CN2736939Y - 发光二极管 - Google Patents

发光二极管 Download PDF

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Publication number
CN2736939Y
CN2736939Y CNU2004200929293U CN200420092929U CN2736939Y CN 2736939 Y CN2736939 Y CN 2736939Y CN U2004200929293 U CNU2004200929293 U CN U2004200929293U CN 200420092929 U CN200420092929 U CN 200420092929U CN 2736939 Y CN2736939 Y CN 2736939Y
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light
support
emitting diode
bending segment
order
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Expired - Lifetime
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CNU2004200929293U
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Inventor
秦元正
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Unity Opto Technology Co Ltd
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Unity Opto Technology Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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Abstract

一种发光二极管。为提供一种组装快速、增强实用性、提高便利性的发光元件,提出本实用新型,它包含可透光胶体、上端设有凹陷槽的第一支架、与第一支架一起封装于透光胶体内的第二支架、设置于第一支架凹陷槽内的芯片及连接芯片与第二支架的导线;第一、二支架的下端分别形成弯折段,且各弯折段底部设有以借快速稳固地组装及提升散热效果的开槽。

Description

发光二极管
技术领域
本实用新型属于发光元件,特别是一种发光二极管。
背景技术
如图1所示,已有的发光二极管为由两个封装于可透光胶体7内的两个支架71、72构成,并于一个支架71的一端设有凹陷槽711,于凹陷槽711内设有芯片73,芯片73以金属线74与另一支架72连接。如此,构成发光二极管,进而发出光源。
虽然,已有的发光二极管可达到发出光源的功效,但发光二极管的支架71、72与电路板结合时,需以焊接方式结合固定,组装上相当不便,故于实际使用上仍不符合使用者的需求。
发明内容
本实用新型的目的是提供一种组装快速、增强实用性、提高便利性的发光二极管。
本实用新型包含可透光胶体、上端设有凹陷槽的第一支架、与第一支架一起封装于透光胶体内的第二支架、设置于第一支架凹陷槽内的芯片及连接芯片与第二支架的导线;第一、二支架的下端分别形成弯折段,且各弯折段底部设有以借快速稳固地组装及提升散热效果的开槽。
其中:
弯折部底部的开槽呈斜向渐缩状俾利结合连接导线。
呈斜向渐缩状的开放端形成开口较大俾利结构连接导线的阶级面。
弯折段侧面设有俾利于稳固结合定位的至少一钩部。
弯折段呈俾利于稳固结合定位的ㄩ字形。
由于本实用新型包含可透光胶体、上端设有凹陷槽的第一支架、与第一支架一起封装于透光胶体内的第二支架、设置于第一支架凹陷槽内的芯片及连接芯片与第二支架的导线;第一、二支架的下端分别形成弯折段,且各弯折段底部设有以借快速稳固地组装及提升散热效果的开槽。组装时,借由封装于可透光胶体内的第一、二支架的下端分别形成具开槽的弯折段的设计,可快速稳固地组装,并使第一、二支架外露的面积加大,进而相对提升整体散热效果,使得本实用新型具有快速、稳固组装及提升散热效果,增加实用性。不仅组装快速,而且增强实用性、提高便利性,从而达到本实用新型的目的。
附图说明
图1、为已有的发光二极管结构示意剖视图。
图2、为本实用新型结构示意立体图。
图3、为本实用新型结构示意侧视图一。
图4、为本实用新型结构示意侧视图二。
图5、为本实用新型使用状态示意图。
具体实施方式
如图2、图3所示,本实用新型包含可透光胶体10、第一支架11、第二支架12、芯片13及导线14。
第一支架11的上端设有供芯片13设置的凹陷槽111。
第一、二支架11、12的下端分别形成弯折段112、122,且各弯折段112、122底部设有呈斜向渐缩状的开槽113、123,且开槽113、123的开放端形成开口较大俾利结合导线14的阶级面115、125。弯折段112、122侧面设有俾利于稳固结合定位的至少一钩部114、124;弯折段112、122呈俾利于稳固结合定位的ㄩ字形。
芯片13以导线14与第二支架12连接。
如图2、图3、图4、图5所示,本实用新型的特点在于:
可借由封装于可透光胶体10内的第一、二支架11、12的下端分别形成具开槽113、123的弯折段112、122的设计,并可借由呈斜向渐缩状的开槽113、123及于呈斜向渐缩状的开放端所形成开口较大的阶级面115、125,俾利于将连接导线20置入开槽113、123内,并形成稳固结合。
借由呈ㄩ字形的弯折段112、122的设计,则可便于将本实用新型快速插置结合于插槽板30上对应的插孔31内,进而增加整体配设的便利性及结合的稳定性。
借由设置于弯折段112、122侧面的至少一钩部114、124,俾使第一、二支架11、12的弯折段112、122于插入插槽板30的插孔31后,借由本身的弹性恢复力而与插槽板30上对应插孔31形成稳固结合定位。
借由第一、二支架11、12的弯折段112、122的设计,从而使第一、二支架11、12外露的面积加大,进而相对提升整体散热效果。
如上所述,使得本实用新型具有快速、稳固组装及提升散热效果,增加实用性。

Claims (5)

1、一种发光二极管,它包含可透光胶体、上端设有凹陷槽的第一支架、与第一支架一起封装于透光胶体内的第二支架、设置于第一支架凹陷槽内的芯片及连接芯片与第二支架的导线;其特征在于所述的第一、二支架的下端分别形成弯折段,且各弯折段底部设有以借快速稳固地组装及提升散热效果的开槽。
2、根据权利要求1所述的发光二极管,其特征在于所述的弯折部底部的开槽呈斜向渐缩状俾利结合连接导线。
3、根据权利要求2所述的发光二极管,其特征在于所述的呈斜向渐缩状的开放端形成开口较大俾利结构连接导线的阶级面。
4、根据权利要求1所述的发光二极管,其特征在于所述的弯折段侧面设有俾利于稳固结合定位的至少一钩部。
5、根据权利要求1所述的发光二极管,其特征在于所述的弯折段呈俾利于稳固结合定位的ㄩ字形。
CNU2004200929293U 2004-09-21 2004-09-21 发光二极管 Expired - Lifetime CN2736939Y (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101459212B (zh) * 2007-12-11 2011-06-22 富士迈半导体精密工业(上海)有限公司 固态发光器件
CN103915541B (zh) * 2012-12-30 2017-08-22 比亚迪股份有限公司 Led支架和具有该led支架的led组件

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101459212B (zh) * 2007-12-11 2011-06-22 富士迈半导体精密工业(上海)有限公司 固态发光器件
CN103915541B (zh) * 2012-12-30 2017-08-22 比亚迪股份有限公司 Led支架和具有该led支架的led组件

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Expiration termination date: 20140921

Granted publication date: 20051026