CN101459212A - 固态发光元件,固态发光器件及固态发光元件的制造方法 - Google Patents
固态发光元件,固态发光器件及固态发光元件的制造方法 Download PDFInfo
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- CN101459212A CN101459212A CNA200710202988XA CN200710202988A CN101459212A CN 101459212 A CN101459212 A CN 101459212A CN A200710202988X A CNA200710202988X A CN A200710202988XA CN 200710202988 A CN200710202988 A CN 200710202988A CN 101459212 A CN101459212 A CN 101459212A
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- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000007787 solid Substances 0.000 title 3
- 238000004806 packaging method and process Methods 0.000 claims description 31
- 238000004020 luminiscence type Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 17
- 230000002349 favourable effect Effects 0.000 abstract 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 235000019994 cava Nutrition 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000013536 elastomeric material Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
Claims (11)
- 【权利要求1】一种固态发光元件,包括封装体、发光芯片、以及第一及第二电极,所述发光芯片封装于封装体内,所述第一及第二电极分别具有封装于封装体内且与发光芯片电性连接的第一端部以及暴露于封装体外的第二端部,其特征在于:所述第一及第二电极其中之一的第二端部设有凸块,使所述第一及第二电极具有不同的外形。
- 【权利要求2】如权利要求1所述的固态发光元件,其特征在于,所述凸块的横截面形状选自矩形、圆形、半圆形、三角形、星形和正多边形。
- 【权利要求3】如权利要求1所述的固态发光元件,其特征在于,所述凸块由第一电极朝向或背离第二电极延伸。
- 【权利要求4】一种固态发光器件,其包括一个固态发光元件及一个固持座,所述固态发光元件包括封装体、发光芯片、以及第一及第二电极,所述发光芯片封装于封装体内,所述第一及第二电极具有封装于封装体内且与发光芯片电性连接的第一端部、以及暴露于封装体外且插设于固持座内的第二端部,所述固持座包括本体、位于本体内且分别与所述第一及第二电极相对应的第一及第二容置孔、以及与所述第一及第二电极电性连接的供电电极,其特征在于:所述第一及第二电极其中之一的第二端部设有可区分所述第一及第二电极的凸块,所述固持座的本体上设有与所述凸块相对应凹槽。
- 【权利要求5】如权利要求4所述的固态发光器件,其特征在于,所述凸块的横截面形状选自矩形、圆形、半圆形、三角形、星形和正多边形。
- 【权利要求6】如权利要求4所述的固态发光器件,其特征在于,所述凸块由第一电极朝向或背离第二电极延伸。
- 【权利要求7】如权利要求4至6中任一项所述的固态发光器件,其特征在于,所述固持座的本体上设有一个扣环,所述扣环的内部设有至少一分布于一圆周上的凸部,所述凸部所在的圆周的直径小于发光二级管上与所述凸部相对应的卡合部分的外径。
- 【权利要求8】如权利要求4所述的固态发光器件,其特征在于,所述供电电极包括具弹性夹持力的第一夹持件、第二夹持件及与第一及第二夹持件电性连接的电源线,所述第一夹持件及第二夹持件的至少一部分分别位于所述第一容置孔及第二容置孔内,所述固态发光元件的第一及第二电极的第二端部插设在对应的第一及第二容置孔内且与对应的第一及第二夹持件形成电性连接。
- 【权利要求9】一种固态发光元件的制造方法,包括:提供若干个导线架,每一个导线架包括第一及第二电极,所述各导线架的第一及第二电极借由一根连接杆连接成一个整体,所述连接杆包括位于单个导线架的第一及第二电极之间的第一杆部、以及位于相邻导线架的第一及第二电极之间的第二杆部;将发光芯片固定至所述导线架上;打线,使所述发光芯片分别与对应导线架的第一及第二电极电性连接;将所述发光芯片、以及第一及第二电极的与发光芯片相连的端部封装至封装体内;部分切除所述连接杆,保留第一杆部或第二杆部中与第一或第二电极相连的一部分连接杆,在所述第一及第二电极其中之一上形成凸块,使第一及第二电极具有不同的外形,得到所述固态发光元件。
- 【权利要求10】如权利要求9所述的固态发光元件的制造方法,其特征在于,所述部分切除连接杆的过程包括部分切除第一杆部的与第一或第二电极相连的一部分连接杆和完全切除第二杆部。
- 【权利要求11】如权利要求9所述的固态发光元件的制造方法,其特征在于,所述部分切除连接杆的过程包括部分切除第二杆部的与第一或第二电极相连的一部分连接杆和完全切除第一杆部。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710202988XA CN101459212B (zh) | 2007-12-11 | 2007-12-11 | 固态发光器件 |
US12/212,982 US7781792B2 (en) | 2007-12-11 | 2008-09-18 | Solid state illumination device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN200710202988XA CN101459212B (zh) | 2007-12-11 | 2007-12-11 | 固态发光器件 |
Publications (2)
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CN101459212A true CN101459212A (zh) | 2009-06-17 |
CN101459212B CN101459212B (zh) | 2011-06-22 |
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Application Number | Title | Priority Date | Filing Date |
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CN200710202988XA Expired - Fee Related CN101459212B (zh) | 2007-12-11 | 2007-12-11 | 固态发光器件 |
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US (1) | US7781792B2 (zh) |
CN (1) | CN101459212B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102734658A (zh) * | 2011-04-12 | 2012-10-17 | 犀德电子有限公司 | 一种led发光体和采用该led发光体的led灯 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI598538B (zh) * | 2015-07-31 | 2017-09-11 | 宏齊科技股份有限公司 | 無需使用預儲電源的可攜式發光裝置及其發光二極體封裝結構 |
TWI778167B (zh) * | 2017-11-05 | 2022-09-21 | 新世紀光電股份有限公司 | 發光裝置及其製作方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
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US4984057A (en) * | 1989-05-01 | 1991-01-08 | Adam Mii | Semiconductor element string structure |
JPH08130328A (ja) | 1994-11-01 | 1996-05-21 | Nippon Seiki Co Ltd | Led保持装置 |
JPH08204238A (ja) | 1995-01-31 | 1996-08-09 | Rohm Co Ltd | 発光装置 |
CN2321116Y (zh) * | 1997-10-29 | 1999-05-26 | 周万顺 | 发光二极管支架结构 |
US6831306B1 (en) * | 2002-03-06 | 2004-12-14 | Daktronics, Inc. | Extended length light emitting diode |
CN2649937Y (zh) * | 2003-10-10 | 2004-10-20 | 胡文松 | 一种可具有不同插头的双色灯泡组 |
CN2736939Y (zh) * | 2004-09-21 | 2005-10-26 | 东贝光电科技股份有限公司 | 发光二极管 |
US7326062B2 (en) * | 2005-02-07 | 2008-02-05 | Avago Technologies Ecbu Ip Pte Ltd | System and method for increasing the surface mounting stability of a lamp |
JP2006286699A (ja) * | 2005-03-31 | 2006-10-19 | Toyoda Gosei Co Ltd | Ledランプ装置及びその製造方法。 |
CN2872595Y (zh) * | 2006-01-20 | 2007-02-21 | 宁波德洲精密电子有限公司 | 发光二极管支架 |
KR101134752B1 (ko) * | 2006-07-14 | 2012-04-13 | 엘지이노텍 주식회사 | Led 패키지 |
-
2007
- 2007-12-11 CN CN200710202988XA patent/CN101459212B/zh not_active Expired - Fee Related
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2008
- 2008-09-18 US US12/212,982 patent/US7781792B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102734658A (zh) * | 2011-04-12 | 2012-10-17 | 犀德电子有限公司 | 一种led发光体和采用该led发光体的led灯 |
WO2012139480A1 (zh) * | 2011-04-12 | 2012-10-18 | 犀德电子有限公司 | 发光二极体灯 |
Also Published As
Publication number | Publication date |
---|---|
US7781792B2 (en) | 2010-08-24 |
US20090146173A1 (en) | 2009-06-11 |
CN101459212B (zh) | 2011-06-22 |
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Address after: 201600 Shanghai City, Songjiang District Songjiang Industrial Zone West science and Technology Industrial Park No. 500 Wen Ji Lu Patentee after: Foxsemicon Semiconductor Precision (Shanghai) Inc. Patentee after: Foxsemicon Integrated Technology Inc. Address before: 201600 Shanghai City, Songjiang District Songjiang Industrial Zone West science and Technology Industrial Park No. 500 Wen Ji Lu Patentee before: Foxsemicon Semiconductor Precision (Shanghai) Inc. Patentee before: Foxsemicon Integrated Technology Inc. |
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Granted publication date: 20110622 Termination date: 20131211 |