruthenium layer into copper metallization of high aspect ratio features
US7855147B1 (en) * 2006-06-22 2010-12-21 Novellus Systems, Inc. Methods and apparatus for engineering an interface between a diffusion barrier layer and a seed layer
US7473634B2 (en) * 2006-09-28 2009-01-06 Tokyo Electron Limited Method for integrated substrate processing in copper metallization
US7510634B1 (en) 2006-11-10 2009-03-31 Novellus Systems, Inc. Apparatus and methods for deposition and/or etch selectivity
US7569475B2 (en) * 2006-11-15 2009-08-04 International Business Machines Corporation Interconnect structure having enhanced electromigration reliability and a method of fabricating same
KR100795363B1 (ko) * 2006-11-24 2008-01-17 삼성전자주식회사 반도체 소자의 도전성 배선 및 이의 형성방법과 이를구비하는 플래시 메모리 장치 및 이의 제조 방법
WO2008074672A1 (en) * 2006-12-20 2008-06-26 Nxp B.V. Improving adhesion of diffusion barrier on cu containing interconnect element
KR100790452B1 (ko) * 2006-12-28 2008-01-03 주식회사 하이닉스반도체 다마신 공정을 이용한 반도체 소자의 다층 금속배선형성방법
JP5103914B2 (ja) * 2007-01-31 2012-12-19 富士通セミコンダクター株式会社 半導体装置の製造方法及び半導体装置
US7682966B1 (en) 2007-02-01 2010-03-23 Novellus Systems, Inc. Multistep method of depositing metal seed layers
US7922880B1 (en) 2007-05-24 2011-04-12 Novellus Systems, Inc. Method and apparatus for increasing local plasma density in magnetically confined plasma
US7897516B1 (en) 2007-05-24 2011-03-01 Novellus Systems, Inc. Use of ultra-high magnetic fields in resputter and plasma etching
DE102007035834A1 (de) * 2007-07-31 2009-02-05 Advanced Micro Devices, Inc., Sunnyvale Halbleiterbauelement mit lokal erhöhtem Elektromigrationswiderstand in einer Verbindungsstruktur
US7846834B2 (en) * 2008-02-04 2010-12-07 International Business Machines Corporation Interconnect structure and method for Cu/ultra low k integration
US8017523B1 (en) 2008-05-16 2011-09-13 Novellus Systems, Inc. Deposition of doped copper seed layers having improved reliability
KR100997315B1 (ko) * 2008-07-15 2010-11-29 주식회사 동부하이텍 이미지 센서의 제조 방법
TWI394239B (zh) * 2008-12-17 2013-04-21 Univ Ishou The integrated circuit with the isolation layer of metal ion migration and its encapsulation structure
US8288276B2 (en) * 2008-12-30 2012-10-16 International Business Machines Corporation Method of forming an interconnect structure including a metallic interfacial layer located at a bottom via portion
US8299567B2 (en) * 2010-11-23 2012-10-30 International Business Machines Corporation Structure of metal e-fuse
DE102016125299B4 (de) 2016-01-29 2024-10-02 Taiwan Semiconductor Manufacturing Co., Ltd. Halbleitervorrichtung und Verfahren zu ihrer Herstellung
US10153351B2 (en) * 2016-01-29 2018-12-11 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and a method for fabricating the same
KR102493464B1 (ko) 2018-07-19 2023-01-30 삼성전자 주식회사 집적회로 장치 및 이의 제조 방법
US10580696B1 (en) * 2018-08-21 2020-03-03 Globalfoundries Inc. Interconnects formed by a metal displacement reaction
US11502000B2 (en) * 2020-08-24 2022-11-15 Taiwan Semiconductor Manufacturing Co., Ltd. Bottom lateral expansion of contact plugs through implantation
TWI844803B (zh) 2021-10-28 2024-06-11 鴻海精密工業股份有限公司 光子晶體面射型雷射裝置及光學系統
CN117199155B (zh) * 2023-11-06 2024-02-13 杭州特洛伊光电技术有限公司 一种波导型可见光及近红外光探测器结构与制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0250432A (ja) 1988-08-12 1990-02-20 Toshiba Corp 半導体装置
JPH07297194A (ja) 1994-04-25 1995-11-10 Sony Corp マルチチャンバー装置及び半導体装置の製造方法
US6555465B2 (en) * 1997-12-05 2003-04-29 Yamaha Corp. Multi-layer wiring structure of integrated circuit and manufacture of multi-layer wiring
US6075291A (en) * 1998-02-27 2000-06-13 Micron Technology, Inc. Structure for contact formation using a silicon-germanium alloy
JP2001341977A (ja) 2000-06-01 2001-12-11 Ishikawajima Harima Heavy Ind Co Ltd ホイストクレーン
WO2006058034A2 (en) * 2004-11-22 2006-06-01 Intermolecular, Inc. Molecular self-assembly in substrate processing

Also Published As

Publication number Publication date
US7416974B2 (en) 2008-08-26
US7851924B2 (en) 2010-12-14
TWI299542B (enExample) 2008-08-01
US20060125100A1 (en) 2006-06-15
TW200631132A (en) 2006-09-01
US20080265418A1 (en) 2008-10-30
KR20060065512A (ko) 2006-06-14

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