JP2006086408A5 - - Google Patents

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Publication number
JP2006086408A5
JP2006086408A5 JP2004271133A JP2004271133A JP2006086408A5 JP 2006086408 A5 JP2006086408 A5 JP 2006086408A5 JP 2004271133 A JP2004271133 A JP 2004271133A JP 2004271133 A JP2004271133 A JP 2004271133A JP 2006086408 A5 JP2006086408 A5 JP 2006086408A5
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JP
Japan
Prior art keywords
cavity
led
tip
led chip
inner peripheral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004271133A
Other languages
English (en)
Japanese (ja)
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JP2006086408A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004271133A priority Critical patent/JP2006086408A/ja
Priority claimed from JP2004271133A external-priority patent/JP2006086408A/ja
Publication of JP2006086408A publication Critical patent/JP2006086408A/ja
Publication of JP2006086408A5 publication Critical patent/JP2006086408A5/ja
Pending legal-status Critical Current

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JP2004271133A 2004-09-17 2004-09-17 Ｌｅｄ装置 Pending JP2006086408A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004271133A JP2006086408A (ja) 2004-09-17 2004-09-17 Ｌｅｄ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004271133A JP2006086408A (ja) 2004-09-17 2004-09-17 Ｌｅｄ装置

Publications (2)

Publication Number Publication Date
JP2006086408A JP2006086408A (ja) 2006-03-30
JP2006086408A5 true JP2006086408A5 (enExample) 2007-10-25

Family

ID=36164646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004271133A Pending JP2006086408A (ja) 2004-09-17 2004-09-17 Ｌｅｄ装置

Country Status (1)

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JP (1) JP2006086408A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100649765B1 (ko) * 2005-12-21 2006-11-27 삼성전기주식회사 엘이디 패키지 및 이를 이용한 백라이트유닛
JP2012178567A (ja) * 2006-04-06 2012-09-13 Hitachi Chem Co Ltd 光反射用熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板とその製造方法および光半導体装置
US7659531B2 (en) * 2007-04-13 2010-02-09 Fairchild Semiconductor Corporation Optical coupler package
US8421093B2 (en) 2007-07-13 2013-04-16 Rohm Co., Ltd. LED module and LED dot matrix display
KR100995688B1 (ko) 2008-04-28 2010-11-19 주식회사 센플러스 발광 다이오드 패키지
KR100875701B1 (ko) 2008-06-12 2008-12-23 알티전자 주식회사 발광 다이오드 패키지
KR101743918B1 (ko) * 2010-11-22 2017-06-07 삼성전자주식회사 발광소자 패키지의 수지 도포 장치 및 이를 이용한 발광소자 패키지 제조방법
KR101693642B1 (ko) * 2010-12-21 2017-01-17 삼성전자 주식회사 발광소자 패키지 제조방법
JP5941249B2 (ja) 2011-02-02 2016-06-29 日亜化学工業株式会社 発光装置
JP2013125776A (ja) * 2011-12-13 2013-06-24 Dainippon Printing Co Ltd リードフレーム、樹脂付リードフレームおよびその製造方法、ならびに半導体装置の製造方法
JP2017076809A (ja) * 2016-12-05 2017-04-20 大日本印刷株式会社 樹脂付リードフレーム、半導体装置、照明装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2981370B2 (ja) * 1993-07-16 1999-11-22 シャープ株式会社 Ｍｉｄチップ型発光素子
JP3065258B2 (ja) * 1996-09-30 2000-07-17 日亜化学工業株式会社 発光装置及びそれを用いた表示装置
JP3964590B2 (ja) * 1999-12-27 2007-08-22 東芝電子エンジニアリング株式会社 光半導体パッケージ
JP4045781B2 (ja) * 2001-08-28 2008-02-13 松下電工株式会社 発光装置
JP4241184B2 (ja) * 2002-07-25 2009-03-18 パナソニック電工株式会社 光電素子部品

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