CN101459212B - 固态发光器件 - Google Patents
固态发光器件 Download PDFInfo
- Publication number
- CN101459212B CN101459212B CN200710202988XA CN200710202988A CN101459212B CN 101459212 B CN101459212 B CN 101459212B CN 200710202988X A CN200710202988X A CN 200710202988XA CN 200710202988 A CN200710202988 A CN 200710202988A CN 101459212 B CN101459212 B CN 101459212B
- Authority
- CN
- China
- Prior art keywords
- electrode
- light
- fixing seat
- emitting diode
- packaging body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Abstract
Description
Claims (4)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710202988XA CN101459212B (zh) | 2007-12-11 | 2007-12-11 | 固态发光器件 |
US12/212,982 US7781792B2 (en) | 2007-12-11 | 2008-09-18 | Solid state illumination device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710202988XA CN101459212B (zh) | 2007-12-11 | 2007-12-11 | 固态发光器件 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101459212A CN101459212A (zh) | 2009-06-17 |
CN101459212B true CN101459212B (zh) | 2011-06-22 |
Family
ID=40720699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200710202988XA Expired - Fee Related CN101459212B (zh) | 2007-12-11 | 2007-12-11 | 固态发光器件 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7781792B2 (zh) |
CN (1) | CN101459212B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109755220A (zh) * | 2017-11-05 | 2019-05-14 | 新世纪光电股份有限公司 | 发光装置及其制作方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
HK1147024A2 (en) * | 2011-04-12 | 2011-07-22 | Seitech Electronics Ltd | Led lamp |
TWI598538B (zh) * | 2015-07-31 | 2017-09-11 | 宏齊科技股份有限公司 | 無需使用預儲電源的可攜式發光裝置及其發光二極體封裝結構 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2321116Y (zh) * | 1997-10-29 | 1999-05-26 | 周万顺 | 发光二极管支架结构 |
CN2649937Y (zh) * | 2003-10-10 | 2004-10-20 | 胡文松 | 一种可具有不同插头的双色灯泡组 |
CN2736939Y (zh) * | 2004-09-21 | 2005-10-26 | 东贝光电科技股份有限公司 | 发光二极管 |
CN2872595Y (zh) * | 2006-01-20 | 2007-02-21 | 宁波德洲精密电子有限公司 | 发光二极管支架 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4984057A (en) * | 1989-05-01 | 1991-01-08 | Adam Mii | Semiconductor element string structure |
JPH08130328A (ja) | 1994-11-01 | 1996-05-21 | Nippon Seiki Co Ltd | Led保持装置 |
JPH08204238A (ja) | 1995-01-31 | 1996-08-09 | Rohm Co Ltd | 発光装置 |
US6831306B1 (en) * | 2002-03-06 | 2004-12-14 | Daktronics, Inc. | Extended length light emitting diode |
US7326062B2 (en) * | 2005-02-07 | 2008-02-05 | Avago Technologies Ecbu Ip Pte Ltd | System and method for increasing the surface mounting stability of a lamp |
JP2006286699A (ja) * | 2005-03-31 | 2006-10-19 | Toyoda Gosei Co Ltd | Ledランプ装置及びその製造方法。 |
KR101134752B1 (ko) * | 2006-07-14 | 2012-04-13 | 엘지이노텍 주식회사 | Led 패키지 |
-
2007
- 2007-12-11 CN CN200710202988XA patent/CN101459212B/zh not_active Expired - Fee Related
-
2008
- 2008-09-18 US US12/212,982 patent/US7781792B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2321116Y (zh) * | 1997-10-29 | 1999-05-26 | 周万顺 | 发光二极管支架结构 |
CN2649937Y (zh) * | 2003-10-10 | 2004-10-20 | 胡文松 | 一种可具有不同插头的双色灯泡组 |
CN2736939Y (zh) * | 2004-09-21 | 2005-10-26 | 东贝光电科技股份有限公司 | 发光二极管 |
CN2872595Y (zh) * | 2006-01-20 | 2007-02-21 | 宁波德洲精密电子有限公司 | 发光二极管支架 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109755220A (zh) * | 2017-11-05 | 2019-05-14 | 新世纪光电股份有限公司 | 发光装置及其制作方法 |
CN109755220B (zh) * | 2017-11-05 | 2022-09-02 | 新世纪光电股份有限公司 | 发光装置及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
US7781792B2 (en) | 2010-08-24 |
CN101459212A (zh) | 2009-06-17 |
US20090146173A1 (en) | 2009-06-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102182939B (zh) | 照明装置 | |
KR102363258B1 (ko) | 만곡된 리드 프레임 상에 장착된 led들 | |
US20060262533A1 (en) | Modular light emitting diode | |
CN101459162B (zh) | 固态发光器件 | |
EP2477242B1 (en) | Light-emitting device package | |
US8246215B2 (en) | LED bulb | |
US20140001504A1 (en) | Light emitting diode package and method for manufacturing the same | |
KR101761637B1 (ko) | 발광 다이오드 패키지 및 그의 제조 방법 | |
CN101459212B (zh) | 固态发光器件 | |
US20130161671A1 (en) | Light emitting diode with sidewise light output structure and method for manufacturing the same | |
JP2006352064A (ja) | Ledランプ及びledランプ装置 | |
US8334175B1 (en) | Manufacturing method of LED package structure | |
KR20120051380A (ko) | 발광소자 패키지 제조방법 | |
CN103646879B (zh) | 一种可拆卸、可组装的sip封装结构的制作方法 | |
US20130062642A1 (en) | Led package device | |
CN102637813B (zh) | Led封装结构及使用该封装结构的led灯 | |
TWI380466B (en) | Solid illuminating element, solid illuminator, and method for manufacturing the solid illuminating element | |
US8597964B2 (en) | Manufacturing method of LED package structure | |
KR20120032908A (ko) | 발광소자 패키지 | |
US20130200403A1 (en) | Package structure for semiconductor light emitting device | |
CN203607396U (zh) | 一种可拆卸、可组装的SiP封装结构 | |
KR101274043B1 (ko) | 발광 다이오드 | |
CN203607395U (zh) | 一种可拆卸、可组装的SiP封装结构的连接器初始件 | |
CN216719977U (zh) | 一种大功率led仿流明封装支架及led灯珠 | |
US9395054B2 (en) | Light source and lighting device including the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201600 Shanghai City, Songjiang District Songjiang Industrial Zone West science and Technology Industrial Park No. 500 Wen Ji Lu Patentee after: Foxsemicon Semiconductor Precision (Shanghai) Inc. Patentee after: Foxsemicon Integrated Technology Inc. Address before: 201600 Shanghai City, Songjiang District Songjiang Industrial Zone West science and Technology Industrial Park No. 500 Wen Ji Lu Patentee before: Foxsemicon Semiconductor Precision (Shanghai) Inc. Patentee before: Foxsemicon Integrated Technology Inc. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110622 Termination date: 20131211 |