CN101459162A - 固态发光器件 - Google Patents

固态发光器件 Download PDF

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CN101459162A
CN101459162A CNA2007102029894A CN200710202989A CN101459162A CN 101459162 A CN101459162 A CN 101459162A CN A2007102029894 A CNA2007102029894 A CN A2007102029894A CN 200710202989 A CN200710202989 A CN 200710202989A CN 101459162 A CN101459162 A CN 101459162A
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state light
emitting element
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CN101459162B (zh
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江文章
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Foxsemicon Integrated Technology Shanghai Inc
Foxsemicon Integrated Technology Inc
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Foxsemicon Integrated Technology Inc
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015Fastening arrangements intended to retain light sources
    • F21V19/002Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00Lighting devices or systems using a string or strip of light sources
    • F21S4/10Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/168Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being resilient rings acting substantially isotropically, e.g. split rings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12044OLED

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

一种固态发光器件,其包括一固态发光元件及一个固持座,所述固态发光元件包括一个封装体、至少一个发光芯片、以及多个电极,所述至少一个发光芯片及多个电极的第一端部被封装至封装体内,且所述至少一个发光芯片与所述电极电性连接,所述固持座包括本体、容置孔、以及供电电极,所述固态发光元件的电极的第二端部暴露于所述封装体外部并插设于所述容置孔内,且与所述供电电极电性连接,所述固持座的本体上设有弹性扣环,所述弹性扣环环设于所述固态发光元件上并施加一径向压力于所述封装体上,将所述固态发光元件固设于所述固持座内,以防止固态发光元件由固持座中脱落。

Description

固态发光器件
技术领域
本发明涉及光学领域,尤其涉及一种固态发光器件。
背景技术
目前,发光二极管(Light Emitting Diode,LED)作为一种固态发光元件,因其具高亮度、长使用寿命、广色域(Wide Color Gamut)等特性而被广泛应用于多种领域之中,例如,将发光二极管用于各种显示装置内,或将发光二极管用于灯具内构成发光二极管组件。
普通的发光二极管组件一般包括一个发光二极管及一用于插设该发光二极管的固持座。所述发光二极管与固持座的组装一般是将发光二极管的电极插设于固持座上设置的容置孔内,借助发光二极管的电极与容置孔的侧壁之间的摩擦力将发光二极管固定于固持座内。
对于上述的发光二极管组件,由于发光二极管的电极与空置孔的侧壁之间的摩擦力较小,使得所述发光二极管与固持座之间的固定不甚牢固,因此,发光二极管与固持座之间的固定方式尚有改进的必要。
发明内容
有鉴于此,有必要提供一种安装牢固的固态发光器件。
一种固态发光器件,其包括一固态发光元件及一个固持座,所述固态发光元件包括一个封装体、至少一个发光芯片、以及多个电极,所述至少一个发光芯片及多个电极的第一端部被封装至封装体内,与所述电极电性连接,所述固持座包括本体、容置孔、以及供电电极,所述固态发光元件的电极的第二端部暴露于所述封装体外部并插设于所述容置孔内,且与所述供电电极电性连接,所述固持座的本体上设有弹性扣环,所述弹性扣环环设于所述固态发光元件上并施加一径向压力于所述封装体上,将所述固态发光元件固设于所述固持座内。
所述固态发光器件中,由于弹性扣环的设置,使得该固态发光元件在弹性扣环的径向压力的作用下被固持于固持座上,不易由固持座中脱落,从而使得该固态发光元件可简便、牢固地装设于固持座上。
附图说明
图1是本发明一较佳实施例的发光二极管组件的分解示意图。
图2是图1所示的发光二极管组件的组装示意图。
图3是本发明另一较佳实施例的发光二极管组件的组装示意图。
具体实施方式
下面将结合附图对本发明实施例作进一步的详细说明。
本发明提供一种固态发光器件,如发光二极管组件、有机发光二极管组件等,该固态发光器件具有至少一固态发光元件,如半导体发光二极管(light emitting diode,LED)、有机发光二极管(organic light emitting diode,OLED)等,该固态发光元件具有至少一个发光芯片。
下面以发光二极管组件为例对该固态发光器件进行说明。
参见图1及图2,本发明实施例提供的发光二极管组件10,其包括:一个发光二极管12及一个固持座16。
所述发光二极管12包括一个封装体124、一个电路载板125、两个发光二极管芯片126、127、一个第一电极128及一个第二电极129。
封装体124可由透明塑料,如环氧树脂、硅树脂等制成。所述封装体124包括一个基座124a、以及位于基座124a的上部的封装材料124b。所述基座124a的上部具有沿径向凸伸出所述封装材料124b下部的环状的凸缘124c。
所述电路载板125与发光二极管芯片126、127均埋设于所述封装材料124b内,且所述电路载板125夹设于所述第一电极128与发光二极管芯片126、127之间。所述电路载板125上设置有电气连线(图未示),其可为玻璃纤维板、柔性电路板或陶瓷板。所述发光二极管芯片126、127在电激励下可发出可见光,该发光二极管芯片126、127反向并联且经由与电路载板125上的电气连线相连而与电路载板125形成电性连接。可以理解地,该发光二极管12内可以设置多个发光二极管芯片,以使发光二极管芯片发出不同颜色的光,满足不同的发光需求。
所述第一电极128及第二电极129由铜、铁或金属合金等导电材料制成。所述第一电极128大致呈L形,其具有第一端部128a及第二端部128b。所述电路载板125设于所述第一电极128的第一端部128a上,并与所述第一电极128形成电性连接。所述第二电极129大体上呈直线形,其具有第一端部129a及第二端部129b,所述第二电极129的第一端部129a与发光二极管芯片126、127形成电连接。所述第一及第二电极128、129的第一端部128a、129a被封装至封装体124的封装材料124b内,其第二端部128b、129b暴露于封装体124的基座124a外,并插设至所述固持座16内。
所述固持座16包括本体162、扣环163、容置孔164及供电电极166。
所述扣环163为一环设于本体162上部的软管扣环,由塑料,橡胶等具弹性的材料制成,所述扣环163与本体162一体成型,由本体162的上端向上延伸形成。如图3所示,所述扣环163也可为装设于本体162上部的一个独立的元件。该扣环163的外表面的上部向内凹陷,从而在扣环163的内表面的上部形成一圆环状的凸部163a,并在扣环163的内表面的下部形成一环状的凹槽163b。该环状的凸部163a的直径小于环状的凹槽163b的直径。可以理解地,所述凸部163a不限于设置在扣环163的上部,其也可设置在扣环163的中部或下部。
所述容置孔164设置在本体162上,图1中示出两个容置孔164,其分别对应发光二极管12的第一电极128及第二电极129,用以容置所述第一及第二电极128、129的第二端部128b、129b。
所述供电电极166包括两个夹持件166a及166b,以及与该两个夹持件166a及166b分别电性连接的电源线166c及166d;该供电电极166经由其部分暴露于本体162之外的电源线166c及166d与外部电源相连以向发光二极管12供电。该两夹持件166a及166b均可产生一弹性夹持力,用以固持并电性连接插设于所述容置孔164内的发光二极管12的第一及第二电极128、129。该供电电极166一体成型于本体162内,所述供电电极166的夹持件166a及166b的一部分延伸至容置孔164内,而其它部分则埋设于本体162内。可以理解的是,该两夹持件166a及166b也可全部嵌设于容置孔164内,其同样可实现固持并电性连接插设于容置孔164内的发光二极管12的第一及第二电极128、129的目的。
将该发光二极管12安装至该固持座16的过程中,首先,将该发光二极管12置于所述固持座16的扣环163上,同时使该发光二极管12的第一及第二电极128、129的一部分分别收容于所述固持座16的容置孔164内;其次,向下按压所述发光二极管12,使该发光二极管12沿固持座16的扣环163向下滑动,当该发光二极管12的凸缘124c到达扣环163的凸部163a处时,挤压该凸部163a发生弹性变形而向外扩张,当该凸缘124c滑过扣环163的凸部163a时,该凸部163a恢复弹性变形而向内收缩,将发光二极管12的凸缘124c卡设于扣环163的凹槽163b内,并紧密环设于发光二极管12的封装体124的基座124a的外围,此时,发光二极管12的第一及第二电极128、129的第二端部128b、129b则刚好在供电电极166的夹持件166a及166b的作用下被固持于固持座16的容置孔164内,而该发光二极管12的发光二极管芯片126、127则位于固持座16的扣环163的最上端的上部,以防止固持座16的扣环163遮挡发光二极管芯片126、127所发出的光。
该发光二极管组件10中,该固持座16的扣环163施加一径向压紧力于所述发光二极管12的封装体124上,将所述发光二极管12固持于固持座16上,不易由固持座16中脱落,从而使得该发光二极管12可简便、牢固地装设于固持座16上。而且,该扣环163与发光二极管12与扣环163相对应的部分即封装体124的基座124a的外围紧密贴合,可防止外部的水汽进入该固持座16,与第一及第二电极128、129接触而损坏第一及第二电极128、129。
进一步地,该供电电极166的具弹性夹持力的两夹持件166a及166b的设置,使得该发光二极管12可更为牢固地固持于固持座16内,进一步地防止发光二极管12由固持座16上脱落。
本实施例中,第一及第二电极128、129的下端具有光滑的外表面。可以理解地,该发光二极管12的第一、第二电极128、129的下端的外表面不限于本实施例所述的光滑的表面,其也可为波浪状(如图3所示)或锯齿状等粗糙表面,以进一步增强发光二极管12的第一、第二电极128、129与夹持件166a及166b之间的固定,更进一步的防止发光二极管12由固持座16上脱落。另外,该发光二极管12的第一、第二电极128、129的下端也不限于本实施例所述的直线形,在不计较成本的情况下,其也可折弯其它形状,如在第一、第二电极128、129的下端反向弯折出分别与第一电极128的第二端部128b及第二电极129紧贴的反折部等,只需满足发光二极管12的第一、第二电极128、129可直接插入或拔出固持座16的容置孔164,并与供电电极166电性连接即可。
如图3所示,所述封装体124的基座124a可以去掉,使得封装材料124b填充至原来基座124a所在的位置,将发光二极管芯片126、127、电路载板125、以及第一及第二电极128、129的第一端部128a、129a封装至封装材料124b内。另外,基座124a上的凸缘124c可以去掉,使得发光二极管12与固持座16的扣环163之间的固持仅借由扣环163的弹性变形即可实现。本实施例中是借由环形的凸部163a的弹性变形来实现将发光二极管12固持于固持座16的上部的目的,可以理解地,也可以借由在扣环163的内表面凸设若干凸点,并使该若干凸点所在的圆的直径小于发光二极管12上与凸点相对应的部分的外径,从而实现将发光二极管12固持于固持座16的上部的目的。
另外,本领域技术人员还可于本发明精神内做其它变化,如固持座16的结构,扣环163的结构,发光二极管组件10的电性连接方式等以用于本发明等设计,只要其不偏离本发明的技术效果均可。这些依据本发明精神所做的变化,都应包含在本发明所要求保护的范围之内。

Claims (10)

  1. 【权利要求1】一种固态发光器件,其包括一固态发光元件及一个固持座,所述固态发光元件包括一个封装体、至少一个发光芯片、以及多个电极,所述至少一个发光芯片及多个电极的第一端部被封装至封装体内,且所述至少一个发光芯片与所述电极电性连接,所述固持座包括本体、容置孔、以及供电电极,所述固态发光元件的电极的第二端部暴露于所述封装体外部并插设于所述容置孔内,且与所述供电电极电性连接,其特征在于:所述固持座的本体上设有弹性扣环,所述弹性扣环环设于所述固态发光元件上并施加一径向压力于所述封装体上,将所述固态发光元件固设于所述固持座内。
  2. 【权利要求2】如权利要求1所述的固态发光器件,其特征在于,所述扣环向内凸伸形成有环状的凸部,所述凸部所在的圆的直径小于固态发光元件上与其相对应的部分的外径。
  3. 【权利要求3】如权利要求1所述的固态发光器件,其特征在于,所述扣环向内凸伸形成有若干凸点,所述凸点所在的圆的直径小于固态发光元件上与其相对应的部分的外径。
  4. 【权利要求4】如权利要求1所述的固态发光器件,其特征在于,所述扣环在凸部的下方形成一凹槽,所述固态发光元件的下部设有一可收容于所述凹槽内的凸缘。
  5. 【权利要求5】如权利要求1所述的固态发光器件,其特征在于,所述供电电极包括弹性的夹持件、以及与所述夹持件电性连接的电源线,所述夹持件的至少一部分位于所述的容置孔内,所述固态发光元件的电极插设于所述的夹持件内与所述的夹持件间形成电性连接。
  6. 【权利要求6】如权利要求5所述的固态发光器件,其特征在于,所述夹持件全部嵌设在所述容置孔内。
  7. 【权利要求7】如权利要求1所述的固态发光器件,其特征在于,所述固态发光元件的电极的第二端部呈直线形。
  8. 【权利要求8】如权利要求7所述的固态发光器件,其特征在于,所述固态发光元件的电极的第二端部具有光滑的外表面,或具有波浪形或锯齿形的外表面。
  9. 【权利要求9】如权利要求1所述的固态发光器件,其特征在于,所述扣环与所述固态发光元件上与扣环相对应的部分的外围紧密贴合。
  10. 【权利要求10】如权利要求1所述的固态发光器件,其特征在于,所述固态发光元件为一个发光二极管。
CN2007102029894A 2007-12-11 2007-12-11 固态发光器件 Expired - Fee Related CN101459162B (zh)

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CN102686940A (zh) * 2010-01-05 2012-09-19 皇家飞利浦电子股份有限公司 具有固定的电路板连接装置的电路板支撑结构
CN103378252A (zh) * 2012-04-16 2013-10-30 展晶科技(深圳)有限公司 发光二极管模组
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CN102686940A (zh) * 2010-01-05 2012-09-19 皇家飞利浦电子股份有限公司 具有固定的电路板连接装置的电路板支撑结构
CN102686940B (zh) * 2010-01-05 2016-12-21 皇家飞利浦电子股份有限公司 具有固定的电路板连接装置的电路板支撑结构
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