JP5157038B2 - 導電性接着剤およびそれを用いた電子装置 - Google Patents

導電性接着剤およびそれを用いた電子装置 Download PDF

Info

Publication number
JP5157038B2
JP5157038B2 JP2004318130A JP2004318130A JP5157038B2 JP 5157038 B2 JP5157038 B2 JP 5157038B2 JP 2004318130 A JP2004318130 A JP 2004318130A JP 2004318130 A JP2004318130 A JP 2004318130A JP 5157038 B2 JP5157038 B2 JP 5157038B2
Authority
JP
Japan
Prior art keywords
conductive adhesive
filler
conductive
resin
curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004318130A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006124607A5 (enExample
JP2006124607A (ja
Inventor
今井　　博和
祐司 大谷
真志 都外川
泰徳 二宮
幸紀 右高
長坂　　崇
道典 駒形
剛 戸井田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Denso Corp
Original Assignee
Namics Corp
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp, Denso Corp filed Critical Namics Corp
Priority to JP2004318130A priority Critical patent/JP5157038B2/ja
Publication of JP2006124607A publication Critical patent/JP2006124607A/ja
Publication of JP2006124607A5 publication Critical patent/JP2006124607A5/ja
Application granted granted Critical
Publication of JP5157038B2 publication Critical patent/JP5157038B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
JP2004318130A 2004-11-01 2004-11-01 導電性接着剤およびそれを用いた電子装置 Expired - Fee Related JP5157038B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004318130A JP5157038B2 (ja) 2004-11-01 2004-11-01 導電性接着剤およびそれを用いた電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004318130A JP5157038B2 (ja) 2004-11-01 2004-11-01 導電性接着剤およびそれを用いた電子装置

Publications (3)

Publication Number Publication Date
JP2006124607A JP2006124607A (ja) 2006-05-18
JP2006124607A5 JP2006124607A5 (enExample) 2010-02-25
JP5157038B2 true JP5157038B2 (ja) 2013-03-06

Family

ID=36719643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004318130A Expired - Fee Related JP5157038B2 (ja) 2004-11-01 2004-11-01 導電性接着剤およびそれを用いた電子装置

Country Status (1)

Country Link
JP (1) JP5157038B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218643A (ja) * 2007-03-02 2008-09-18 Fujitsu Ltd 半導体装置及びその製造方法
TWI491601B (zh) * 2008-09-25 2015-07-11 Sekisui Chemical Co Ltd A sulfide compound, a mixture containing a cyclic sulfide, a process for producing a mixture containing a cyclic sulfide, a hardened composition and a connecting structure
JP6681437B2 (ja) * 2017-07-03 2020-04-15 Ｄｏｗａエレクトロニクス株式会社 導電性ペースト
JP7784385B2 (ja) * 2020-11-04 2025-12-11 リンテック株式会社 接着フィルムの使用方法、硬化体の製造方法および構造体の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000207942A (ja) * 1999-01-11 2000-07-28 Toshiba Chem Corp 異方性導電接着剤
JP2000290617A (ja) * 1999-04-08 2000-10-17 Asahi Chem Ind Co Ltd 導電性接着剤およびその使用法
JP4019254B2 (ja) * 2002-04-24 2007-12-12 信越化学工業株式会社 導電性樹脂組成物
JP4055583B2 (ja) * 2003-01-15 2008-03-05 日立化成工業株式会社 回路接続用接着剤組成物、これを用いた回路端子の接続方法及び回路端子の接続構造

Also Published As

Publication number Publication date
JP2006124607A (ja) 2006-05-18

Similar Documents

Publication Publication Date Title
JP4593123B2 (ja) 導電性接着剤
JPWO2008026517A1 (ja) 導電性接合材料、及び電子装置
TWI588237B (zh) 導電性接著劑
JP5195061B2 (ja) 導電性接着剤およびそれを用いた部材の接続方法
JP2007269959A (ja) 導電性接着剤、電子装置およびその製造方法
JPWO2006080247A1 (ja) 導電性ペースト
CN102069186A (zh) 一种微米银片表面处理及制备高电导率导电胶的方法
WO2006013793A1 (ja) 導電ペーストおよびそれを用いた電子部品搭載基板
JP5157038B2 (ja) 導電性接着剤およびそれを用いた電子装置
JP4720481B2 (ja) 電子装置の製造方法
JP2008094908A (ja) 電極接続用接着剤
JP4933217B2 (ja) 導電性接着剤
JPH10279903A (ja) 導電性接着剤
JP4867805B2 (ja) 電極接続用接着剤
JP2007056209A (ja) 回路接続用接着剤
JP2748615B2 (ja) 導電性接着剤
TW201711057A (zh) 安裝用導電性糊
JP2000192000A (ja) 導電性接着剤
JP2720343B2 (ja) 導電性ペースト
JP2006265484A (ja) 接着性樹脂組成物及び電子装置
JP2005317491A (ja) 導電ペーストおよびそれを用いた電子部品搭載基板
JPH10265748A (ja) 導電性接着剤
JP2584424B2 (ja) 樹脂封止型半導体装置
JP2002338923A (ja) 導電性接着剤
Luyckx et al. Electrically Conductive Adhesives as Solder Alternative: A Feasible Challenge

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070131

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100107

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100513

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100525

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100723

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110705

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110831

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20120605

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120903

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121005

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20121026

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20121113

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20121126

R150 Certificate of patent or registration of utility model

Ref document number: 5157038

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20151221

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees