JP2006148067A - GaN系化合物半導体の発光素子 - Google Patents
GaN系化合物半導体の発光素子 Download PDFInfo
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- JP2006148067A JP2006148067A JP2005274754A JP2005274754A JP2006148067A JP 2006148067 A JP2006148067 A JP 2006148067A JP 2005274754 A JP2005274754 A JP 2005274754A JP 2005274754 A JP2005274754 A JP 2005274754A JP 2006148067 A JP2006148067 A JP 2006148067A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 64
- 150000001875 compounds Chemical class 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 14
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims description 3
- 229910001634 calcium fluoride Inorganic materials 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052741 iridium Inorganic materials 0.000 claims description 3
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 claims description 3
- 229910001635 magnesium fluoride Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052707 ruthenium Inorganic materials 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 claims 1
- 239000010410 layer Substances 0.000 description 88
- 229910002601 GaN Inorganic materials 0.000 description 20
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 19
- 238000002310 reflectometry Methods 0.000 description 12
- 238000000605 extraction Methods 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000009429 electrical wiring Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 nitride compound Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
【解決手段】 基板(10)上に順次に積層されたn型半導体層(12)、n型半導体層の第1領域上に形成された活性層(14)、及び活性層上に形成されたp型半導体層(16)と、p型半導体層上に形成されたp型電極(20)と、n型半導体層上で第1領域と離れた第2領域上に形成されたn型電極(30)と、p型半導体層、活性層及びn型半導体層の側壁に形成された誘電層(52)と、誘電層上に形成された反射層(54)とを備えることを特徴とする半導体発光素子。
【選択図】 図1
Description
12 第1化合物半導体層、
14 活性層、
16 第2化合物半導体層、
20 p型電極、
30 n型電極、
40 側壁、
50 高反射層、
52 誘電層、
54 反射膜、
R1 第1領域、
R2 第2領域。
Claims (8)
- 基板と、
前記基板上に形成されたn型半導体層と、
前記n型半導体層の第1領域上に形成された活性層と、
前記活性層上に形成されたp型半導体層と、
前記p型半導体層上に形成されたp型電極と、
前記n型半導体層上で前記第1領域と離れた第2領域上に形成されたn型電極と、
前記p型半導体層、活性層、及びn型半導体層を備えるスタックの側壁に形成された誘電層と、
前記誘電層上に形成された反射層と、
を備えることを特徴とする半導体発光素子。 - 前記誘電層の屈折率は、1から2.5であることを特徴とする請求項1に記載の半導体発光素子。
- 前記誘電層は、シリコン酸化物、窒化ケイ素、酸窒化ケイ素、アルミニウム酸化物、フッ化リチウム、フッ化カルシウム、及びフッ化マグネシウムからなる群から選択される何れか一つであることを特徴とする請求項2に記載の半導体発光素子。
- 前記誘電層の厚さは、前記活性層からの光の波長(nm)の1/4であることを特徴とする請求項1に記載の半導体発光素子。
- 前記基板は、透光材料からなることを特徴とする請求項1に記載の半導体発光素子。
- 前記基板は、サファイアからなることを特徴とする請求項5に記載の半導体発光素子。
- 前記反射層は、Ag、Al、Au、Pt、Ru、及びIrからなる群から選択される何れか一つで形成されることを特徴とする請求項1に記載の半導体発光素子。
- 前記n型半導体層、活性層、及びp型半導体層は、GaN系列のIII−V族窒化物系の化合物であることを特徴とする請求項1に記載の半導体発光素子。
Applications Claiming Priority (1)
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KR1020040096149A KR100862453B1 (ko) | 2004-11-23 | 2004-11-23 | GaN 계 화합물 반도체 발광소자 |
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JP2012058847A Division JP2012109639A (ja) | 2004-11-23 | 2012-03-15 | GaN系化合物半導体の発光素子 |
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JP2005274754A Pending JP2006148067A (ja) | 2004-11-23 | 2005-09-21 | GaN系化合物半導体の発光素子 |
JP2012058847A Pending JP2012109639A (ja) | 2004-11-23 | 2012-03-15 | GaN系化合物半導体の発光素子 |
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US (1) | US7566910B2 (ja) |
JP (2) | JP2006148067A (ja) |
KR (1) | KR100862453B1 (ja) |
Cited By (3)
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JP2010525586A (ja) * | 2007-04-26 | 2010-07-22 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | オプトエレクトロニクス部品及びオプトエレクトロニクス部品の製造方法 |
JP2012114377A (ja) * | 2010-11-26 | 2012-06-14 | Mitsubishi Chemicals Corp | 半導体発光素子 |
JP2020150274A (ja) * | 2011-06-01 | 2020-09-17 | ルミレッズ ホールディング ベーフェー | 発光デバイスを支持基板に取り付ける方法 |
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KR100714638B1 (ko) * | 2006-02-16 | 2007-05-07 | 삼성전기주식회사 | 단면 발광형 led 및 그 제조방법 |
KR100752719B1 (ko) * | 2006-08-16 | 2007-08-29 | 삼성전기주식회사 | 플립칩용 질화물계 발광다이오드 |
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US7985979B2 (en) | 2007-12-19 | 2011-07-26 | Koninklijke Philips Electronics, N.V. | Semiconductor light emitting device with light extraction structures |
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CN101872824A (zh) * | 2010-06-07 | 2010-10-27 | 厦门市三安光电科技有限公司 | 侧面具有双反射层的氮化镓基倒装发光二极管及其制备方法 |
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KR101623986B1 (ko) * | 2007-04-26 | 2016-05-24 | 오스람 옵토 세미컨덕터스 게엠베하 | 광전 소자,및 복수 개의 광전 소자들의 제조 방법 |
JP2012114377A (ja) * | 2010-11-26 | 2012-06-14 | Mitsubishi Chemicals Corp | 半導体発光素子 |
JP2020150274A (ja) * | 2011-06-01 | 2020-09-17 | ルミレッズ ホールディング ベーフェー | 発光デバイスを支持基板に取り付ける方法 |
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KR20060057090A (ko) | 2006-05-26 |
KR100862453B1 (ko) | 2008-10-08 |
JP2012109639A (ja) | 2012-06-07 |
US7566910B2 (en) | 2009-07-28 |
US20060108593A1 (en) | 2006-05-25 |
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