CN201285000Y - Led三维发光板 - Google Patents
Led三维发光板 Download PDFInfo
- Publication number
- CN201285000Y CN201285000Y CNU2008201676736U CN200820167673U CN201285000Y CN 201285000 Y CN201285000 Y CN 201285000Y CN U2008201676736 U CNU2008201676736 U CN U2008201676736U CN 200820167673 U CN200820167673 U CN 200820167673U CN 201285000 Y CN201285000 Y CN 201285000Y
- Authority
- CN
- China
- Prior art keywords
- led
- led chip
- luminous
- aluminium base
- dimensional luminous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Abstract
Description
Claims (8)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008201676736U CN201285000Y (zh) | 2008-11-20 | 2008-11-20 | Led三维发光板 |
EP09174047A EP2189706A1 (en) | 2008-11-20 | 2009-10-26 | Three-dimensional LED light-emitting plate |
US12/615,081 US8039851B2 (en) | 2008-11-20 | 2009-11-09 | Three-dimensional LED light-emitting plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008201676736U CN201285000Y (zh) | 2008-11-20 | 2008-11-20 | Led三维发光板 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201285000Y true CN201285000Y (zh) | 2009-08-05 |
Family
ID=40949986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2008201676736U Expired - Fee Related CN201285000Y (zh) | 2008-11-20 | 2008-11-20 | Led三维发光板 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8039851B2 (zh) |
EP (1) | EP2189706A1 (zh) |
CN (1) | CN201285000Y (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013177735A1 (zh) * | 2012-05-28 | 2013-12-05 | 深圳市众明半导体照明有限公司 | 一种led光源及其照明装置 |
CN103715341A (zh) * | 2013-12-26 | 2014-04-09 | 深圳市光之谷新材料科技有限公司 | 一种发光二极管灯条 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202012102963U1 (de) | 2012-08-07 | 2013-11-13 | Rp-Technik E.K. | Leuchtstofflampenartiges LED-Leuchtmittel |
CN108613029A (zh) | 2014-03-13 | 2018-10-02 | 飞利浦照明控股有限公司 | 用于照明装置的灯丝 |
EP3310933B1 (en) | 2015-06-17 | 2020-11-18 | The Translational Genomics Research Institute | Methods for obtaining biological molecules from a sample |
DE102018100766A1 (de) * | 2018-01-15 | 2019-07-18 | Osram Opto Semiconductors Gmbh | Leuchtmodul, Leuchtmittel und Verfahren zur Herstellung eines Leuchtmoduls |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1023039A (en) * | 1975-02-28 | 1977-12-20 | Bowmar Canada Limited | Light emitting diode display |
US7102172B2 (en) * | 2003-10-09 | 2006-09-05 | Permlight Products, Inc. | LED luminaire |
WO2006075290A1 (en) * | 2005-01-14 | 2006-07-20 | Koninklijke Philips Electronics N.V. | Lighting arrangement |
US7396142B2 (en) * | 2005-03-25 | 2008-07-08 | Five Star Import Group, L.L.C. | LED light bulb |
US7977696B2 (en) * | 2006-05-31 | 2011-07-12 | Fujikura Ltd. | Light-emitting element mounting substrate, light-emitting element package, display device, and illumination device |
-
2008
- 2008-11-20 CN CNU2008201676736U patent/CN201285000Y/zh not_active Expired - Fee Related
-
2009
- 2009-10-26 EP EP09174047A patent/EP2189706A1/en not_active Withdrawn
- 2009-11-09 US US12/615,081 patent/US8039851B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013177735A1 (zh) * | 2012-05-28 | 2013-12-05 | 深圳市众明半导体照明有限公司 | 一种led光源及其照明装置 |
CN103715341A (zh) * | 2013-12-26 | 2014-04-09 | 深圳市光之谷新材料科技有限公司 | 一种发光二极管灯条 |
CN103715341B (zh) * | 2013-12-26 | 2017-01-18 | 深圳市光之谷新材料科技有限公司 | 一种发光二极管灯条 |
Also Published As
Publication number | Publication date |
---|---|
US20100123143A1 (en) | 2010-05-20 |
US8039851B2 (en) | 2011-10-18 |
EP2189706A1 (en) | 2010-05-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN201285000Y (zh) | Led三维发光板 | |
CN201363590Y (zh) | 光型饱满柔和的大功率led光源及使用该光源的大功率led照明灯 | |
CN202008025U (zh) | 具有截锥台导热安装体的大光度角球泡 | |
CN201075132Y (zh) | 一种具有大功率led光源模块的集合透镜 | |
CN102222665B (zh) | 带薄型复眼透镜的集成led模块 | |
CN100516631C (zh) | Led灯 | |
CN101235959B (zh) | 一种led光源 | |
CN103557453A (zh) | 一种远程荧光led装置 | |
CN202493960U (zh) | 大角度光输出led灯 | |
CN202521271U (zh) | 一种具有分区发光结构内部镂空散热的led灯 | |
CN201428943Y (zh) | Led灯 | |
CN103672507B (zh) | Led cob石英灯 | |
CN202074353U (zh) | 一种led户外照明灯具 | |
CN203641916U (zh) | 一种荧光led装置 | |
CN202647270U (zh) | 一种全配光型自镇流led灯 | |
CN201434235Y (zh) | 一种由发光二级管构成的光源模块 | |
CN201599582U (zh) | Led节能灯 | |
CN108036243B (zh) | Led地面灯 | |
CN203533298U (zh) | Led cob石英灯 | |
CN201681925U (zh) | 一种高效率阵列式led封装结构 | |
CN203453839U (zh) | 一种led模组 | |
CN203743952U (zh) | 采用弯曲铝基板的大角度发光led灯泡 | |
CN212986882U (zh) | 一种多功能投光灯 | |
CN201081149Y (zh) | Led聚光路灯灯头 | |
CN102022691B (zh) | 一种非对称光场的led配光装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: TIANJIN JINMA OPTOELECTRONIC CO., LTD. Free format text: FORMER OWNER: ZHANG RONGMIN Effective date: 20130806 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 311100 HANGZHOU, ZHEJIANG PROVINCE TO: 300308 BINHAI NEW ZONE, TIANJIN CITY |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130806 Address after: 300308 A, block 9, eight West 518, Tianjin Airport Economic Zone Patentee after: Tianjin Jinma Photoelectric Co., Ltd. Address before: 311100, Donggang Road, Hangzhou Road, Yuhang District, Zhejiang, 28 Patentee before: Zhang Rongmin |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090805 Termination date: 20161120 |
|
CF01 | Termination of patent right due to non-payment of annual fee |