JP2006086408A - Ｌｅｄ装置 - Google Patents

Ｌｅｄ装置 Download PDF

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Publication number
JP2006086408A
JP2006086408A JP2004271133A JP2004271133A JP2006086408A JP 2006086408 A JP2006086408 A JP 2006086408A JP 2004271133 A JP2004271133 A JP 2004271133A JP 2004271133 A JP2004271133 A JP 2004271133A JP 2006086408 A JP2006086408 A JP 2006086408A
Authority
JP
Japan
Prior art keywords
cavity
led
led device
led chip
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004271133A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006086408A5 (enExample
Inventor
Akihiko Hanya
明彦 半谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP2004271133A priority Critical patent/JP2006086408A/ja
Publication of JP2006086408A publication Critical patent/JP2006086408A/ja
Publication of JP2006086408A5 publication Critical patent/JP2006086408A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Led Device Packages (AREA)
JP2004271133A 2004-09-17 2004-09-17 Ｌｅｄ装置 Pending JP2006086408A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004271133A JP2006086408A (ja) 2004-09-17 2004-09-17 Ｌｅｄ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004271133A JP2006086408A (ja) 2004-09-17 2004-09-17 Ｌｅｄ装置

Publications (2)

Publication Number Publication Date
JP2006086408A true JP2006086408A (ja) 2006-03-30
JP2006086408A5 JP2006086408A5 (enExample) 2007-10-25

Family

ID=36164646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004271133A Pending JP2006086408A (ja) 2004-09-17 2004-09-17 Ｌｅｄ装置

Country Status (1)

Country Link
JP (1) JP2006086408A (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100875701B1 (ko) 2008-06-12 2008-12-23 알티전자 주식회사 발광 다이오드 패키지
WO2009011302A1 (ja) * 2007-07-13 2009-01-22 Rohm Co., Ltd. Ｌｅｄモジュールおよびｌｅｄドットマトリクス表示装置
JP2010524260A (ja) * 2007-04-13 2010-07-15 フェアチャイルド セミコンダクター コーポレイション 光カプラ・パッケージ
KR100995688B1 (ko) 2008-04-28 2010-11-19 주식회사 센플러스 발광 다이오드 패키지
JP2011139078A (ja) * 2005-12-21 2011-07-14 Samsung Led Co Ltd Ｌｅｄパッケージ及びこれを用いたバックライトユニット
JP2012114430A (ja) * 2010-11-22 2012-06-14 Samsung Led Co Ltd 発光素子パッケージの樹脂塗布装置、及びこれを用いる発光素子パッケージの製造方法
KR20120070213A (ko) * 2010-12-21 2012-06-29 삼성엘이디 주식회사 발광소자 패키지 및 그 제조방법
EP2485286A2 (en) 2011-02-02 2012-08-08 Nichia Corporation Light emitting device
JP2012178567A (ja) * 2006-04-06 2012-09-13 Hitachi Chem Co Ltd 光反射用熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板とその製造方法および光半導体装置
JP2013125776A (ja) * 2011-12-13 2013-06-24 Dainippon Printing Co Ltd リードフレーム、樹脂付リードフレームおよびその製造方法、ならびに半導体装置の製造方法
JP2017076809A (ja) * 2016-12-05 2017-04-20 大日本印刷株式会社 樹脂付リードフレーム、半導体装置、照明装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0738154A (ja) * 1993-07-16 1995-02-07 Sharp Corp Ｍｉｄチップ型発光素子
JPH10107325A (ja) * 1996-09-30 1998-04-24 Nichia Chem Ind Ltd 発光装置及びそれを用いた表示装置
JP2001185763A (ja) * 1999-12-27 2001-07-06 Toshiba Electronic Engineering Corp 光半導体パッケージ
JP2003152225A (ja) * 2001-08-28 2003-05-23 Matsushita Electric Works Ltd 発光装置
JP2004111906A (ja) * 2002-07-25 2004-04-08 Matsushita Electric Works Ltd 光電素子部品

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0738154A (ja) * 1993-07-16 1995-02-07 Sharp Corp Ｍｉｄチップ型発光素子
JPH10107325A (ja) * 1996-09-30 1998-04-24 Nichia Chem Ind Ltd 発光装置及びそれを用いた表示装置
JP2001185763A (ja) * 1999-12-27 2001-07-06 Toshiba Electronic Engineering Corp 光半導体パッケージ
JP2003152225A (ja) * 2001-08-28 2003-05-23 Matsushita Electric Works Ltd 発光装置
JP2004111906A (ja) * 2002-07-25 2004-04-08 Matsushita Electric Works Ltd 光電素子部品

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011139078A (ja) * 2005-12-21 2011-07-14 Samsung Led Co Ltd Ｌｅｄパッケージ及びこれを用いたバックライトユニット
JP2012178567A (ja) * 2006-04-06 2012-09-13 Hitachi Chem Co Ltd 光反射用熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板とその製造方法および光半導体装置
JP2010524260A (ja) * 2007-04-13 2010-07-15 フェアチャイルド セミコンダクター コーポレイション 光カプラ・パッケージ
WO2009011302A1 (ja) * 2007-07-13 2009-01-22 Rohm Co., Ltd. Ｌｅｄモジュールおよびｌｅｄドットマトリクス表示装置
US8835946B2 (en) 2007-07-13 2014-09-16 Rohm Co., Ltd. LED module and LED dot matrix display
JP5368987B2 (ja) * 2007-07-13 2013-12-18 ローム株式会社 Ｌｅｄモジュールおよびｌｅｄドットマトリクス表示装置
US8421093B2 (en) 2007-07-13 2013-04-16 Rohm Co., Ltd. LED module and LED dot matrix display
US10147759B2 (en) 2007-07-13 2018-12-04 Rohm Co., Ltd. LED module and LED dot matrix display
KR100995688B1 (ko) 2008-04-28 2010-11-19 주식회사 센플러스 발광 다이오드 패키지
KR100875701B1 (ko) 2008-06-12 2008-12-23 알티전자 주식회사 발광 다이오드 패키지
KR101743918B1 (ko) * 2010-11-22 2017-06-07 삼성전자주식회사 발광소자 패키지의 수지 도포 장치 및 이를 이용한 발광소자 패키지 제조방법
JP2012114430A (ja) * 2010-11-22 2012-06-14 Samsung Led Co Ltd 発光素子パッケージの樹脂塗布装置、及びこれを用いる発光素子パッケージの製造方法
KR20120070213A (ko) * 2010-12-21 2012-06-29 삼성엘이디 주식회사 발광소자 패키지 및 그 제조방법
KR101693642B1 (ko) * 2010-12-21 2017-01-17 삼성전자 주식회사 발광소자 패키지 제조방법
US8455915B2 (en) 2011-02-02 2013-06-04 Nichia Corporation Light emitting device
US9091419B2 (en) * 2011-02-02 2015-07-28 Nichia Corporation Light emitting device
US20130235599A1 (en) * 2011-02-02 2013-09-12 Nichia Corporation Light emitting device
EP2485286A2 (en) 2011-02-02 2012-08-08 Nichia Corporation Light emitting device
JP2013125776A (ja) * 2011-12-13 2013-06-24 Dainippon Printing Co Ltd リードフレーム、樹脂付リードフレームおよびその製造方法、ならびに半導体装置の製造方法
JP2017076809A (ja) * 2016-12-05 2017-04-20 大日本印刷株式会社 樹脂付リードフレーム、半導体装置、照明装置

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