JP2006152303A5 - - Google Patents

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Publication number
JP2006152303A5
JP2006152303A5 JP2005346074A JP2005346074A JP2006152303A5 JP 2006152303 A5 JP2006152303 A5 JP 2006152303A5 JP 2005346074 A JP2005346074 A JP 2005346074A JP 2005346074 A JP2005346074 A JP 2005346074A JP 2006152303 A5 JP2006152303 A5 JP 2006152303A5
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JP
Japan
Prior art keywords
composition
organic solvent
salt
substrate
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005346074A
Other languages
English (en)
Japanese (ja)
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JP2006152303A (ja
Filing date
Publication date
Priority claimed from US11/000,147 external-priority patent/US20060116313A1/en
Application filed filed Critical
Publication of JP2006152303A publication Critical patent/JP2006152303A/ja
Publication of JP2006152303A5 publication Critical patent/JP2006152303A5/ja
Withdrawn legal-status Critical Current

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JP2005346074A 2004-11-30 2005-11-30 残留物を除去するための組成物及び方法 Withdrawn JP2006152303A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/000,147 US20060116313A1 (en) 2004-11-30 2004-11-30 Compositions comprising tannic acid as corrosion inhibitor

Publications (2)

Publication Number Publication Date
JP2006152303A JP2006152303A (ja) 2006-06-15
JP2006152303A5 true JP2006152303A5 (https=) 2006-11-30

Family

ID=36568074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005346074A Withdrawn JP2006152303A (ja) 2004-11-30 2005-11-30 残留物を除去するための組成物及び方法

Country Status (6)

Country Link
US (1) US20060116313A1 (https=)
JP (1) JP2006152303A (https=)
KR (1) KR100774276B1 (https=)
CN (1) CN1789400A (https=)
SG (1) SG122932A1 (https=)
TW (1) TWI296357B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4678673B2 (ja) * 2005-05-12 2011-04-27 東京応化工業株式会社 ホトレジスト用剥離液
JP2010222552A (ja) * 2009-02-24 2010-10-07 Sumitomo Chemical Co Ltd 洗浄用組成物及びそれを用いる液晶性ポリエステル製造装置の洗浄方法
KR20110016418A (ko) * 2009-08-11 2011-02-17 동우 화인켐 주식회사 레지스트 박리액 조성물 및 이를 이용한 레지스트의 박리방법
CN103631101B (zh) * 2012-08-22 2018-01-09 得凯莫斯公司弗罗里达有限公司 包含含氟表面活性剂的光阻剥除剂
KR102092919B1 (ko) * 2014-03-21 2020-04-14 동우 화인켐 주식회사 레지스트 박리액 조성물 및 이를 이용한 레지스트의 박리방법
CN105152367A (zh) * 2015-10-10 2015-12-16 无棣华信石油技术服务有限公司 一种环保型油田回注水缓蚀阻垢剂及其制备方法
MX2023002963A (es) * 2020-09-16 2023-05-10 Adama Makhteshim Ltd Formulacion novedosa de fungicidas y bactericidas basados en cobre.
TWI812342B (zh) * 2021-11-22 2023-08-11 南韓商Ｌｇ化學股份有限公司 移除光阻之剝離劑組成物以及使用其之剝離光阻方法
CN119376200B (zh) * 2024-12-31 2025-10-28 芯越微电子材料(嘉兴)有限公司 一种能够保护GaAs和PI衬底的光刻胶剥离液及其应用

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3650957A (en) * 1970-07-24 1972-03-21 Shipley Co Etchant for cupreous metals
US3650959A (en) * 1970-07-24 1972-03-21 Shipley Co Etchant for cupreous metals
US3650958A (en) * 1970-07-24 1972-03-21 Shipley Co Etchant for cupreous metals
US4054466A (en) * 1975-09-10 1977-10-18 Oxy Metal Industries Corporation Tannin treatment of aluminum
US4628023A (en) * 1981-04-10 1986-12-09 Shipley Company Inc. Metal ion free photoresist developer composition with lower alkyl quaternary ammonium hydrozide as alkalai agent and a quaternary ammonium compound as surfactant
US4806453A (en) * 1986-05-07 1989-02-21 Shipley Company Inc. Positive acting bilayer photoresist development
US5496491A (en) * 1991-01-25 1996-03-05 Ashland Oil Company Organic stripping composition
US5597420A (en) * 1995-01-17 1997-01-28 Ashland Inc. Stripping composition having monoethanolamine
US5563119A (en) * 1995-01-26 1996-10-08 Ashland Inc. Stripping compositions containing alkanolamine compounds
JP2911792B2 (ja) * 1995-09-29 1999-06-23 東京応化工業株式会社 レジスト用剥離液組成物
DE69941088D1 (de) * 1998-05-18 2009-08-20 Mallinckrodt Baker Inc Alkalische, silikat enthaltende reinigungslösungen für mikroelektronische substrate
JP2002528903A (ja) * 1998-10-23 2002-09-03 アーチ・スペシャルティ・ケミカルズ・インコーポレイテッド 活性剤溶液を含有し、化学機械的に磨くためのスラリーシステム
US6828289B2 (en) * 1999-01-27 2004-12-07 Air Products And Chemicals, Inc. Low surface tension, low viscosity, aqueous, acidic compositions containing fluoride and organic, polar solvents for removal of photoresist and organic and inorganic etch residues at room temperature
JP3339575B2 (ja) 2000-01-25 2002-10-28 日本電気株式会社 剥離剤組成物および剥離方法
US20030104770A1 (en) * 2001-04-30 2003-06-05 Arch Specialty Chemicals, Inc. Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers
US20030022800A1 (en) * 2001-06-14 2003-01-30 Peters Darryl W. Aqueous buffered fluoride-containing etch residue removers and cleaners
JP4443864B2 (ja) * 2002-07-12 2010-03-31 株式会社ルネサステクノロジ レジストまたはエッチング残さ物除去用洗浄液および半導体装置の製造方法
US7166419B2 (en) * 2002-09-26 2007-01-23 Air Products And Chemicals, Inc. Compositions substrate for removing etching residue and use thereof
US7300601B2 (en) * 2002-12-10 2007-11-27 Advanced Technology Materials, Inc. Passivative chemical mechanical polishing composition for copper film planarization
US8236485B2 (en) * 2002-12-20 2012-08-07 Advanced Technology Materials, Inc. Photoresist removal
US6951710B2 (en) * 2003-05-23 2005-10-04 Air Products And Chemicals, Inc. Compositions suitable for removing photoresist, photoresist byproducts and etching residue, and use thereof
US20050097825A1 (en) * 2003-11-06 2005-05-12 Jinru Bian Compositions and methods for a barrier removal
US7435712B2 (en) * 2004-02-12 2008-10-14 Air Liquide America, L.P. Alkaline chemistry for post-CMP cleaning
US8030263B2 (en) * 2004-07-01 2011-10-04 Air Products And Chemicals, Inc. Composition for stripping and cleaning and use thereof
US9217929B2 (en) * 2004-07-22 2015-12-22 Air Products And Chemicals, Inc. Composition for removing photoresist and/or etching residue from a substrate and use thereof

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