WO2015099240A1 - Self-powered multi-chip cob led package - Google Patents

Self-powered multi-chip cob led package Download PDF

Info

Publication number
WO2015099240A1
WO2015099240A1 PCT/KR2014/001468 KR2014001468W WO2015099240A1 WO 2015099240 A1 WO2015099240 A1 WO 2015099240A1 KR 2014001468 W KR2014001468 W KR 2014001468W WO 2015099240 A1 WO2015099240 A1 WO 2015099240A1
Authority
WO
WIPO (PCT)
Prior art keywords
self
led
powered
package
chip
Prior art date
Application number
PCT/KR2014/001468
Other languages
French (fr)
Inventor
Young Hwan LHO
Original Assignee
Woosung University Corporation Of Industrical Educational Programs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Woosung University Corporation Of Industrical Educational Programs filed Critical Woosung University Corporation Of Industrical Educational Programs
Publication of WO2015099240A1 publication Critical patent/WO2015099240A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/18—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing electrical output from mechanical input, e.g. generators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to a self-powered multi-chip chip-on-board (COB) light emitting diode (LED) package. More specifically, the present invention relates to a self-powered multi-chip COB LED package which is made small and has improved endurance by forming an LED, an LED driving device for driving the LED, and a self-powered device which is self-powered by an external motion to supply power to the LED driving device, in a single package using COB technology.
  • COB chip-on-board
  • LED light emitting diode
  • LED the abbreviation of “light emitting diode,” is a semiconductor device which converts electric energy to a light signal when a voltage is applied. LEDs are commonly used in our daily life, for example, an indicator lamp or a numeric display of a general electric apparatus. At first, there were low brightness and limitations of color, however, high brightness LED products which provide all colors comprising white light and visible light are now being manufactured due to new LED ingredients and advanced production technology.
  • a merit and feature of LEDs is that energy waste due to heat losses is low since LEDs generate less heat than existing light bulbs.
  • LEDs can be made smaller and lighter, and have excellent endurance and a semi-permanent life span, LEDs are expected to be used in a broader range of applications and replace existing light sources used in our daily life.
  • Korean Patent Publication No. 2003-0000393 Jan. 6, 2003 titled "SELF GENERATING TYPE LIGHT EMITTING JUMP ROPE” discloses technology for solving the above-described problem.
  • the document discloses a self-generating type light emitting jump rope including a self-generating system which supplies electricity to an LED embedded in a jump rope by generating electricity by rotation of a handle of the jump rope.
  • the LED and the self-generating system have a limited range of applications because those are limited to a jump rope.
  • the LED and the self-generating system are separately configured, it is difficult to ensure endurance.
  • the present invention is directed to provide a self-powered multi-chip COB LED package which can be made smaller and lighter, and have an improved application range because an LED, an LED driving device, a self-powered power supply which is self-powered by an external motion (a kinetic energy) are formed in a single package using COB technology.
  • a self-powered multi-chip chip-on-board (COB) light emitting diode (LED) package includes a substrate 10, one or more light emitting diodes (LEDs) 20 disposed on the substrate 10, an LED driving device 30 disposed on the substrate 10 and including an LED driving circuit for driving the LEDs 20, and a self-powered device 40 disposed on the substrate 10 and configured to be self-powered by an external motion and supply power to the LED driving device 30.
  • COB multi-chip chip-on-board
  • LED light emitting diode
  • the LED driving device 30 may further include a boosting circuit configured to boost a voltage supplied from the self-powered device 40, and supply the boosted voltage to the LED 20.
  • the self-powered multi-chip COB LED package may be molded by an epoxy resin 50 in a single package, and an empty space 41 may be formed around the self-powered device 40 during the epoxy molding process using.
  • the LED driving device 30 and the self-powered device 40 may be formed as a single device.
  • each of the LED 20, the LED driving device 30, and the self-powered device 40 may be connected by wire-bonding.
  • An electrode pattern 80 configured to electrically connect the LED 20, the LED driving device 30, and the self-powered device 40 may be formed on the substrate 10. The electrode pattern 80 may connect the LED 20, the LED driving device 30, and the self-powered device 40 to the substrate 10 by wire-bonding.
  • an integrated package is formed using a chip-on-board (COB) method in which the three devices are connected on the substrate 10 by wire-bonding, and then molded. Accordingly, the package in accordance with the embodiments of the present invention can be downsized and lightened, and can have improved reliability. Further, the package in accordance with the embodiments of the present invention has enhanced endurance by preventing deformation, such as disconnection or short between connection contacts of the devices caused by an external impact.
  • COB chip-on-board
  • the package in accordance with the embodiments of the present invention uses a self-powered device as a power supply without being connected to an external power supply in order to drive an LED, the LED emits light when the package in accordance with the embodiments of the present invention is attached to wherever a motion exists. Accordingly, the package in accordance with the embodiments of the present invention has wide field of application.
  • FIG. 1 is a self-generating type light emitting jump rope in the related art.
  • FIG. 2 is a block diagram showing a self-powered multi-chip COB LED package in accordance with an embodiment of the present invention.
  • FIG. 3 is a schematic diagram showing a self-powered multi-chip COB LED package in accordance with a first embodiment of the present invention.
  • FIG. 4 is a schematic diagram showing a self-powered multi-chip COB LED package in accordance with a second embodiment of the present invention.
  • FIG. 5 is a partially cross-sectional view of a self-powered multi-chip COB LED package in accordance with the second embodiment of the present invention.
  • FIG. 2 is a block diagram showing a self-powered multi-chip COB LED package in accordance with an embodiment of the present invention.
  • the self-powered multi-chip COB LED package in accordance with the embodiment of the present invention may largely include an LED 20, an LED driving device 30, and a self-powered device 40, and further include a substrate 10.
  • one or more LEDs 20 are disposed on the substrate 10.
  • the LED driving device 30 is also disposed on the substrate 10 and functions to drive the LED 20 by including a LED driving circuit.
  • the self-powered device 40 is also disposed on the substrate 10, and functions to supply power to the LED driving device 30 by being self-powered by an external motion.
  • the LED 20 operates at a lower temperature since it does not use a filament causing burn-out unlike an incandescent bulb.
  • the LED 20 wastes much less energy since it does not generate heat so much unlike the incandescent bulb which wastes 90% of energy consumption because of heat.
  • the LED 20 is far beyond the incandescent bulb having about 24 lm/W, and has a luminous efficacy of more than 200 lm/W or more, the range of use is gradually widening.
  • a high luminance LED may be used, if necessary, or an LED module in which the LEDs 20 having various colors and sizes are connected in series or parallel may be used.
  • the LED driving device 30 for driving the LED 20 plays important roles, such as controlling of light emission of a column of LEDs and controlling switching operation of a power switch which controls power supplied to the column of LEDs.
  • the LED driving device 30 in accordance with the embodiment of the present invention may be used by being preferably and suitably selected from a variety of generally used LED driver ICs.
  • the self-powered device 40 configuring the present invention is a self-powered device using kinetic energy.
  • the self-powered device 40 fabricated using the principle in which when a magnet connected by a spring is disposed in the center of a coil wound several times, currents are generated as the magnet vibrates according to an external motion (kinetic energy), may be used.
  • any device self-powered by kinetic energy may be used without any particular limitation.
  • the LED driving device 30 in accordance with the embodiment of the inventive concept may preferably include a boosting circuit which boosts a voltage supplied from the self-powered device 40 and supplies the boosted voltage to the LED 20.
  • a threshold voltage (Vf) or more power needs to be supplied.
  • the threshold voltages are 1.8V in a red LED, 2.1V in a green LED, and 3.2V in a blue LED. Accordingly, since the voltage generated by the self-powered device 40 is not sufficient, the voltage needs to be boosted using a charge pumping method.
  • the charge pumping method is that a circuit is configured using a capacitor in order to generate power lower or higher than a voltage of a power supply, and can be fabricated in a small size since a capacitor is used for storing a voltage.
  • FIG. 3 is a schematic diagram showing a self-powered multi-chip COB LED package in accordance with a first embodiment of the present invention.
  • the first embodiment of the present invention may include, as described above, a substrate 10, and an LED 20, an LED driving device 30, and a self-powered device 40 which are disposed on the substrate 10, and may be formed, as shown in FIG. 3, in a single package by being molded using an epoxy resin 50. Therefore, the self-powered multi-chip COB LED package in accordance with the embodiment of the present invention can prevent deformation, such as disconnection or short between connection contacts of the devices, and thereby endurance can be improved.
  • an empty space 41 may be preferably formed around the self-powered device 40 as shown in FIG. 3.
  • the reason for forming the empty space 41 is, because vibrations may occur in the device during generating power using kinetic energy as described above, to absorb the generated vibrations easily and protect the device.
  • each of the LED 20, the LED driving device 30, and the self-powered device 40 may be connected by wire-bonding as shown in FIG. 3.
  • the wire-bonding is a method of placing a lead wire 70 (for example, a thin gold wire) on a pad 60 of a device, and momentarily heating and pressing the lead wire 70.
  • FIG. 4 is a schematic diagram showing a self-powered multi-chip COB LED package in accordance with a second embodiment of the present invention.
  • the second embodiment of the present invention may include a substrate 10, an LED 20, an LED driving device 30, and a self-powered device 40, the same as in the first embodiment, and may be formed in a single package by being molded using the epoxy resin 50.
  • an electrode pattern 80 for electrically connecting the LED 20, the LED driving device 30, and the self-powered device 40 on the substrate 10 is formed in the second embodiment, and the LED 20, the LED driving device 30, and the self-powered device 40 are connected to the substrate 10 using wire-bonding.
  • FIG. 5 A partially cross-sectional view of the self-powered multi-chip COB LED package in accordance with the second embodiment of the present invention is shown in FIG. 5.
  • the present invention may include a case in which the LED driving device 30 and the self-powered device 40 are not separated devices, but a single device.
  • an LED package in the related art has limited fields of application and does not ensure endurance since the LED 20, the LED driving device 30, and the power supply are separately configured.
  • the present invention having the above-described configuration is formed in an integrated package using a chip-on-board (COB) method in which the three devices are connected by wire-bonding, and then molded on the substrate 10. Accordingly, the self-powered multi-chip COB LED package in accordance with the present invention can be downsized and lightened, and can have improved reliability and enhanced endurance.
  • COB chip-on-board
  • the self-powered device 40 which is self-powered without being connected to an external power supply in order to drive an LED is used as a power supply, the LED emits light when the package in accordance with the embodiments of the present invention is attached to wherever a motion exists. Accordingly, the package in accordance with the embodiments of the present invention has wide field of application.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

Provided is a self-powered multi-chip chip-on-board (COB) light emitting diode (LED) package. More specifically, provided is a self-powered multi-chip COB LED package which is small-sized and has improved endurance because an LED, an LED driving device for driving the LED, a self-powered device which is self-powered by an external motion to supply power to the LED driving device are formed in a single package using COB technology.

Description

SELF-POWERED MULTI-CHIP COB LED PACKAGE
The present invention relates to a self-powered multi-chip chip-on-board (COB) light emitting diode (LED) package. More specifically, the present invention relates to a self-powered multi-chip COB LED package which is made small and has improved endurance by forming an LED, an LED driving device for driving the LED, and a self-powered device which is self-powered by an external motion to supply power to the LED driving device, in a single package using COB technology.
An LED, the abbreviation of “light emitting diode,” is a semiconductor device which converts electric energy to a light signal when a voltage is applied. LEDs are commonly used in our daily life, for example, an indicator lamp or a numeric display of a general electric apparatus. At first, there were low brightness and limitations of color, however, high brightness LED products which provide all colors comprising white light and visible light are now being manufactured due to new LED ingredients and advanced production technology.
A merit and feature of LEDs is that energy waste due to heat losses is low since LEDs generate less heat than existing light bulbs. In addition, since LEDs can be made smaller and lighter, and have excellent endurance and a semi-permanent life span, LEDs are expected to be used in a broader range of applications and replace existing light sources used in our daily life.
However, in order to drive an LED, it needs to connect the LED to a separate power supply or have an embedded battery. Accordingly, when an LED is connected to a separate power supply, the LED is inevitably used in a limited location, and when an LED has an embedded battery, it is much hassle to repeatedly replace or recharge the battery.
Korean Patent Publication No. 2003-0000393 (Jan. 6, 2003) titled "SELF GENERATING TYPE LIGHT EMITTING JUMP ROPE" discloses technology for solving the above-described problem. The document discloses a self-generating type light emitting jump rope including a self-generating system which supplies electricity to an LED embedded in a jump rope by generating electricity by rotation of a handle of the jump rope.
However, according to the document, the LED and the self-generating system have a limited range of applications because those are limited to a jump rope. In addition, since the LED and the self-generating system are separately configured, it is difficult to ensure endurance.
[Citation List]
[Non-Patent Literature]
1. Korean Patent Publication No. 2003-0000393 (Jan. 6, 2003) titled "SELF GENERATING TYPE LIGHT EMITTING JUMP ROPE"
The present invention is directed to provide a self-powered multi-chip COB LED package which can be made smaller and lighter, and have an improved application range because an LED, an LED driving device, a self-powered power supply which is self-powered by an external motion (a kinetic energy) are formed in a single package using COB technology.
In accordance with an aspect of the present invention, a self-powered multi-chip chip-on-board (COB) light emitting diode (LED) package includes a substrate 10, one or more light emitting diodes (LEDs) 20 disposed on the substrate 10, an LED driving device 30 disposed on the substrate 10 and including an LED driving circuit for driving the LEDs 20, and a self-powered device 40 disposed on the substrate 10 and configured to be self-powered by an external motion and supply power to the LED driving device 30.
In some embodiments, the LED driving device 30 may further include a boosting circuit configured to boost a voltage supplied from the self-powered device 40, and supply the boosted voltage to the LED 20.
In other embodiments, the self-powered multi-chip COB LED package may be molded by an epoxy resin 50 in a single package, and an empty space 41 may be formed around the self-powered device 40 during the epoxy molding process using.
In still other embodiments, the LED driving device 30 and the self-powered device 40 may be formed as a single device.
In yet other embodiments, each of the LED 20, the LED driving device 30, and the self-powered device 40 may be connected by wire-bonding. An electrode pattern 80 configured to electrically connect the LED 20, the LED driving device 30, and the self-powered device 40 may be formed on the substrate 10. The electrode pattern 80 may connect the LED 20, the LED driving device 30, and the self-powered device 40 to the substrate 10 by wire-bonding.
Since an LED, an LED driving device, and a power supply are separately configured in the related art, fields of application are limited and endurance is not ensured. According to embodiments of the present invention, an integrated package is formed using a chip-on-board (COB) method in which the three devices are connected on the substrate 10 by wire-bonding, and then molded. Accordingly, the package in accordance with the embodiments of the present invention can be downsized and lightened, and can have improved reliability. Further, the package in accordance with the embodiments of the present invention has enhanced endurance by preventing deformation, such as disconnection or short between connection contacts of the devices caused by an external impact.
In addition, since the package in accordance with the embodiments of the present invention uses a self-powered device as a power supply without being connected to an external power supply in order to drive an LED, the LED emits light when the package in accordance with the embodiments of the present invention is attached to wherever a motion exists. Accordingly, the package in accordance with the embodiments of the present invention has wide field of application.
FIG. 1 is a self-generating type light emitting jump rope in the related art.
FIG. 2 is a block diagram showing a self-powered multi-chip COB LED package in accordance with an embodiment of the present invention.
FIG. 3 is a schematic diagram showing a self-powered multi-chip COB LED package in accordance with a first embodiment of the present invention.
FIG. 4 is a schematic diagram showing a self-powered multi-chip COB LED package in accordance with a second embodiment of the present invention.
FIG. 5 is a partially cross-sectional view of a self-powered multi-chip COB LED package in accordance with the second embodiment of the present invention.
Hereinafter, embodiments of the present invention will be fully described with reference to the accompanying drawings.
The accompanying drawings are, however, just examples illustrated for purposes of describing embodiments of the present invention more specifically, and the present invention should not be construed as limited to shapes shown in the accompanying drawings.
FIG. 2 is a block diagram showing a self-powered multi-chip COB LED package in accordance with an embodiment of the present invention. As shown in FIG. 2, the self-powered multi-chip COB LED package in accordance with the embodiment of the present invention may largely include an LED 20, an LED driving device 30, and a self-powered device 40, and further include a substrate 10.
More specifically, one or more LEDs 20 are disposed on the substrate 10. The LED driving device 30 is also disposed on the substrate 10 and functions to drive the LED 20 by including a LED driving circuit. The self-powered device 40 is also disposed on the substrate 10, and functions to supply power to the LED driving device 30 by being self-powered by an external motion.
As described above, the LED 20 operates at a lower temperature since it does not use a filament causing burn-out unlike an incandescent bulb. In addition, the LED 20 wastes much less energy since it does not generate heat so much unlike the incandescent bulb which wastes 90% of energy consumption because of heat. Further, in terms of luminous efficacy, since the LED 20 is far beyond the incandescent bulb having about 24 lm/W, and has a luminous efficacy of more than 200 lm/W or more, the range of use is gradually widening.
According to embodiments of the present convention, a high luminance LED may be used, if necessary, or an LED module in which the LEDs 20 having various colors and sizes are connected in series or parallel may be used. In addition, the LED driving device 30 for driving the LED 20 plays important roles, such as controlling of light emission of a column of LEDs and controlling switching operation of a power switch which controls power supplied to the column of LEDs. The LED driving device 30 in accordance with the embodiment of the present invention may be used by being preferably and suitably selected from a variety of generally used LED driver ICs.
In addition, the self-powered device 40 configuring the present invention is a self-powered device using kinetic energy. As an example of methods of generating power using kinetic energy, the self-powered device 40 fabricated using the principle in which when a magnet connected by a spring is disposed in the center of a coil wound several times, currents are generated as the magnet vibrates according to an external motion (kinetic energy), may be used. In addition, any device self-powered by kinetic energy may be used without any particular limitation.
In addition, the LED driving device 30 in accordance with the embodiment of the inventive concept may preferably include a boosting circuit which boosts a voltage supplied from the self-powered device 40 and supplies the boosted voltage to the LED 20. In order to drive the LED 20, a threshold voltage (Vf) or more power needs to be supplied. For example, the threshold voltages are 1.8V in a red LED, 2.1V in a green LED, and 3.2V in a blue LED. Accordingly, since the voltage generated by the self-powered device 40 is not sufficient, the voltage needs to be boosted using a charge pumping method.
The charge pumping method is that a circuit is configured using a capacitor in order to generate power lower or higher than a voltage of a power supply, and can be fabricated in a small size since a capacitor is used for storing a voltage.
FIG. 3 is a schematic diagram showing a self-powered multi-chip COB LED package in accordance with a first embodiment of the present invention. The first embodiment of the present invention may include, as described above, a substrate 10, and an LED 20, an LED driving device 30, and a self-powered device 40 which are disposed on the substrate 10, and may be formed, as shown in FIG. 3, in a single package by being molded using an epoxy resin 50. Therefore, the self-powered multi-chip COB LED package in accordance with the embodiment of the present invention can prevent deformation, such as disconnection or short between connection contacts of the devices, and thereby endurance can be improved.
In addition, when the epoxy resin 50 is formed, an empty space 41 may be preferably formed around the self-powered device 40 as shown in FIG. 3. The reason for forming the empty space 41 is, because vibrations may occur in the device during generating power using kinetic energy as described above, to absorb the generated vibrations easily and protect the device.
According to the first embodiment of the present invention, each of the LED 20, the LED driving device 30, and the self-powered device 40 may be connected by wire-bonding as shown in FIG. 3. The wire-bonding is a method of placing a lead wire 70 (for example, a thin gold wire) on a pad 60 of a device, and momentarily heating and pressing the lead wire 70.
FIG. 4 is a schematic diagram showing a self-powered multi-chip COB LED package in accordance with a second embodiment of the present invention. As shown in FIG. 4, the second embodiment of the present invention may include a substrate 10, an LED 20, an LED driving device 30, and a self-powered device 40, the same as in the first embodiment, and may be formed in a single package by being molded using the epoxy resin 50. However, an electrode pattern 80 for electrically connecting the LED 20, the LED driving device 30, and the self-powered device 40 on the substrate 10 is formed in the second embodiment, and the LED 20, the LED driving device 30, and the self-powered device 40 are connected to the substrate 10 using wire-bonding. A partially cross-sectional view of the self-powered multi-chip COB LED package in accordance with the second embodiment of the present invention is shown in FIG. 5.
In addition, although not shown in the drawings, the present invention may include a case in which the LED driving device 30 and the self-powered device 40 are not separated devices, but a single device.
An LED package in the related art has limited fields of application and does not ensure endurance since the LED 20, the LED driving device 30, and the power supply are separately configured. On the contrary, the present invention having the above-described configuration is formed in an integrated package using a chip-on-board (COB) method in which the three devices are connected by wire-bonding, and then molded on the substrate 10. Accordingly, the self-powered multi-chip COB LED package in accordance with the present invention can be downsized and lightened, and can have improved reliability and enhanced endurance.
In addition, since the self-powered device 40 which is self-powered without being connected to an external power supply in order to drive an LED is used as a power supply, the LED emits light when the package in accordance with the embodiments of the present invention is attached to wherever a motion exists. Accordingly, the package in accordance with the embodiments of the present invention has wide field of application.
Although a few embodiments of the present invention have been shown and described, it would be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the claims and their equivalents.

Claims (7)

  1. A self-powered multi-chip chip-on-board (COB) light emitting diode (LED) package, comprising:
    a substrate (10);
    one or more light emitting diodes (LEDs) (20) disposed on the substrate (10);
    an LED driving device (30) disposed on the substrate (10) and including an LED driving circuit for driving the LEDs (20); and
    a self-powered device (40) disposed on the substrate (10) and configured to be self-powered by an external motion and supply power to the LED driving device (30).
  2. The self-powered multi-chip COB LED package of claim 1, wherein the LED driving device (30) further comprises a boosting circuit configured to boost a voltage supplied from the self-powered device (40), and supply the boosted voltage to the LEDs (20).
  3. The self-powered multi-chip COB LED package of claim 1, which is molded by an epoxy resin (50) in a single package.
  4. The self-powered multi-chip COB LED package of claim 3, wherein an empty space (41) is formed around the self-powered device (40) during an epoxy-molding process.
  5. The self-powered multi-chip COB LED package of claim 1, wherein the LED driving device (30) and the self-powered device (40) are formed as a single device.
  6. The self-powered multi-chip COB LED package of claim 1, wherein each of the LEDs (20), the LED driving device (30), and the self-powered device (40) is connected by wire-bonding.
  7. The self-powered multi-chip COB LED package of claim 1, wherein an electrode pattern (80) is formed to electrically connect the LEDs (20), the LED driving device (30), and the self-powered device (40) on the substrate (10),
    wherein the LEDs (20), the LED driving device (30), and the self-powered device (40) are connected to the substrate (10) by wire-bonding.
PCT/KR2014/001468 2013-12-27 2014-02-24 Self-powered multi-chip cob led package WO2015099240A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2013-0165220 2013-12-27
KR1020130165220A KR20150076702A (en) 2013-12-27 2013-12-27 Self-powered Multi-chip COB LED Package

Publications (1)

Publication Number Publication Date
WO2015099240A1 true WO2015099240A1 (en) 2015-07-02

Family

ID=53479070

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2014/001468 WO2015099240A1 (en) 2013-12-27 2014-02-24 Self-powered multi-chip cob led package

Country Status (2)

Country Link
KR (1) KR20150076702A (en)
WO (1) WO2015099240A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105072776A (en) * 2015-09-06 2015-11-18 深圳市源磊科技有限公司 Integrated COB light source with power drive
CN106851148A (en) * 2016-12-25 2017-06-13 惠州三华工业有限公司 A kind of great power LED intelligent television power supply driver

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200411675Y1 (en) * 2006-01-04 2006-03-16 하늘다람쥐 주식회사 Ropeskipping comprising emitting light apparatus
US7361074B1 (en) * 2005-02-18 2008-04-22 Rapid Pro Manufacturing, Martin And Periman Partnership Rotating light toy
KR100934202B1 (en) * 2009-05-26 2009-12-29 김동영 LED level meter by self-power generation and its measuring method
US20100012165A1 (en) * 2008-07-15 2010-01-21 Mark Bedard Self-Powered Electrical System
KR20120067564A (en) * 2010-12-16 2012-06-26 한국전자통신연구원 Power supplier using a flexible pcb based self-powering and sensor node using the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7361074B1 (en) * 2005-02-18 2008-04-22 Rapid Pro Manufacturing, Martin And Periman Partnership Rotating light toy
KR200411675Y1 (en) * 2006-01-04 2006-03-16 하늘다람쥐 주식회사 Ropeskipping comprising emitting light apparatus
US20100012165A1 (en) * 2008-07-15 2010-01-21 Mark Bedard Self-Powered Electrical System
KR100934202B1 (en) * 2009-05-26 2009-12-29 김동영 LED level meter by self-power generation and its measuring method
KR20120067564A (en) * 2010-12-16 2012-06-26 한국전자통신연구원 Power supplier using a flexible pcb based self-powering and sensor node using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105072776A (en) * 2015-09-06 2015-11-18 深圳市源磊科技有限公司 Integrated COB light source with power drive
CN105072776B (en) * 2015-09-06 2016-06-29 深圳市源磊科技有限公司 Integrated COB light source containing power drives
CN106851148A (en) * 2016-12-25 2017-06-13 惠州三华工业有限公司 A kind of great power LED intelligent television power supply driver

Also Published As

Publication number Publication date
KR20150076702A (en) 2015-07-07

Similar Documents

Publication Publication Date Title
CN103311415B (en) Luminescent device and use its lighting device and system
KR100828891B1 (en) LED Package
EP2760047B1 (en) Light emitting module, lighting apparatus, and lighting fixture
US9851057B2 (en) Lighting device
EP2699055A2 (en) Light-emitting module and luminaire
US9874318B2 (en) LED assembly and LED bulb using the same
JP2010212679A (en) Light-emitting diode package
US20090050912A1 (en) Light emitting diode and outdoor illumination device having the same
EP2679895A1 (en) Light-emitting module and luminaire
TW201339494A (en) Light emitting module and illuminating apparatus
US8507932B2 (en) LED unit
CN102163602B (en) Light-emitting device and lighting apparatus provided with the same
US8536593B2 (en) LED device having two LED dies separated by a dam
WO2015099240A1 (en) Self-powered multi-chip cob led package
CN103247727A (en) Wireless solid-state light-emitting device
WO2016202213A1 (en) Led fluorescent tube
CN104896324B (en) Illumination light source and lighting device
JP2010182803A (en) Light-emitting apparatus
CN204300727U (en) lamp and lighting device
CN106206559A (en) Modularized light emitting device
US20140055049A1 (en) Illuminating device
JP2015050207A (en) Light emitting module and lighting system
CN101403485B (en) LED luminous element for integrated control device
CN106499960A (en) Light-emitting diode lighting module and the lamp with the light-emitting diode lighting module
US20130175916A1 (en) Multichip package structure and light bulb of using the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14875366

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14875366

Country of ref document: EP

Kind code of ref document: A1