JP2006124607A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2006124607A5 JP2006124607A5 JP2004318130A JP2004318130A JP2006124607A5 JP 2006124607 A5 JP2006124607 A5 JP 2006124607A5 JP 2004318130 A JP2004318130 A JP 2004318130A JP 2004318130 A JP2004318130 A JP 2004318130A JP 2006124607 A5 JP2006124607 A5 JP 2006124607A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive adhesive
- conductive
- filler
- metal
- adhesive according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 31
- 230000001070 adhesive effect Effects 0.000 claims description 31
- 239000000945 filler Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 239000010419 fine particle Substances 0.000 claims description 12
- 239000011231 conductive filler Substances 0.000 claims description 11
- 239000002105 nanoparticle Substances 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 238000001723 curing Methods 0.000 claims description 7
- 239000005011 phenolic resin Substances 0.000 claims description 6
- 150000008065 acid anhydrides Chemical class 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 238000013007 heat curing Methods 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- 230000015556 catabolic process Effects 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 9
- 239000010953 base metal Substances 0.000 claims 4
- 239000003822 epoxy resin Substances 0.000 claims 2
- 125000001624 naphthyl group Chemical group 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 230000009477 glass transition Effects 0.000 claims 1
- 229920003986 novolac Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910000510 noble metal Inorganic materials 0.000 description 4
- 230000004927 fusion Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004318130A JP5157038B2 (ja) | 2004-11-01 | 2004-11-01 | 導電性接着剤およびそれを用いた電子装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004318130A JP5157038B2 (ja) | 2004-11-01 | 2004-11-01 | 導電性接着剤およびそれを用いた電子装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006124607A JP2006124607A (ja) | 2006-05-18 |
| JP2006124607A5 true JP2006124607A5 (enExample) | 2010-02-25 |
| JP5157038B2 JP5157038B2 (ja) | 2013-03-06 |
Family
ID=36719643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004318130A Expired - Fee Related JP5157038B2 (ja) | 2004-11-01 | 2004-11-01 | 導電性接着剤およびそれを用いた電子装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5157038B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008218643A (ja) * | 2007-03-02 | 2008-09-18 | Fujitsu Ltd | 半導体装置及びその製造方法 |
| TWI491601B (zh) * | 2008-09-25 | 2015-07-11 | Sekisui Chemical Co Ltd | A sulfide compound, a mixture containing a cyclic sulfide, a process for producing a mixture containing a cyclic sulfide, a hardened composition and a connecting structure |
| JP6681437B2 (ja) * | 2017-07-03 | 2020-04-15 | Ｄｏｗａエレクトロニクス株式会社 | 導電性ペースト |
| JP7784385B2 (ja) * | 2020-11-04 | 2025-12-11 | リンテック株式会社 | 接着フィルムの使用方法、硬化体の製造方法および構造体の製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000207942A (ja) * | 1999-01-11 | 2000-07-28 | Toshiba Chem Corp | 異方性導電接着剤 |
| JP2000290617A (ja) * | 1999-04-08 | 2000-10-17 | Asahi Chem Ind Co Ltd | 導電性接着剤およびその使用法 |
| JP4019254B2 (ja) * | 2002-04-24 | 2007-12-12 | 信越化学工業株式会社 | 導電性樹脂組成物 |
| JP4055583B2 (ja) * | 2003-01-15 | 2008-03-05 | 日立化成工業株式会社 | 回路接続用接着剤組成物、これを用いた回路端子の接続方法及び回路端子の接続構造 |
-
2004
- 2004-11-01 JP JP2004318130A patent/JP5157038B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4593123B2 (ja) | 導電性接着剤 | |
| JP2011054892A (ja) | 導電性ペーストを用いたはんだ接合 | |
| CN104540869B (zh) | 电子部件用固化性组合物、连接结构体及连接结构体的制造方法 | |
| TW201643894A (zh) | 導電性糊及使用其之多層基板 | |
| TWI546149B (zh) | 錫膏及其製備方法 | |
| JP5195061B2 (ja) | 導電性接着剤およびそれを用いた部材の接続方法 | |
| JP4840097B2 (ja) | 導電性銅ペースト | |
| CN107189103B (zh) | 一种导电填料、其制备方法及用途 | |
| JP2006124607A5 (enExample) | ||
| JP2010278025A (ja) | 異方性導電フィルム | |
| JPS60189229A (ja) | 半導体素子 | |
| JP2008097922A (ja) | 電極接続用接着剤 | |
| JP2007026776A (ja) | 導電性微粒子およびそれを用いた接着剤 | |
| JP4867805B2 (ja) | 電極接続用接着剤 | |
| JP2007317563A (ja) | 回路接続用接着剤 | |
| Yim et al. | Characteristics of isotropically conductive adhesive (ICA) filled with carbon nanotubes (CNTs) and low-melting-point alloy fillers | |
| JP2019121568A (ja) | はんだ密着金属ペースト導電膜の製造方法 | |
| JP5157038B2 (ja) | 導電性接着剤およびそれを用いた電子装置 | |
| JP5351786B2 (ja) | 熱硬化性樹脂組成物およびその製造方法 | |
| JP5273514B2 (ja) | 電極接続用接着剤とその製造方法 | |
| JP5076412B2 (ja) | 導電性接着剤 | |
| JP2004238483A (ja) | 異方性導電塗料及びそれを用いてなる異方性導電膜 | |
| JP2006260951A (ja) | 導電性銅ペースト | |
| JP2008226726A (ja) | 導電性ペースト | |
| JPH07252460A (ja) | 接着剤 |