CN101459162A - 固态发光器件 - Google Patents
固态发光器件 Download PDFInfo
- Publication number
- CN101459162A CN101459162A CNA2007102029894A CN200710202989A CN101459162A CN 101459162 A CN101459162 A CN 101459162A CN A2007102029894 A CNA2007102029894 A CN A2007102029894A CN 200710202989 A CN200710202989 A CN 200710202989A CN 101459162 A CN101459162 A CN 101459162A
- Authority
- CN
- China
- Prior art keywords
- state light
- emitting element
- light emitting
- solid
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/10—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
- F21V17/168—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being resilient rings acting substantially isotropically, e.g. split rings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims (10)
- 【权利要求1】一种固态发光器件,其包括一固态发光元件及一个固持座,所述固态发光元件包括一个封装体、至少一个发光芯片、以及多个电极,所述至少一个发光芯片及多个电极的第一端部被封装至封装体内,且所述至少一个发光芯片与所述电极电性连接,所述固持座包括本体、容置孔、以及供电电极,所述固态发光元件的电极的第二端部暴露于所述封装体外部并插设于所述容置孔内,且与所述供电电极电性连接,其特征在于:所述固持座的本体上设有弹性扣环,所述弹性扣环环设于所述固态发光元件上并施加一径向压力于所述封装体上,将所述固态发光元件固设于所述固持座内。
- 【权利要求2】如权利要求1所述的固态发光器件,其特征在于,所述扣环向内凸伸形成有环状的凸部,所述凸部所在的圆的直径小于固态发光元件上与其相对应的部分的外径。
- 【权利要求3】如权利要求1所述的固态发光器件,其特征在于,所述扣环向内凸伸形成有若干凸点,所述凸点所在的圆的直径小于固态发光元件上与其相对应的部分的外径。
- 【权利要求4】如权利要求1所述的固态发光器件,其特征在于,所述扣环在凸部的下方形成一凹槽,所述固态发光元件的下部设有一可收容于所述凹槽内的凸缘。
- 【权利要求5】如权利要求1所述的固态发光器件,其特征在于,所述供电电极包括弹性的夹持件、以及与所述夹持件电性连接的电源线,所述夹持件的至少一部分位于所述的容置孔内,所述固态发光元件的电极插设于所述的夹持件内与所述的夹持件间形成电性连接。
- 【权利要求6】如权利要求5所述的固态发光器件,其特征在于,所述夹持件全部嵌设在所述容置孔内。
- 【权利要求7】如权利要求1所述的固态发光器件,其特征在于,所述固态发光元件的电极的第二端部呈直线形。
- 【权利要求8】如权利要求7所述的固态发光器件,其特征在于,所述固态发光元件的电极的第二端部具有光滑的外表面,或具有波浪形或锯齿形的外表面。
- 【权利要求9】如权利要求1所述的固态发光器件,其特征在于,所述扣环与所述固态发光元件上与扣环相对应的部分的外围紧密贴合。
- 【权利要求10】如权利要求1所述的固态发光器件,其特征在于,所述固态发光元件为一个发光二极管。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007102029894A CN101459162B (zh) | 2007-12-11 | 2007-12-11 | 固态发光器件 |
US12/019,925 US20090146561A1 (en) | 2007-12-11 | 2008-01-25 | Solid state illumination device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007102029894A CN101459162B (zh) | 2007-12-11 | 2007-12-11 | 固态发光器件 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101459162A true CN101459162A (zh) | 2009-06-17 |
CN101459162B CN101459162B (zh) | 2010-12-08 |
Family
ID=40720903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007102029894A Expired - Fee Related CN101459162B (zh) | 2007-12-11 | 2007-12-11 | 固态发光器件 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20090146561A1 (zh) |
CN (1) | CN101459162B (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101582488B (zh) * | 2009-06-25 | 2011-02-16 | 彩虹集团公司 | 一种有机电致发光器件的封装盖板 |
CN102686940A (zh) * | 2010-01-05 | 2012-09-19 | 皇家飞利浦电子股份有限公司 | 具有固定的电路板连接装置的电路板支撑结构 |
CN103378252A (zh) * | 2012-04-16 | 2013-10-30 | 展晶科技(深圳)有限公司 | 发光二极管模组 |
CN103515517A (zh) * | 2012-06-20 | 2014-01-15 | 展晶科技(深圳)有限公司 | 发光二极管模组 |
TWI685627B (zh) * | 2019-07-05 | 2020-02-21 | 合信材料有限公司 | Led發光結構及led發光元件之料帶、led發光元件及led燈泡 |
CN113299815A (zh) * | 2021-05-25 | 2021-08-24 | 深圳市奥蕾达科技有限公司 | 一种led灯珠 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009054519A1 (de) * | 2009-12-10 | 2011-06-16 | Osram Gesellschaft mit beschränkter Haftung | Led-Lampe |
DE102010003073B4 (de) * | 2010-03-19 | 2013-12-19 | Osram Gmbh | LED-Beleuchtungsvorrichtung |
EP2466198B1 (en) * | 2010-12-17 | 2015-08-26 | Vossloh-Schwabe Italia SPA | Heat sinking light source holder |
WO2012159744A2 (de) * | 2011-05-24 | 2012-11-29 | Naseri Morteza Mobalegh | Leuchte insbesondere strassenleuchte mit leds |
DE102011107642A1 (de) * | 2011-07-12 | 2013-01-17 | Bjb Gmbh & Co. Kg | Leuchtmittel mit wenigstens einer organischen, Licht emittierenden Diode |
JP6569895B2 (ja) * | 2015-06-11 | 2019-09-04 | パナソニックIpマネジメント株式会社 | 照明装置及びコネクタ |
JP6569894B2 (ja) * | 2015-06-11 | 2019-09-04 | パナソニックIpマネジメント株式会社 | 照明装置及びコネクタ |
US10690316B1 (en) * | 2017-05-06 | 2020-06-23 | Designs For Vision, Inc. | LED lighting element and method of manufacturing same |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3718750A (en) * | 1971-10-12 | 1973-02-27 | Gen Motors Corp | Electrical connector |
US3887803A (en) * | 1974-05-28 | 1975-06-03 | Savage John Jun | Light emitting diode device |
US5709554A (en) * | 1996-02-12 | 1998-01-20 | Savage, Jr.; John M. | Angled circuit connector structure |
CN1123061C (zh) * | 1998-07-27 | 2003-10-01 | 明华国际有限公司 | 一体成形之圣诞灯串用灯头和灯座 |
JP2004153089A (ja) * | 2002-10-31 | 2004-05-27 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体発光素子及びその製造方法 |
US7520771B2 (en) * | 2005-07-13 | 2009-04-21 | Lumination Llc | LED string light engine and devices that are illuminated by the string light engine |
-
2007
- 2007-12-11 CN CN2007102029894A patent/CN101459162B/zh not_active Expired - Fee Related
-
2008
- 2008-01-25 US US12/019,925 patent/US20090146561A1/en not_active Abandoned
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101582488B (zh) * | 2009-06-25 | 2011-02-16 | 彩虹集团公司 | 一种有机电致发光器件的封装盖板 |
CN102686940A (zh) * | 2010-01-05 | 2012-09-19 | 皇家飞利浦电子股份有限公司 | 具有固定的电路板连接装置的电路板支撑结构 |
CN102686940B (zh) * | 2010-01-05 | 2016-12-21 | 皇家飞利浦电子股份有限公司 | 具有固定的电路板连接装置的电路板支撑结构 |
CN103378252A (zh) * | 2012-04-16 | 2013-10-30 | 展晶科技(深圳)有限公司 | 发光二极管模组 |
CN103378252B (zh) * | 2012-04-16 | 2016-01-06 | 展晶科技(深圳)有限公司 | 发光二极管模组 |
CN103515517A (zh) * | 2012-06-20 | 2014-01-15 | 展晶科技(深圳)有限公司 | 发光二极管模组 |
CN103515517B (zh) * | 2012-06-20 | 2016-03-23 | 展晶科技(深圳)有限公司 | 发光二极管模组 |
TWI685627B (zh) * | 2019-07-05 | 2020-02-21 | 合信材料有限公司 | Led發光結構及led發光元件之料帶、led發光元件及led燈泡 |
CN113299815A (zh) * | 2021-05-25 | 2021-08-24 | 深圳市奥蕾达科技有限公司 | 一种led灯珠 |
Also Published As
Publication number | Publication date |
---|---|
US20090146561A1 (en) | 2009-06-11 |
CN101459162B (zh) | 2010-12-08 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201600 Shanghai City, Songjiang District Songjiang Industrial Zone West science and Technology Industrial Park No. 500 Wen Ji Lu Patentee after: Foxsemicon Semiconductor Precision (Shanghai) Inc. Patentee after: Foxsemicon Integrated Technology Inc. Address before: 201600 Shanghai City, Songjiang District Songjiang Industrial Zone West science and Technology Industrial Park No. 500 Wen Ji Lu Patentee before: Foxsemicon Semiconductor Precision (Shanghai) Inc. Patentee before: Foxsemicon Integrated Technology Inc. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101208 Termination date: 20131211 |