JP2006114738A - レジスト剥離方法およびレジスト剥離装置 - Google Patents

レジスト剥離方法およびレジスト剥離装置 Download PDF

Info

Publication number
JP2006114738A
JP2006114738A JP2004301366A JP2004301366A JP2006114738A JP 2006114738 A JP2006114738 A JP 2006114738A JP 2004301366 A JP2004301366 A JP 2004301366A JP 2004301366 A JP2004301366 A JP 2004301366A JP 2006114738 A JP2006114738 A JP 2006114738A
Authority
JP
Japan
Prior art keywords
steam
substrate
resist
water
water mist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2004301366A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006114738A5 (enExample
Inventor
Norio Suzuki
則夫 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
REALIZE ADVANCED Tech Ltd
Original Assignee
REALIZE ADVANCED Tech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by REALIZE ADVANCED Tech Ltd filed Critical REALIZE ADVANCED Tech Ltd
Priority to JP2004301366A priority Critical patent/JP2006114738A/ja
Priority to TW094142111A priority patent/TW200721288A/zh
Publication of JP2006114738A publication Critical patent/JP2006114738A/ja
Publication of JP2006114738A5 publication Critical patent/JP2006114738A5/ja
Ceased legal-status Critical Current

Links

Images

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2004301366A 2004-10-15 2004-10-15 レジスト剥離方法およびレジスト剥離装置 Ceased JP2006114738A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004301366A JP2006114738A (ja) 2004-10-15 2004-10-15 レジスト剥離方法およびレジスト剥離装置
TW094142111A TW200721288A (en) 2004-10-15 2005-11-30 Method and apparatus for peeling resist

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004301366A JP2006114738A (ja) 2004-10-15 2004-10-15 レジスト剥離方法およびレジスト剥離装置

Publications (2)

Publication Number Publication Date
JP2006114738A true JP2006114738A (ja) 2006-04-27
JP2006114738A5 JP2006114738A5 (enExample) 2007-11-29

Family

ID=36383000

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004301366A Ceased JP2006114738A (ja) 2004-10-15 2004-10-15 レジスト剥離方法およびレジスト剥離装置

Country Status (2)

Country Link
JP (1) JP2006114738A (enExample)
TW (1) TW200721288A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007324359A (ja) * 2006-05-31 2007-12-13 Choonpa Jozosho Kk 洗浄方法と洗浄装置
CN113118102A (zh) * 2019-12-31 2021-07-16 苏州阿洛斯环境发生器有限公司 一种微液滴集群载气混合清洗系统
CN113118103A (zh) * 2019-12-31 2021-07-16 苏州阿洛斯环境发生器有限公司 一种共混超声驱动控制微液滴集群清洗系统
CN113118104A (zh) * 2019-12-31 2021-07-16 苏州阿洛斯环境发生器有限公司 一种多通超声驱动控制微液滴集群清洗系统

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002096003A (ja) * 2000-06-02 2002-04-02 Spraying Syst Co 改良型空気式スプレーノズル
JP2003071332A (ja) * 2001-08-31 2003-03-11 Lam Research Kk 水供給装置および水供給方法
JP2003282513A (ja) * 2002-03-26 2003-10-03 Seiko Epson Corp 有機物剥離方法及び有機物剥離装置
JP2004214587A (ja) * 2002-11-12 2004-07-29 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2004237282A (ja) * 2003-01-16 2004-08-26 Kyoritsu Gokin Co Ltd 二流体ノズル
JP2004273799A (ja) * 2003-03-10 2004-09-30 Dainippon Screen Mfg Co Ltd 基板用リンス液、基板処理方法および基板処理装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002096003A (ja) * 2000-06-02 2002-04-02 Spraying Syst Co 改良型空気式スプレーノズル
JP2003071332A (ja) * 2001-08-31 2003-03-11 Lam Research Kk 水供給装置および水供給方法
JP2003282513A (ja) * 2002-03-26 2003-10-03 Seiko Epson Corp 有機物剥離方法及び有機物剥離装置
JP2004214587A (ja) * 2002-11-12 2004-07-29 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2004237282A (ja) * 2003-01-16 2004-08-26 Kyoritsu Gokin Co Ltd 二流体ノズル
JP2004273799A (ja) * 2003-03-10 2004-09-30 Dainippon Screen Mfg Co Ltd 基板用リンス液、基板処理方法および基板処理装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007324359A (ja) * 2006-05-31 2007-12-13 Choonpa Jozosho Kk 洗浄方法と洗浄装置
CN113118102A (zh) * 2019-12-31 2021-07-16 苏州阿洛斯环境发生器有限公司 一种微液滴集群载气混合清洗系统
CN113118103A (zh) * 2019-12-31 2021-07-16 苏州阿洛斯环境发生器有限公司 一种共混超声驱动控制微液滴集群清洗系统
CN113118104A (zh) * 2019-12-31 2021-07-16 苏州阿洛斯环境发生器有限公司 一种多通超声驱动控制微液滴集群清洗系统

Also Published As

Publication number Publication date
TW200721288A (en) 2007-06-01

Similar Documents

Publication Publication Date Title
WO2011052111A1 (ja) 基板洗浄装置及び基板洗浄方法
JP2002208579A (ja) 基板処理装置および基板処理方法
JP2010269214A (ja) ノズル洗浄装置
JP5399678B2 (ja) レジスト剥離装置
KR101244086B1 (ko) 기판 세정 장치 및 방법
CN101009206A (zh) 基板处理装置及基板处理方法
JP2008288541A (ja) 枚葉式洗浄装置
JP2006114738A (ja) レジスト剥離方法およびレジスト剥離装置
JP2006114738A5 (enExample)
KR102759188B1 (ko) 수증기 보조 단일 기판 세정 프로세스 및 장치
KR100487834B1 (ko) 레이저를 이용한 패턴마스크 세정방법 및 장치
KR20060050162A (ko) 세정 방법 및 그것을 실시하기 위한 세정 장치
US7766021B2 (en) Substrate treatment apparatus
JP4799807B2 (ja) 対象物処理装置及び対象物処理方法
JP2007038209A (ja) 基板洗浄装置および基板洗浄方法
JP2004152849A (ja) 液処理装置及び液処理方法
JP2004260099A (ja) 処理流体供給装置およびこれを適用した基板処理装置、ならびに基板処理方法
KR101992987B1 (ko) 펄스신호를 이용하는 유체 분사 장치
KR100576823B1 (ko) 기판세정장치
JP2006210598A (ja) 基板の処理装置及び処理方法
WO2007063576A1 (ja) レジスト剥離方法およびレジスト剥離装置
JP2004342886A (ja) 基板処理装置および基板処理方法
JP2006245051A (ja) 基板処理装置及び基板処理方法
JP3756381B2 (ja) 基板洗浄装置
KR100314225B1 (ko) 유리기판 또는 웨이퍼 처리용 분사장치

Legal Events

Date Code Title Description
A521 Written amendment

Effective date: 20071015

Free format text: JAPANESE INTERMEDIATE CODE: A523

A621 Written request for application examination

Effective date: 20071015

Free format text: JAPANESE INTERMEDIATE CODE: A621

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080117

A01 Written decision to grant a patent or to grant a registration (utility model)

Effective date: 20100629

Free format text: JAPANESE INTERMEDIATE CODE: A01

A045 Written measure of dismissal of application

Effective date: 20101026

Free format text: JAPANESE INTERMEDIATE CODE: A045